Systems and methods for contact erosion mitigation are provided. To perform contact erosion mitigation, an order of opening/closing poles and/or contact relays of particular poles is altered, resulting in a sharing of potential arcing conditions amongst the poles/contact relays of these poles.

The present utility model discloses an adjustable contactor including: a static contact fixed in the contactor; a movable contact which is connected in the movable contact bracket through a contact spring, and which makes contact with the static contact in accordance with the movement of the movable contact bracket in the contactor; the contactor further includes adjusting knobs provided in the movable contact bracket at one end in connection with the contact spring while corresponding to the contact springs connected with individual movable contacts, the adjusting knob being set so that adjustment of the compression or release of the contact spring is achieved by rotating the adjusting knob so as to adjust the contact pressure of the movable contact.

A current monitor circuit comprises a sense transistor disposed in a first voltage domain; a reference transistor disposed in a second voltage domain isolated from the first voltage domain; and sensing circuitry configured to determine if a current in the sense transistor is greater than or less than a specified current using a current in the reference transistor.

A defect detector can receives voltage data characterizing a three-phase voltage for each of a plurality of feeder lines. The defect detector generates an alert indicating that a potential defect exists at a switch upstream of the plurality of feeder lines in response to the voltage data indicating (i) a drop in two or more phases of voltage at a given feeder line of the plurality of feeder lines occurred within a predetermined amount of time of toggling of the switch or (ii) a drop in two or more phases of voltage on at least two or more feeder lines of the plurality of feeder lines has occurred.

A temperature measurement circuit includes a band-gap reference circuit configured to generate a band-gap reference voltage that is fixed regardless of an operation temperature, a reference voltage generator circuit configured to generate a measurement reference voltage by adjusting the band-gap reference voltage, a sensing circuit configured to generate a temperature-variant voltage based on a bias current, where the temperature-variant voltage is varied depending on the operation temperature, an analog-digital converter circuit configured to generate a first digital code indicating the operation temperature based on the measurement reference voltage and the temperature-variant voltage, and an analog built-in self-test (BIST) circuit configured to generate a plurality of flag signals indicating whether each of the band-gap reference voltage, the measurement reference voltage, and a bias voltage corresponding to the bias current is included in a predetermined range.

The present invention relates to a self-diagnostic apparatus capable of improving safety of a device under test (DUT) by analyzing a characteristic change of a DUT, such as a semiconductor, a circuit module, or a system, in a safe operating region over time and allowing a regular test and a periodic test to be performed even while the DUT is running.

A ZSI testing apparatus includes a fault generation circuit, a plurality of cable assemblies coupled to the fault generation circuit, wherein the cable assemblies are structured to be selectively coupled to selected circuit interrupters, a human machine interface, and a controller coupled. The controller is configured to: (i) selectively cause a fault current to be provided to a number of the cable assemblies, (ii) receive an input from each circuit interrupter that is coupled to one of the cable assemblies, each input being indicative of a trip signal output of the circuit interrupter, (iii) determine based on the received inputs (a) that an error has occurred with respect to operation of the circuit interrupters and (b) a recommendation for fixing the error, and (iv) cause an output indicative of the error and the recommendation to be provided on the human machine interface.

A relay and metering test instrument includes an application processor circuitry to control functional operation of the relay and metering test instrument. The application processor circuitry may receive a user selected source code state program, and operational parameters input by the user. The application processor circuitry may compile the source code state program and the operational parameters into a test routine for storage in a memory circuitry with other test routines. The relay and metering instrument may also include a real time processor circuitry and an input/output processor circuitry. The real time processor circuitry may selectively and independently execute the test routine or one of the other test routines to perform one or more respective testing stages. The input/output processor circuitry may cooperatively operate with the real time processor circuitry to output test signals and monitor for receipt of input test signals according to execution of the test routine.

A testing system includes a truck carrying a circuit breaker, a fixed contact, and an actuator piston connected to a movable contact. A test platform supports the truck in a contact testing position and includes a sensor circuit mounted on the test platform and positioned under the truck and aligned with the circuit breaker when the truck is on the test platform in the contact testing position. The sensor circuit is configured to acquire displacement data of the actuator piston when the movable electrical contact is moved between the open and closed positions. A controller is coupled to the sensor circuit and configured to receive the displacement data and determine electrical contact erosion within the circuit breaker.

An object is to provide a semiconductor device capable of accurately detecting a temperature of a transistor part and a temperature of the diode part, and improving an overheat protection function. A semiconductor device includes a semiconductor chip having a cell region made up of a plurality of cells including cells corresponding to a transistor part and a diode part, respectively, a temperature detection part detecting a temperature of the transistor part, and a temperature detection part detecting a temperature of the diode part, the temperature detection part is disposed in the cell corresponding to the transistor part, and the temperature detection part is disposed in the cell corresponding to the diode part.