An example apparatus includes an input buffer coupled to an input terminal, wherein the input buffer is configured to provide an input signal based on a voltage received at the input terminal, a test terminal configured to receive a probe signal, and a power supply terminal configured to receive an external supply voltage. The example apparatus further includes a test logic circuit configured to, in response to the probe signal indicating a test and an external supply voltage detection signal having a value indicating detection of the external supply voltage, initiate a probe contact detection test. During the initiate a probe contact detection test, the test logic circuit is configured to receive the input signal and to provide an output signal having a value based on the input signal.

There is a provided a drive circuit in which a first drive signal output circuit includes a first control circuit that controls an output of a first drive signal, and a first abnormality detection circuit that detects an abnormality in a first drive signal output circuit, a second drive signal output circuit includes a second control circuit that controls an output of a second drive signal, and a second abnormality detection circuit that detects an abnormality in a second drive signal output circuit, the first drive signal output circuit transmits an occurrence of abnormality to the second drive signal output circuit, when the first abnormality detection circuit detects the abnormality, and the second drive signal output circuit transmits an occurrence of abnormality to the first drive signal output circuit, when the second abnormality detection circuit detects the abnormality.

A processor, including: a core; system test circuitry, the system test circuitry to be locked during operational processor operation; reset circuitry including a kick-off test (KOT) input, the reset circuitry to detect a reset with the KOT input asserted, and to initiate an in-field system test (IFST) mode; a test interface controller to receive in IFST mode an encrypted test packet having a signature, verify the signature of the test packet, and decrypt the test packet; and IFST control circuitry to cause the system test circuitry to perform an IFST test according to the decrypted test packet and to log or report results.

A wafer-level method of testing an integrated circuit (IC) device includes: (i) applying a plurality of test operation signals to a wafer containing the IC device, (ii) generating a test enable signal in response to detecting, on the wafer, a toggling of at least one of the plurality of test operation signals, and then (iii) testing at least a portion of the IC device in response to the generating the test enable signal. The generating may also include generating a test enable signal in response to detecting, on the wafer, an inactive-to-active transition of a toggle detection signal.

A wafer-level method of testing an integrated circuit (IC) device includes: (i) applying a plurality of test operation signals to a wafer containing the IC device, (ii) generating a test enable signal in response to detecting, on the wafer, a toggling of at least one of the plurality of test operation signals, and then (iii) testing at least a portion of the IC device in response to the generating the test enable signal. The generating may also include generating a test enable signal in response to detecting, on the wafer, an inactive-to-active transition of a toggle detection signal.

Techniques and mechanisms to exchange test, debug or trace (TDT) information via a general purpose input/output (I/O) interface. In an embodiment, an I/O interface of a device is coupled to an external TDT unit, wherein the I/O interface is compatible with an interconnect standard that supports communication of data other than any test information, debug information or trace information. One or more circuit components reside on the device or are otherwise coupled to the external TDT unit via the I/O interface. Information exchanged via the I/O interface is generated by, or results in, the performance of one or more TDT operations to evaluate the one or more circuit components. In another embodiment, the glue logic of the device interfaces the I/O interface with a test access point that is coupled between the one or more circuit components and the I/O interface.

Examples herein describe techniques for testing a receiver interface on a die. In one embodiment, the die includes tester circuitry which includes a digital to analog convertor (DAC) which outputs an analog test signal to a selector circuit (e.g., a multiplexer) which forwards the analog test signal to a receiver. By varying the analog test signal, the tester circuitry can identify one or more trip points corresponding to the receiver. That is, by monitoring the output of the receiver, a testing application can determine when the output of the receiver switches states thereby indicating that the analog test signal at the input of the receiver corresponds to the trip point of the receiver. In this manner, internal circuitry (e.g., the tester circuitry) can be used to test a receiver interface that may otherwise be inaccessible.

A wafer-level method of testing an integrated circuit (IC) device includes: (i) applying a plurality of test operation signals to a wafer containing the IC device, (ii) generating a test enable signal in response to detecting, on the wafer, a toggling of at least one of the plurality of test operation signals, and then (iii) testing at least a portion of the IC device in response to the generating the test enable signal. The generating may also include generating a test enable signal in response to detecting, on the wafer, an inactive-to-active transition of a toggle detection signal.

Disclosed is a test and measurement instrument including a plurality of ports. The ports are configured to source a test signal into a device under test (DUT), and receive a signal response from the DUT. The test and measurement instrument also includes a measurement unit configured to measure the signal response. The test and measurement instrument further includes a processor configured to compare the signal response to a data structure. The processor also determines a classification of, and/or connections to, at least one DUT component coupled to at least one of the ports based on results of the comparison.

Systems, devices and methods for high-speed I/O margin testing can screen high volumes of pre-production and production parts and identify cases where the electrical characteristics have changed enough to impact operation. The margin tester disclosed is lower cost, easier to use and faster than traditional BERT and scopes and can operate on the full multi-lane I/O links in their standard operating states with full loading and cross-talk. The margin tester assesses the electrical receiver margin of an operation multi-lane high speed I/O link of a device under test simultaneously in either or both directions. In a technology-specific form, an embodiment of the margin tester can be implemented as an add-in card margin tester to test motherboard slots of a mother board under test, or as a as a motherboard with slots to test add-in cards.