Techniques are described herein that are capable of providing a modularized acoustic probe that includes multiple acoustic transducers that have discrete substrates. A first acoustic transducer is configured to generate an acoustic signal and to transmit the acoustic signal toward an object. The second acoustic transducer is configured to detect a reflected acoustic signal, which results from the acoustic signal reflecting from the object, and to convert the reflected acoustic signal to an electrical signal. The first and second acoustic transducers have respective discrete substrates. In an example, the second acoustic transducer may not be configured to generate acoustic signals. In another example, the first and second acoustic transducers may be in respective first and second rows of a two-row transducer array. In accordance with this example, the first and second acoustic transducers may be designed to have an acoustic parameter having respective first and second parameter values.

A hand-held ultrasound device, for placement on a subject, includes a semiconductor device and a housing to support the semiconductor device. The semiconductor device includes: a plurality of ultrasonic transducer elements; a plurality of pulsers coupled to the plurality of ultrasonic transducer elements; a plurality of waveform generators configured to drive the plurality of pulsers; receive processing circuitry configured to process ultrasound signals received by the plurality of ultrasonic transducer elements; and a plurality of independently controllable registers configured to store a plurality of different parameters for the waveform generators.

A system for coherence imaging may receive ultrasound signals each having a respective delay associated with a respective ultrasonic transducer element in an ultrasonic transducer array. The system may obtain an approximation of the auto-correlation of ultrasound signals without any auto-correlation calculation, and determine the output image based on the approximation. In approximating the auto-correlation, the system may group the ultrasound signals into multiple portions, each corresponding to a respective sub-aperture of a plurality of sub-apertures of the ultrasonic transducer array. The system may determine a coherent sum of signals for each sub-aperture, perform a square operation or magnitude square operation over the coherent sum to obtain resulting data, normalize the resulting data, and sum the resulting data for all of the sub-apertures to generate the output image. A sub-aperture in the plurality of sub-apertures may overlap with another sub-aperture.

A 3D ultrasonic diagnostic imaging system produces 3D display images at a 3D frame rate of display which is equal to the acquisition rate of a 3D image dataset. The volumetric region being imaged is sparsely sub-sampled by separated scanning beams. Spatial locations between the beams are filled in with interpolated values or interleaved with acquired data values from other 3D scanning intervals depending upon the existence of motion in the image field. A plurality of different beam scanning patterns are used, different ones of which have different spatial locations where beams are located and beams are omitted. In a preferred embodiment the determination of motion and the consequent decision to use interpolated or interleaved data for display is determined on a pixel-by-pixel basis.

An ultrasound device for use with various types of imaging. In some embodiments, the ultrasound device may comprise a circuitry substrate and a plurality of transducer chips coupled to the circuitry substrate. In some embodiments, each transducer chip may comprise a microelectromechanical systems (MEMS) component that may include a plurality of ultrasound elements closely packed with one another, an Application-Specific Integrated Circuit (ASIC) that may be operatively coupled to the plurality of ultrasound elements of said MEMS component, and a control unit that may be electrically coupled to each ASIC of the plurality of transducer chips for control thereof. In some embodiments, at least two transducer chips of the plurality of transducer chips may be placed on the circuitry substrate with a separation distance that may be less than an operational wavelength of the ultrasound elements of the MEMS components of said at least two transducer chips.

In a chip-on-array approach, acoustic and electronic modules are separately formed. The acoustic stack is connected to one interposer, and the electronics are connected to another interposer. Different connection processes (e.g., using low temperature bonding for the acoustic stack and higher temperature-based interconnect for the electronics) may be used. This arrangement may allow for different pitches of the transducer elements and the I/O of the electronics by staggering vias in the interposers. The two interposers are then connected to form the chip-on-array.

Provided are an ultrasound system, an ultrasound probe, a control method of the ultrasound system, and a control method of the ultrasound probe capable of using various types of display terminals and causing the display terminal to perform processing according to computing power of the display terminal to be used.

An ultrasound system includes a display terminal and an ultrasound probe. The ultrasound probe has a reception circuit that generates a sound ray signal from a reception signal output from an oscillator array, an image generation unit that generates ultrasound image data from the sound ray signal, and a data selection unit that selects one of the ultrasound image data and intermediate data generated in a middle of generating the ultrasound image data, according to computing power of the display terminal, as data to be output to the display terminal. The display terminal to which the intermediate data is input generates the ultrasound image data from the intermediate data and displays an ultrasound image based on the ultrasound image data on the monitor.

An ultrasound probe contains an array transducer and a microbeamformer coupled to elements of the array. The microbeamformer comprises one or more analog ASICs containing transmitters and amplifiers coupled to transducer elements, and one or more digital ASICs containing analog to digital converters and digital beamforming circuitry. The analog ASICs and the digital ASICs are manufactured by different integrated circuit 5 processes, with that of the analog ASIC optimized for high voltage analog operation and that of the digital ASICs optimized for high density, low voltage digital circuitry.

An ultrasound probe contains an array transducer coupled to a digital microbeamformer. The digital microbeamformer is capable of producing delayed echo signals which are a delayed by a fraction of a clock cycle of received digital echo signals. The fractional delay is produced by an FIR filter which conserves power by weighting digital echo signals without the use of digital multipliers.

The method of bonding an interposer and an integrated circuit chip includes preparing an interposer including an insulator and conductive lines each having one end exposed to a first surface of the insulator and another end exposed to a second surface opposite to the first surface; placing a bonding mask on the interposer; forming through-holes on the bonding mask before or after the placing of the bonding mask on the interposer; filling the plurality with a conductive material; and bonding an integrated circuit chip to the bonding mask.