An integrated circuit that includes a processor also has an on-chip current test circuit that indirectly measures quiescent current in the processor. A supply voltage pin of the integrated circuit receives a supply voltage from an external test unit to provide power to the processor. The on-chip test circuit measures a voltage change across the processor during a predetermined test period T when the processor is isolated from the supply voltage and the clock signal is stopped. The voltage change provides an indication of quiescent current corresponding to the processor.

An integrated circuit that includes a processor also has an on-chip current test circuit that indirectly measures quiescent current in the processor. A supply voltage pin of the integrated circuit receives a supply voltage from an external test unit to provide power to the processor. The on-chip test circuit measures a voltage change across the processor during a predetermined test period T when the processor is isolated from the supply voltage and the clock signal is stopped. The voltage change provides an indication of quiescent current corresponding to the processor.

According to an embodiment, a testing system for a satellite payload includes a built-in testing component configured at a satellite, the built-in testing component comprising a built-in testing component input and a built-in testing component output, and a payload component configured at the satellite, the payload component comprising a payload component input communicatively connected to the built-in testing component output and a payload component output communicatively connected to the built-in testing component input, wherein the built-in testing component is configured to transmit a digital test signal from the built-in testing component output to the payload component input and receive a digital output signal at the built-in testing component input from the payload component output.

According to an embodiment, a testing system for a satellite payload includes a built-in testing component configured at a satellite, the built-in testing component comprising a built-in testing component input and a built-in testing component output, and a payload component configured at the satellite, the payload component comprising a payload component input communicatively connected to the built-in testing component output and a payload component output communicatively connected to the built-in testing component input, wherein the built-in testing component is configured to transmit a digital test signal from the built-in testing component output to the payload component input and receive a digital output signal at the built-in testing component input from the payload component output.

A method includes varying spacing between at least one of a source region or a drain region and a well contact region to create a group of configurations. The method further includes determining an effect of latchup on each configuration.

A data storage apparatus is provided which has a plurality of data storage units, each respective data storage unit configured to store a respective data bit of a data word. Stored data value parity generation circuitry is configured to generate a parity bit for the data word in dependence on the data bits of the data word stored in the plurality of data storage units. The stored data value parity generation circuitry is configured such that switching within the stored data value parity generation circuitry does not occur when the data word is read out from the plurality of data storage units. Transition detection circuitry is configured to detect a change in value of the parity bit.

A data storage apparatus is provided which has a plurality of data storage units, each respective data storage unit configured to store a respective data bit of a data word. Stored data value parity generation circuitry is configured to generate a parity bit for the data word in dependence on the data bits of the data word stored in the plurality of data storage units. The stored data value parity generation circuitry is configured such that switching within the stored data value parity generation circuitry does not occur when the data word is read out from the plurality of data storage units. Transition detection circuitry is configured to detect a change in value of the parity bit.

According to one or more embodiments, the semiconductor integrated circuit device includes a pattern generator, a result comparator, and a control circuit. The pattern generator supplies input data to a device-under-test. The result comparator compares output data of the device-under-test with expected value data and outputs a test result signal. The control circuit controls the pattern generator and the result comparator. The device-under-test and the result comparator are commonly connected to a first clock line. The pattern generator and the control circuit are commonly connected to a second clock line different from the first clock line.

According to one embodiment, a semiconductor integrated circuit includes: a logic circuit including a first scan chain configured to operate based on a first clock signal and a second scan chain configured to operate based on a second clock signal in a built-in self-test; a pattern generator configured to generate a test pattern and transmit the test pattern to the first and second scan chains; a compression circuit configured to compress first data received from the first and second scan chains; a clock select circuit configured to select one of the first and second clock signals and transmit the one of the first and second clock signals to the corresponding one of the first and second scan chains in the test; and a test control circuit configured to control the test and detect a fault in the logic circuit based on a result of the test.

According to one embodiment, a semiconductor integrated circuit includes: a logic circuit including a first scan chain configured to operate based on a first clock signal and a second scan chain configured to operate based on a second clock signal in a built-in self-test; a pattern generator configured to generate a test pattern and transmit the test pattern to the first and second scan chains; a compression circuit configured to compress first data received from the first and second scan chains; a clock select circuit configured to select one of the first and second clock signals and transmit the one of the first and second clock signals to the corresponding one of the first and second scan chains in the test; and a test control circuit configured to control the test and detect a fault in the logic circuit based on a result of the test.