A packaged integrated circuit (IC) chip that provides input/output (I/O) signal fail safe verification is disclosed. The packaged IC chip includes a first processing unit, a first control peripheral coupled to receive a first processed signal from the processing unit and to provide an output signal, and compare logic. The compare logic is coupled to receive the output signal and a comparison signal, to compare the output signal and the comparison signal, and to provide an error signal responsive to a difference between the output signal and the comparison signal.

A probe module, which supports loopback test and is provided between a PCB and a DUT, includes an adapter, two probes, two inductive components provided at the adapter, and a capacitive component. The adapter has two connecting circuits. An end of each of the probes is connected to one of the connecting circuits, while another end thereof, which is a tip, contacts the DUT. Each of the inductive components has an end electrically connected to one of the connecting circuits, and another end electrically connected to the PCB through a conductive member, which is provided at the adapter, wherein two ends of the capacitive component are electrically connected to one of the connecting circuits, respectively. Whereby, the signal paths are changed by the differences between frequencies of signals, and the transmission path of high-frequency signals is effectively shortened.

A method includes receiving a first signal at an input of a device driver included at an electronic device, the first signal representing first information. A second signal representing the first information is provided at an output of the device driver. The output of the device driver, under normal operating conditions, is coupled to an output terminal of the electronic device. A third signal at the output terminal is received at feedback circuitry of the electronic device. The feedback circuitry identifies a fault at the output terminal based on the third signal and the first signal.

A device comprising includes an output terminal and a first current path from the output terminal to a first reference voltage. The first current path includes a series connection of current electrodes of a first transistor and a second transistor. The first transistor receives at a control electrode a signal to set a desired level of current to be conducted by the first current path. The second transistor generates at a control electrode a feedback signal indicative of an actual current conducted by the first transistor.

One embodiment of the present disclosure describes a memory system that may include one or more memory devices that may store data. The memory devices may receive command signals to access the stored data as a loopback signal. The memory devices may operate in a normal operational mode, a loopback operational mode, a retrieval operational mode, a non-inverting pass-through operational sub-mode, and an inverting pass-through operational sub-mode. The operational modes facilitate the transmission of the loopback signal for the purpose of monitoring of memory device operations. A selective inversion technique, which uses the operational modes, may protect the loopback signal integrity during transmission.

Techniques for memory I/O tests using integrated test data paths are provided. In an example, a method for operating input/output data paths of a memory apparatus can include receiving, during a first mode, non-test information at a data terminal of a first channel of the memory apparatus from a memory array of the first channel via a first data path, receiving during a first test mode, first test information at the data terminal of the first channel from a first additional data path coupling the first channel with a second channel of the memory apparatus, and wherein an interface die of the memory apparatus includes the first data path and the additional data path.

An interface chip with a built-in self-test mechanism. An electrical physical layer (EPHY) provides a signal to a transmission terminal of the interface chip, and gets a signal from a reception terminal of the interface chip. A digital code generator generates a source code to be scrambled as a scrambled code and then encoded by an encoder and conveyed to the EPHY to be converted into the signal that is provided to the transmission terminal by the EPHY. The EPHY further converts the signal received from the reception terminal into a receiving code to be decoded by a decoder as a decoded code and then descrambled by the descrambler as a restored code. When the transmission terminal is coupled back to the interface chip via the reception terminal, the code checker checks whether the restored code matches the source code.

Systems, methods, and devices are described herein for performing intra-die and inter-die tests of one or more dies of an integrated circuit. A cell of an integrated circuit includes a data register, an I/O pad, and a first multiplexer. The data register is configured to output a signal. The I/O pad is coupled to the data register and configured to receive and buffer the signal. The first multiplexer is coupled to the I/O pad and the data register. The multiplexer is configured to selectively output either the buffered signal or the signal based on whether a scan mode or a functional mode is enabled.

Circuits and methods for loopback testing are provided. A die incorporates a receiver (RX) to each transmitter (TX) as well as a TX to each RX. This architecture is applied to each bit so, e.g., a die that transmits or receives 32 data bits during operation would have 32 transceivers (one for each bit). Focusing on one of the transceivers, a loopback architecture includes a TX data path and an RX data path that are coupled to each other through an external contact, such as a via at the transceiver. The die further includes a transmit clock tree feeding the TX data path and a receive clock tree feeding the RX data path. The transmit clock tree feeds the receive clock tree through a conductive clock node that is exposed on a surface of the die. Some systems further include a variable delay in the clock path.

Circuits and methods for loopback testing are provided. A die incorporates a receiver (RX) to each transmitter (TX) as well as a TX to each RX. This architecture is applied to each bit so, e.g., a die that transmits or receives 32 data bits during operation would have 32 transceivers (one for each bit). Focusing on one of the transceivers, a loopback architecture includes a TX data path and an RX data path that are coupled to each other through an external contact, such as a via at the transceiver. The die further includes a transmit clock tree feeding the TX data path and a receive clock tree feeding the RX data path. The transmit clock tree feeds the receive clock tree through a conductive clock node that is exposed on a surface of the die. Some systems further include a variable delay in the clock path.