A system for testing a circuit comprises scan chains, a controller configured to generate a bit- inverting signal based on child test pattern information, and bit-inverting circuitry coupled to the controller and configured to invert bits of a parent test pattern associated with a plurality of shift clock cycles based on the bit-inverting signal to generate a child test pattern during a shift operation. Here, the plurality of shift clock cycles for bit inverting occur every m shift clock cycles, and the child test pattern information comprises information of m and location of the plurality of shift clock cycles in the shift operation.

A test assistance device includes at least one memory configured to store instructions; and at least one processor configured to execute the instructions to; generate one or more of a test pattern in which a value of a parameter in test target-associated information is determined based on the test target-associated information indicating, so as to include the parameter, a requirement for a test defined in accordance with a test target, and generate a system requirement for a system satisfying the requirement for the test indicated by the test pattern.

A circuit debug apparatus for debugging an integrated circuit that causes a functional fault may include a processor configured to extract a scan pattern of a scan chain of the integrated circuit while the integrated circuit is in a scan mode. The scan pattern includes a plurality of logic states for a corresponding plurality of logic circuits of the integrated circuit. The processor may also be configured to apply a modified scan pattern to the integrated circuit while the integrated circuit is in the scan mode, where the modified scan pattern includes a test pattern configured to eliminate the functional fault. The processor may be further configured to determine whether the integrated circuit with the modified scan pattern produces the functional fault while the integrated circuit is in a functional mode.

A margin testing device includes at least one interface structured to connect to a device under test (DUT) one or more controllers structured to create a set of test signals based on a sequence of pseudo random data and one or more pre-defined parameters, and an output structured to send the set of test signals to the DUT. Methods and a system for testing a DUT with the disclosed margin tester and other testing device are also described.

According to one or more embodiments, the semiconductor integrated circuit device includes a pattern generator, a result comparator, and a control circuit. The pattern generator supplies input data to a device-under-test. The result comparator compares output data of the device-under-test with expected value data and outputs a test result signal. The control circuit controls the pattern generator and the result comparator. The device-under-test and the result comparator are commonly connected to a first clock line. The pattern generator and the control circuit are commonly connected to a second clock line different from the first clock line.

The disclosed embodiments relate to method, apparatus and system for testing memory circuitry and diagnostic components designed to test the memory circuitry. The memory may be tested regularly using Memory Built-In Self-Test (MBIST) to detect memory failure. Error Correction Code (ECC)/Parity is implemented for SRAM/Register Files/ROM memory structures to protect against transient and permanent faults during runtime. ECC/Parity encoder and decoder logic detect failure on both data and address buses and are intended to catch soft error or structural fault in address decoding logic in SRAM Controller, where data may be read/written from/to different locations due to faults. ECC/parity logic on the memory structures are subject to failures. In certain exemplary embodiments, an array test controller is used to generate and transmit error vectors to thereby determine faulty diagnostic components. The test vectors may be generated randomly to test the diagnostic components during run-time for in-field testing.

A system-on-chip integrated circuit device includes a plurality of functional circuit modules, at least a first circuit module of the plurality of functional circuit modules operating under a first protocol, the first protocol being an interface protocol for communicating outside the system-on-chip integrated circuit device, an interconnect fabric coupled to the functional circuit modules in the plurality of functional circuit modules, and a built-in self-test circuit module coupled to the interconnect fabric. The built-in self-test circuit is configured to test one or more selected functional circuit modules in the plurality of functional circuit modules, including at least the first circuit module under the first protocol for communicating outside the system-on-chip integrated circuit device, by routing test data through the one or more selected functional circuit modules.

Manufacturers perform tests on chips before the chips are shipped to customers. However, defects can occur on a chip after the manufacturer testing and when the chips are used in a system or device. The defects can occur due to aging or the environment in which the chip is employed and can be critical; especially when the chips are used in systems such as autonomous vehicles. To verify the structural integrity of the IC during the lifetime of the product, an in-system test (IST) is disclosed. The IST enables self-testing mechanisms for an IC in working systems. The IST mechanisms provide structural testing of the ICs when in a functional system and at a manufacturer's level of testing. Unlike ATE tests that are running on a separate environment, the IST provides the ability to go from a functional world view to a test mode.

A method includes identifying state holding pipeline stages in a pipeline path of a design for test (DFT) of an integrated circuit design, splitting each pattern of a plurality of patterns into a first part and a second part, reformatting the plurality of patterns to generate another plurality of patterns such that the first part and the second part of each pattern of the plurality patterns are included in different patterns of the another plurality of patterns. The length of the first part is a function of a number of the identified pipeline stages.

A circuit comprises: scan chains comprising scan cells, the scan chains configured to shift in test patterns, apply the test patterns to the circuit, capture test responses of the circuit, and shift out the test responses; a decompressor configured to decompress compressed test patterns into the test patterns; a test response compactor configured to compact the test responses; and shuffler circuitry inserted between outputs of the scan chains and inputs of the test response compactor, the shuffler circuitry comprising state elements configured to delay output signals from some of the scan chains for one or more clock cycles based on a control signal, the control signal varying with the test patterns.