G01R31/31715

Transmitter test with interpolation

Various embodiments provide for testing a transmitter with interpolation, which can be used with a circuit for data communications, such as serializer/deserializer (SerDes) communications. In particular, some embodiments provide for data transmission test of a transmitter by: generating and outputting a pre-determined data pattern through a serializer of the transmitter; sampling a serialized data output of the serializer over a plurality of different interpolation phase positions of a phase interpolator; and using a pattern checker to error check the sampled data over the plurality of different interpolation phase positions to determine whether the data transmission test passes.

Test compression in a JTAG daisy-chain environment
11105852 · 2021-08-31 · ·

The disclosure describes novel methods and apparatuses for controlling a device's TCA circuit when the device exists in a JTAG daisy-chain arrangement with other devices. The methods and apparatuses allow the TCA test pattern set used during device manufacturing to be reused when the device is placed in a JTAG daisy-chain arrangement with other devices, such as in a customers system using the device. Additional embodiments are also provided and described in the disclosure.

Pin Testing System for Multi-Pin Chip and Method Thereof
20230400511 · 2023-12-14 ·

A pin testing system for a multi-pin chip and method thereof are disclosed. In the system, a chip testing circuit board includes a testing circuit, a to-be-tested chip fixture, a testing chip and a JTAG port, each pin of the testing chip is electrically connected to a corresponding pin of the to-be-tested chip fixture through the testing circuit. The JTAG port, the testing chip and the to-be-tested chip fixture are serially connected to form a JTAG link through the testing circuit, the testing device, the JTAG controller and the chip testing circuit board are serially connected, the testing device generates a testing signal to test each of the pins of the to-be-tested chip through the JTAG controller, and a testing result for each of the pins is transmitted to the testing device, so that the testing on the pins of the to-be-tested chip is completed.

METHOD OF HIGH SPEED AND DYNAMIC CONFIGURATION OF A TRANSCEIVER SYSTEM
20210199718 · 2021-07-01 ·

A field-programmable gate array includes a memory, a firmware state machine, a register, and an interconnect structure. The memory is configured to store a plurality of configurations. Each of the plurality of configurations has at least one parameter associated therewith. The firmware state machine is configured to read the parameters stored in the memory. The register is configured to have the parameters associated with the plurality of configurations written thereto. The interconnect structure is configured to transmit the parameters between the firmware state machine and the register. The interconnect structure is configured to receive the parameters associated with the plurality of the configurations simultaneously and the interconnect structure is configured to transmit the received parameters associated with the plurality of configurations to the register simultaneously.

Adapting the usage configuration of integrated circuit input-output pads

Techniques for implementing a self-test procedure of an integrated circuit are provided, where the self-test procedure comprises testing for an electrical connection between first and second input-output pads of the integrated circuit. A control device is capable of adapting a functional configuration of usage of the first and second input-output pads in dependence on presence of the electrical connection. A corresponding integrated circuit, printed circuit and method are also provided. These techniques allow the integrated circuit to be used in a variety of contexts, without requiring physical customisation of the integrated circuit to adapt it to its usage context, in particular where connections from the context to the pads of the integrated circuit may be made to individual pads in some contexts or may span more than one pad in other contexts.

SELF-TEST CIRCUITRY

The present disclosure relates to self-test circuitry for a system that includes one or more current control subsystems, each current control subsystem having a load terminal for coupling the current control subsystem to a load. The self-test circuitry comprises: a signal path associated with each current control subsystem, each signal path configured to selectively couple a measurement node to the load terminal of the current control subsystem, wherein the measurement node is common to all of the signal paths; voltage detection circuitry; and test voltage source circuitry configured to provide a test voltage to the measurement node. The voltage detection circuitry is operable to output a signal indicative of a fault condition if a voltage detected at the measurement node differs from the test voltage when the measurement node is coupled to the load terminal.

TESTING OF ASYNCHRONOUS RESET LOGIC

Testing of integrated circuitry, wherein the integrated circuitry includes a flip-flop with an asynchronous input, so that during performance of asynchronous scan patterns, glitches are avoided. Combinatorial logic circuitry delivers a local reset signal to the asynchronous input independent of an assertion of an asynchronous global reset signal. A synchronous scan test is performed of delivery of the local reset signal from the combinatorial logic circuitry while masking delivery of any reset signal to the asynchronous input of the flip-flop. An asynchronous scan test is performed of an asynchronous reset of the flip-flop with the asynchronous global reset signal while masking delivery of the local reset signal to the asynchronous input of the flip-flop.

Device and method for testing a computer system
11009547 · 2021-05-18 · ·

A computer system includes a circuit board, one or more electronic components and a board management controller (BMC). The electronic components are disposed on the circuit board. The BMC is disposed on the circuit board and electrically connected to the one or more electronic components. The BMC is configured to enable/initiate a boundary scan test for the one or more electronic component.

Time interleaved scan system
10996267 · 2021-05-04 · ·

Certain aspects of the present disclosure provide a circuit for testing processor cores. For example, certain aspects provide a circuit having a deserializer having at least one input coupled to at least one input node of the circuit and having a first plurality of outputs, a plurality of processor cores having inputs coupled to the first plurality of outputs of the deserializer, and a serializer having inputs coupled to a second plurality of outputs of the plurality of processor cores.

Methods and apparatuses to detect test probe contact at external terminals

An example apparatus includes an input buffer coupled to an input terminal, wherein the input buffer is configured to provide an input signal based on a voltage received at the input terminal, a test terminal configured to receive a probe signal, and a power supply terminal configured to receive an external supply voltage. The example apparatus further includes a test logic circuit configured to, in response to the probe signal indicating a test and an external supply voltage detection signal having a value indicating detection of the external supply voltage, initiate a probe contact detection test. During the initiate a probe contact detection test, the test logic circuit is configured to receive the input signal and to provide an output signal having a value based on the input signal.