A test board is provided including a first branch line including a first portion which receives an input signal and a second portion opposite to the first portion. A plurality of second branch lines branch from the first branch line. Each of the second branch lines include a third portion connected to the second portion of the first branch line and a fourth portion connected to the third portion. A first characteristic impedance of the first portion of the first branch line is different from a second characteristic impedance of the second portion of the first branch line. A third characteristic impedance of the third portions of each of the second branch lines is different from a fourth characteristic impedance of the fourth portions of each of the second branch lines. The second characteristic impedance is equal to a combined characteristic impedance of the third portions of each of the second branch lines.

A burn-in board capable of realizing a uniform temperature distribution inside a burn-in board is provided. A burn-in board includes: a plurality of sockets; a burn-in board body including an upper surface for mounting the sockets thereon and a lower surface on the side opposite to the upper surface; a reinforcement frame contacting the lower surface; a bottom cover contacting the reinforcement frame; a heat conduction plate interposed between the burn-in board body and the bottom cover; and a heat conduction sheet thermally connecting the burn-in board body to the heat conduction plate, in which the reinforcement frame presses the heat conduction plate toward the heat conduction sheet.

A reverse bias voltage adjuster is provided. The reverse bias voltage adjuster includes an operating voltage generating circuit and a voltage adjusting circuit. The operating voltage generating circuit generates an operating voltage according to a burnin-test signal, a power start signal, and a reverse bias enable signal. In a normal operation mode, the operating voltage is a first voltage value, and in a burnin-test mode, the operating voltage is a second voltage value, wherein the second voltage value is less than the first voltage value. The voltage adjusting circuit is provided with a switch, and in an initial time interval in the burnin-test mode, the voltage adjusting circuit adjusts voltage value of the reverse bias by turning on the switch.

The present invention concerns a method and a device for estimating a level of damage or a lifetime expectation of a power semiconductor module comprising at least one die that is mechanically, thermally, and electrically attached to a substrate, composed of plural layers of different materials. The invention: obtains power losses of the power semiconductor module, obtains the temperature in at least two different locations of the power semiconductor module, estimates a thermal model between the at least two different locations of the power semiconductor module using the determined power losses and the obtained temperatures, determines if a notification indicating the level of damage or the lifetime expectation has to be performed according to the estimated thermal model and a reference thermal model. notifies the level and location of damage or the lifetime expectation if the determining step determines that the notification has to be performed.

Disclosed is a system and method for monitoring a characteristic of an environment of an electronic device. The electronic device may include a printed circuit board and a component. A sensor is placed on the printed circuit board, and may be between the component and the board, and connects to a monitor, or detector. An end user device may be used to store, assess, display and understand the data received from the sensor through the monitor.

An inspection apparatus for inspecting electrical characteristics of a plurality of devices formed on an inspection object, includes a stage configured to mount the inspection object, a temperature detector configured to detect a temperature of the stage, a heat source provided separately from the stage, a cooler configured to cool the stage, and a temperature controller configured to control the heat source and the cooler based on the temperature of the stage detected by the temperature detector.

The present disclosure relates to a device for simulating a battery of a device-under-test (DUT), comprising a battery simulation unit adapted to fit into a battery reception unit of the DUT; and a controller configured to control the battery simulation unit to simulate electrical characteristics of a battery; wherein the battery simulation unit is configured to supply electrical power to the DUT or drain electrical power from the DUT based to the simulated electrical characteristics. The device further comprises a temperature sensor configured to measure a temperature at or in the battery simulation unit; and a heater unit configured to heat the battery simulation unit.

A method for performing predictive maintenance of an amplifier module is described. At least one parameter of at least one amplifier module is acquired via a measurement data acquisition unit. The at least one parameter acquired is analyzed via a measurement data analyzing unit so as to predict the probability and/or time of default of the at least one amplifier module. Further, a system is described.

A device used for attaching a semiconductor device to a circuit board over a first temperature. The device includes a hook member that includes a first hook, a second hook, and a body between the first hook and the second hook. The body has a first surface, a second surface opposite the first surface, and a first hole extended from the first surface to the second surface. The device further includes a fixing member and a holder. The fixing member has a second hole, and the holder passes through the first hole and the second hole, and is engaged with the fixing member.

An electronic device includes: a detection circuit configured to determine one or more operating data, one or more device sensor data, or a combination thereof associated with operation of the electronic device; a trigger circuit operably coupled to the circuit, the trigger circuit configured to generate a stress input based on detecting one or more target criteria from the one or more operating data, the one or more device sensor data, or a combination thereof; and a degradation sensor operably coupled to the trigger circuit, the degradation sensor having a threshold voltage and being configured to record the target criteria that occurs during operation of the electronic device, wherein the degradation sensor is configured to record the target criteria based on degradation of the threshold voltage according to the stress input.