A portable test device with automatic robotic arm is provided to use a micro step motor as the power source for the reciprocating movement of the robotic arm. The dual adjustment slots design of the intermediate plate enables quick adjustment of the angle and height of the robotic arm. The intermediate plate is further mounted to a precision guide for precise operation of the robotic arm.

An image test system includes a test assembly and an image capture card. The test assembly is provided for capturing test signals from test objects, and incudes a first transmission interface, a second transmission interface, and an interface conversion circuit. The interface conversion circuit is connected with the first transmission interface, and converts signal transmission forms of the test signals. The second transmission interface is connected with the interface conversion circuit. Besides, the image capture card is provided for connecting with the second transmission interface, and captures image data from the test signals.

A modular power supply including a voltage regulator configured to output a voltage, a first output configured to connect to a device under test and output the voltage from the regulator, a microcontroller connected to the voltage regulator, and an interface configured to connect to a test and measurement instrument. The interface includes an input configured to receive power from the test and measurement instrument and a second output configured to output a signal characteristic of the first output.

A portable test device with automatic robotic arm is provided to use a micro step motor as the power source for the reciprocating movement of the robotic arm. The dual adjustment slots design of the intermediate plate enables quick adjustment of the angle and height of the robotic arm. The intermediate plate is further mounted to a precision guide for precise operation of the robotic arm.

A carrier includes a base on which a circuit board is mounted, a loading device mounted on the base, a first pressing device mounted on the base, and a second pressing device mounted on the base. The loading device is configured to load an electronic device on the base. The first pressing device is configured to press a first lead end protruding from the electronic device on the circuit board to electrically contact the circuit board. The second pressing device is configured to press a second lead end of the electronic device on the base.

A chip testing device for being transferred among a plurality of working stations includes a circuit board, a control set, and a plurality of connection terminals. The circuit board is provided with a plurality of electrical connection sockets disposed thereon each for carrying a chip. The control set includes a plurality of testing modules disposed on the circuit board. The connection terminals are disposed on the circuit board. When the connection terminals are connected to an external power supply device, the testing modules are connected to the electrical connection sockets, and each of the testing modules is able to test the chip on the electrical connection socket connected thereto.

A chip testing method for being implemented by a chip testing system includes: a chip mounting step implemented by using a chip mounting apparatus to respectively dispose a plurality of chips onto electrical connection sockets of a chip testing device; a moving-in step implemented by transferring the chip testing device carrying the chips into one of accommodating chambers of an environment control apparatus; a temperature adjusting step implemented by controlling a temperature adjusting device of the one of the accommodating chambers so that the chips are in an environment having a predetermined temperature; and a testing step implemented by providing electricity to the chip testing device, so that each testing module of the chip testing device performs a predetermined testing process on the chips on the corresponding electrical connection sockets connected thereto.

Example automatic test equipment (ATE) includes a first test instrument to receive a waveform from a device under test, where the waveform is based on test signals sent from the ATE to the DUT; circuitry to generate digital pulses based on the waveform; and a second test instrument to receive the digital pulses over at least two digital pins and to process the digital pulses to test the DUT.

A test and measurement instrument switch matrix including a first cable including a center conductor and a guard connected to a first output of the test and measurement instrument; a second cable including a center conductor and a guard connected to a second output of the test and measurement instrument; a third cable including a center conductor and a guard connected to the device under test; and a fourth cable including a center conductor connected to the device under test and a guard connected to the device under test.

An integrated interface for an electronic device without a USB port includes at least one SIM card interface drive chip, a USB interface control chip, at least one SIM card interface control chip electronically connected to the at least one SIM card interface drive chip and the USB interface control chip, and a USB interface drive chip electronically connected to the USB interface control chip. A detection signal pin is defined on the USB interface control chip. When the detection signal pin is triggered, the USB interface control chip is turned on and the SIM card interface drive chip is turned off. When triggered, the USB interface drive chip drives the USB interface control chip to work, allowing access by an external whole-machine probe or test device.