G01R31/31713

Test apparatuses including probe card for testing semiconductor devices and operation methods thereof
11243232 · 2022-02-08 · ·

A probe apparatus includes a tester including a voltage supply, and a probe card including a first probe and a first sensing pin. The first probe is electrically connected to both an output port of the voltage supply and an electrode pad of a first semiconductor device. The first sensing pin is electrically connected to both a controller and a sensing pad of the first semiconductor device.

Test messaging demodulate and modulate on separate power pads
09739832 · 2017-08-22 · ·

The present disclosure describes a novel method and apparatus for using a device's power and ground terminals as a test and/or debug interface for the device. According to the present disclosure, messages are modulated over DC voltages applied to the power terminals of a device to input test/debug messages to the device and output test/debug messages from the device. The present disclosure advantageously allows a device to be tested and/or debugged without the device having any shared or dedicated test or debug interface terminals.

Non-Interleaved Scan Operation for Achieving Higher Scan Throughput in Presence of Slower Scan Outputs
20170234925 · 2017-08-17 ·

A scan chain may be formed throughout an integrated circuit in which the scan chain is coupled to a set of pins via bi-directional input/output (I/O) buffers. A test pattern may be received from an external tester using the set of I/O pins and buffers operating in parallel. The test pattern is scanned into the scan chain using a shift clock operating at a first rate. The test pattern is then provided to combinatorial logic circuitry coupled to the scan chain. A response pattern is captured in the scan chain and then scanned from the scan chain using a shift clock operating at a second rate that is slower than the first rate. The response pattern is provided to the external tester using the same set of I/O pins and buffers operating in parallel.

Secure external SoC debugging
11250167 · 2022-02-15 · ·

Various systems and methods for implementing secure system-on-chip (SoC) debugging are described herein. A method of providing secure system-on-a-chip (SoC) debugging, comprises: receiving, from a remote host at a debug companion circuit, a debug initiation request to initiate a debugging session with an SoC associated with the debug companion circuit; encrypting, at the debug companion circuit, a debug handshake command; transmitting the debug handshake command to the SoC from the debug companion circuit, wherein the SoC is configured to authenticate the debug companion circuit, and configure intellectual property (IP) blocks on the SoC to expose debug data to the debug companion circuit in response to authenticating the debug companion circuit; and managing a secure connection with the SoC to obtain debug data and report the debug data to the remote host.

DEBUG SUPPORT DEVICE, DEBUG SUPPORT METHOD, AND COMPUTER READABLE STORAGE MEDIUM
20220043060 · 2022-02-10 · ·

A debug support device includes: a root device extraction unit that extracts, from a sequence program that includes a circuit block including a plurality of devices, a result device on the basis of an association between a factor device that contributes to determination of a value of another device and the result device having the value determined by the factor device; a related device retrieval unit that retrieves, as a related device, each and every one of the factor device(s) that determines the value of the result device; and a display control unit that outputs group information to a display device. The group information is information on a group, associating the result device, the value of the result device, the related device, and a value of the related device.

Controller accessible test access port controls
11209483 · 2021-12-28 · ·

Boundary scan test data and a command to initiate a boundary scan test are received via a universal asynchronous receiver-transmitter (UART). Based on receiving the command, a boundary scan test mode is initiated at a memory sub-system controller. A boundary scan test vector based on the boundary scan test data is synchronously streamed to a boundary scan chain. Test result data output by the scan chain is provided to a UART host via the UART.

Methods and devices for testing comparators

A device for a system on a chip (SOC), the device includes: a comparator that includes a first input port, a second input port, and an output port. A first input signal and a second input signal are split into N bit pairs that include one bit from the first input signal and one bit from the second input signal. The comparator is configured so a mismatch between the first input signal and the second input signal causes an output signal to assume a first expected state. The device further comprises a test controller to perform a first operability test by mismatching the N bit pairs and verifying that the output signal assumes the first expected state.

INTEGRATED TEST CELL USING ACTIVE THERMAL INTERPOSER (ATI) WITH PARALLEL SOCKET ACTUATION

A testing apparatus comprises a test interface board comprising a plurality of socket interface boards, wherein each socket interface board comprises: a) an open socket to hold a DUT; b) a discrete active thermal interposer comprising thermal properties and operable to make thermal contact with the DUT; c) a superstructure operable to contain the discrete active thermal interposer; and d) an actuation mechanism operable to provide a contact force to bring the discrete active thermal interposer in contact with the DUT.

SYSTEM CAPABLE OF DETECTING FAILURE OF COMPONENT OF SYSTEM AND METHOD THEREOF
20220206068 · 2022-06-30 · ·

This disclosure proposes an inventive system capable of testing a component in the system during runtime. The system may comprise: a substrate; a plurality of functional components, of the plurality of functional components being mounted onto the substrate and including a circuitry; a system bus formed with electrically conductive pattern onto the substrate thereby allowing the plurality of functional components to communicate with each other; one or more wrappers, each of the one or more wrappers connected to one of the plurality of functional components; and an in-system component tester (ICT) configured to: select, as a component under test (CUT), at least one functional component, in an idle state, of the plurality of the functional components; and test, via the one or more test wrappers, the at least one functional component selected as the CUT.

Electronic chip with analog input and output

An electronic chip includes an analog input connection pad and an analog output connection pad. A switch is coupled between the analog input connection pad and the analog output connection pad. In one embodiment, the chip operates in a self-test mode and in an active mode. The switch is closed only in the self-test mode.