A digital input and output signal test platform includes a digital input signal circuit, a digital output signal circuit, and a digital signal interface circuit. The digital input signal circuit generates a plurality of digital input signals and displays the generated digital input signals. The digital output signal circuit receives a plurality of digital output signals and displays the received digital output signals. The digital signal interface circuit transmits the generated digital input signals to digital input ports of an electronic product under test, and transmits the digital output signals output from digital output ports of the electronic product to the digital output signal circuit.

In some embodiments, a system and/or method may test logic blocks for an integrated circuit. To alleviate problems associated with current methods of integrated circuit testing, a system may include a power switch control signal on a different voltage rail. In some embodiments, a Test VDD may be used to isolate the power switches from the rest of the logic cells in an integrated circuit. During testing, each logic block may be powered individually using the Test VDD to control the power switches to the logic blocks. When a logic block short is identified, the nonviable logic block may be isolated to such that the nonviable logic block is not used during the future and only viable logic blocks are used in the integrated circuit. This allows for use of logic within an integrated circuit that might otherwise have been discarded or destroyed because of one or more shorts.

Techniques and mechanisms to exchange test, debug or trace (TDT) information via a general purpose input/output (I/O) interface. In an embodiment, an I/O interface of a device is coupled to an external TDT unit, wherein the I/O interface is compatible with an interconnect standard that supports communication of data other than any test information, debug information or trace information. One or more circuit components reside on the device or are otherwise coupled to the external TDT unit via the I/O interface. Information exchanged via the I/O interface is generated by, or results in, the performance of one or more TDT operations to evaluate the one or more circuit components. In another embodiment, the glue logic of the device interfaces the I/O interface with a test access point that is coupled between the one or more circuit components and the I/O interface.

Disclosed are methods, systems and devices for implementing built-in self-test (BIST) to be performed by an untrusted party and/or in an unsecure testing environment. In an embodiment, a test access port (TAP) on a device may enable a party to initiate execution of one or more BIST procedures on the device. Additionally, such a TAP may enable loading of encrypted instructions to be executed by one or more processors formed on a device under test.

A testing system includes a slot configured to receive a device-under-test (DUT), and a core testing processor configured to communicate with a user interface and with the slot, wherein the core testing processor is associated with communication that is independent of any other communications transmitted within the system, and wherein the core testing processor executes a set of tests associated with the DUT.

The disclosure describes novel methods and apparatuses for controlling a device’s TCA circuit when the device exists in a JTAG daisy-chain arrangement with other devices. The methods and apparatuses allow the TCA test pattern set used during device manufacturing to be reused when the device is placed in a JTAG daisy-chain arrangement with other devices, such as in a customer’s system using the device. Additional embodiments are also provided and described in the disclosure.

One embodiment of the present disclosure describes a memory system that may include one or more memory devices that may store data. The memory devices may receive command signals to access the stored data as a loopback signal. The memory devices may operate in a normal operational mode, a loopback operational mode, a retrieval operational mode, a non-inverting pass-through operational sub-mode, and an inverting pass-through operational sub-mode. The operational modes facilitate the transmission of the loopback signal for the purpose of monitoring of memory device operations. A selective inversion technique, which uses the operational modes, may protect the loopback signal integrity during transmission.

An electronic device includes a driver that is connected with a pin, receives an input signal, and outputs an output signal to the pin in response to the input signal, a core circuit that transfers the input signal to the driver, and a monitor circuit that receives the input and output signals and detects a stuck voltage state of the output signal based on the input and output signals. The monitor circuit includes a first detection circuit that detects the stuck voltage state when the input and output signals are logically incorrect, a second detection circuit that detects the stuck voltage state when the input and output signals are logically correct and when the output signal is at a low level, and a third detection circuit that detects the stuck voltage state when the input and output signals are logically correct and when the output signal is at a high level.

The disclosure describes novel methods and apparatuses for controlling a device's TCA circuit when the device exists in a JTAG daisy-chain arrangement with other devices. The methods and apparatuses allow the TCA test pattern set used during device manufacturing to be reused when the device is placed in a JTAG daisy-chain arrangement with other devices, such as in a customers system using the device. Additional embodiments are also provided and described in the disclosure.

The disclosure describes novel methods and apparatuses for controlling a device's TCA circuit when the device exists in a JTAG daisy-chain arrangement with other devices. The methods and apparatuses allow the TCA test pattern set used during device manufacturing to be reused when the device is placed in a JTAG daisy-chain arrangement with other devices, such as in a customers system using the device. Additional embodiments are also provided and described in the disclosure.