A system includes a first integrated circuit including a first interface circuit with a first transmit pin and a first receive pin, and a first test circuit. The system also includes a second integrated circuit including a second interface circuit with a second receive pin coupled to the first transmit pin, and a second transmit pin coupled to the first receive pin. The second integrated circuit further includes a second test circuit configured to route signals from the second receive pin to the second transmit pin, such that the sent test signal is received by the second receive pin, bypasses the second test circuit, and is routed to the second transmit pin. The first test circuit is further configured to receive the routed test signal on the first receive pin via the second conductive path.

A test head assembly for a semiconductor device has a carrier, a pin seat and a test wire assembly. The carrier is formed in an L shape and has a lateral board, a perpendicular board and a opening formed through the perpendicular board. The pin seat is mounted in the corresponding opening. The test wire assembly has a teat head, a plurality of connectors and a plurality of test wires. The test head is mounted on an outer sidewall of the lateral board and connected to the pin seat through the test wires and the connectors. Therefore, the pin seat is mounted on the perpendicular board of the L-shaped uprightly and the test head is mounted on the lateral board. The pin seat and the test head are not parallel to each other, and a lateral size of the test head assembly is reduced to increase the space usage.

An automated test equipment for testing one or more DUTs comprises a test head and a DUT interface. The DUT interface comprises a plurality of blocks of spring-loaded pins, for example groups or fields of spring-loaded pins. For example, the DUT interface is configured for establishing an electronic signal path between the test head and a DUT board or load board, which holds the DUT or which provides a connection to the DUT. The automated test equipment is configured to allow for a variation of a distance between at least two blocks of spring-loaded pins.

A circuit board includes an insulating substrate having a first surface and a second surface opposite to the first surface, a solid conductor located inside the insulating substrate, a first via conductor connected to the solid conductor from a side of the first surface, and a second via conductor connected to the solid conductor from a side of the second surface. The solid conductor has a cutout that intersects a line segment that connects a node of the first via conductor and a node of the second via conductor to each other.

An integrated circuit testing assembly, comprising a slab having a slab axis, and a first electrode and second electrode affixed relative to the slab. The first electrode has a first major axis parallel to the slab axis, is coupled to receive a first voltage for coupling to a first set of pins on an integrated circuit, and includes a first surface area facing the slab axis, wherein the first surface area does not include a surface discontinuity. The second electrode has a second major axis parallel to the slab axis, is coupled to receive a second voltage for coupling to second first set of pins on an integrated circuit, and includes a second surface area facing the slab axis, wherein the second surface area does not include a surface discontinuity.

An inspection jig is used for inspection for an inspection target device including a flexible substrate having a flexible base material with external connection terminals formed thereon. The inspection jig is composed of an inspection device and an attraction part. The inspection device has inspection terminals, and the inspection terminals have vacuum attraction holes. The attraction part has an attraction surface. The external connection terminals have first through holes. In inspection, the attraction part is placed on the front surface of the flexible base material so that the first through holes and the vacuum attraction holes overlap each other and the attraction surface covers the first through holes, and the insides of the first through holes and the vacuum attraction holes are made into vacuum, whereby the attraction surface is attracted to the flexible base material and the external connection terminals are attracted to the inspection terminals.

A probe card device includes a printed circuit board (PCB), a space transformer, and a high-speed flexible printed circuit (FPC). The PCB includes a plurality of first connecting bodies coupled to a tester, and a plurality of second connecting bodies. The space transformer includes a plurality of connecting bodies disposed on a first surface of the space transformer and coupled to the plurality of second connecting bodies of the printed circuit board, a plurality of general contact pads disposed on a second surface of the space transformer and contacted with a plurality of first probes, and a plurality of high-speed contact pads disposed on the second surface of the space transformer and contacted with a plurality of second probes. The high-speed FPC has a first connecting terminal coupled to the tester, and a second connecting terminal coupled to the plurality of high-speed contact pads.

The present disclosure provides a testing apparatus, a holding assembly and a probe card carrier. In some embodiments of the present disclosure, the testing apparatus includes a basic circuit board having a first surface and a second surface; a holding assembly disposed on the first surface; a signal transfer assembly disposed on the second surface and electrically connected to the basic circuit board; and a probe card carrier configured to carry a probe card. In some embodiments of the present disclosure, when the probe card carrier is assembled to the holding assembly, the probe card is electrically connected to the signal transfer assembly.

A micro device under test (DUT) carrier includes a carrier main body, a pusher and a spring. The carrier main body includes a plurality of bearing stages. Each bearing stage is utilized to bear a micro DUT. The pusher, operated to move from a locking position to an opening position, includes a pusher main body and a plurality of locking elements. Each locking element corresponds to each bearing stage, and is located next to each bearing stage. The spring is utilized to send the pusher back to the locking position, so that each locking element restricts movement of each micro DUT.

A probe card includes a flexible inorganic material layer, a metal micro structure, and a circuit board. The flexible inorganic material layer has a first surface and a second surface opposite to each other. The metal micro structure is disposed on the first surface. The circuit board is disposed on the second surface, and the circuit board is electrically connected to the metal micro structure. The test signal is adapted to be conducted to the circuit board through the flexible inorganic material layer.