A circuit board comprising a contacting arrangement, including three metal contacting regions, which are connected with one or more data links of the circuit board and in the case of contact with a communication interface of a test system enable a data exchange with a data memory of a circuit board.

A test system for checking electrical connections, especially solder connections, between electronic components with a circuit board to be checked, characterized in that the test system includes a communication interface with at least three electrically-conductive contact tips, which by contact with a contacting arrangement on the circuit board having a number of contacting locations enable a data exchange with a data memory and/or a communication module of a circuit board, wherein the data exchange occurs according to a communication protocol.

A test system for checking electrical connections, especially solder connections, between electronic components with a circuit board to be checked, characterized in that the test system includes a communication interface with at least three electrically-conductive contact tips, which by contact with a contacting arrangement on the circuit board having a number of contacting locations enable a data exchange with a data memory and/or a communication module of a circuit board, wherein the data exchange occurs according to a communication protocol.

A display device includes: a plurality of electrode wires formed in a touch panel; a plurality of signal wires connecting together opposing ends of each of the electrode wires and a connecting circuit board connected to the touch panel; and a plurality of circuit board terminals formed on the connecting circuit board, each of the circuit board terminals being connected to a corresponding one of the signal wires, wherein the circuit board terminals include: a first circuit board terminal connected at one end to one of the electrode wires; and a second circuit board terminal connected at an other end to the one electrode wire, the first circuit board terminal and the second circuit board terminal being different.

A display device includes: a plurality of electrode wires formed in a touch panel; a plurality of signal wires connecting together opposing ends of each of the electrode wires and a connecting circuit board connected to the touch panel; and a plurality of circuit board terminals formed on the connecting circuit board, each of the circuit board terminals being connected to a corresponding one of the signal wires, wherein the circuit board terminals include: a first circuit board terminal connected at one end to one of the electrode wires; and a second circuit board terminal connected at an other end to the one electrode wire, the first circuit board terminal and the second circuit board terminal being different.

A test system for testing electric connections, in particular soldered connections, between electronic components and a printed circuit board to be tested, characterized in that the test system includes a subassembly, which is movably mounted in a housing of the test system, and a current and/or voltage source for energizing the circuit board to be tested, the current and/or voltage source being arranged in the housing of the test system in such a way as to be movable in at least two directions in space.

A test system for testing electric connections, in particular soldered connections, between electronic components and a printed circuit board to be tested, characterized in that the test system includes a subassembly, which is movably mounted in a housing of the test system, and a current and/or voltage source for energizing the circuit board to be tested, the current and/or voltage source being arranged in the housing of the test system in such a way as to be movable in at least two directions in space.

The present disclosure relates to a concept for checking at least one solder joint between a printed circuit board and a current sensor, including: measuring, by means of the current sensor, an electric current through the solder joint; measuring at least one temperature of the current sensor as a function of the electric current; and ascertaining a quality of the solder joint based on the temperature and the electric current.

Test structures and methods for superconducting bump bond electrical characterization are used to verify the superconductivity of bump bonds that electrically connect two superconducting integrated circuit chips fabricated using a flip-chip process, and can also ascertain the self-inductance of bump bond(s) between chips. The structures and methods leverage a behavioral property of superconducting DC SQUIDs to modulate a critical current upon injection of magnetic flux in the SQUID loop, which behavior is not present when the SQUID is not superconducting, by including bump bond(s) within the loop, which loop is split among chips. The sensitivity of the bump bond superconductivity verification is therefore effectively perfect, independent of any multi-milliohm noise floor that may exist in measurement equipment.

A centrifugal fan allows good or inferior condition of soldering on the back surface of a circuit board to be visually inspected, includes a secondary casing 130, the secondary casing 130 including a connector housing 190 having opening portion 191 at a lateral side thereof and a connector pin 192 embedded thereinside, wherein one end of the connector pin 192 protrudes inside of the connector housing 190, and the other end of the connector pin 192 penetrates the circuit board 135 and is soldered to the circuit board 135, thereby forming solder fillets 195a and 195b between the front and back surfaces of the circuit board 135 and the connector pin 192, a gap 139 is arranged between the secondary casing 130 and the part of the circuit board 135 where connector pin 192 penetrates, a through hole for visual inspection is arranged in a bottom wall portion of the secondary casing so as to see the fillet formed between the back surface of the circuit board and the connector pin.