An ultrasonic fingerprint sensing method includes: generating a first ultrasonic wave using a first frequency; receiving a first signal generated by reflection of the first ultrasonic wave from each of a ridge and a valley of a fingerprint; generating a first image based on the first signal; comparing the first image with a registered reference image to generate a matching score; and in response to the matching score being less than a threshold value, generating a second image using a second frequency.

An ultrasonic fingerprint sensing method includes: generating a first ultrasonic wave using a first frequency; receiving a first signal generated by reflection of the first ultrasonic wave from each of a ridge and a valley of a fingerprint; generating a first image based on the first signal; comparing the first image with a registered reference image to generate a matching score; and in response to the matching score being less than a threshold value, generating a second image using a second frequency.

A photoacoustic apparatus may include: a ring transducer configured to measure a photoacoustic signal generated from an object, and including a hollow space that is provided as a travel path of light and ultrasonic waves; a mirror part disposed along a light path of the light transmitted from the ring transducer, and configured to reflect the light transmitted from the ring transducer, and the ultrasonic waves generated from the object, and to adjust magnification of the mirror part according to a number of apertures of the photoacoustic apparatus; and a fluid tank including a transparent film that allows the photoacoustic signal to pass through the fluid tank, and accommodating a fluid, the ring transducer, and the mirror part inside the fluid tank.

Described are transducer assemblies and imaging devices comprising: a microelectromechanical systems (MEMS) die including a plurality of piezoelectric elements; a complementary metal-oxide-semiconductor (CMOS) die electrically coupled to the MEMS die by a first plurality of bumps and including at least one circuit for controlling the plurality of piezoelectric elements; and a package secured to the CMOS die by an adhesive layer and electrically connected to the CMOS die.

An ultrasound probe comprises an optical light guide comprising a multi-mode optical waveguide for transmitting excitation light and a single-mode optical waveguide for transmitting interrogation light. The probe further comprises an ultrasound transmitter located at a distal end of the probe, the ultrasound transmitter comprising an optically absorbing material for absorbing the excitation light from the multi-mode optical waveguide to generate an ultrasound beam via the photoacoustic effect. The probe further comprises an ultrasound receiver including an optical cavity external to the single-mode optical waveguide. The interrogation light from the single-mode optical waveguide is provided to the ultrasound receiver. The optical cavity has a reflectivity that is modulated by impinging ultrasound waves. The interrogation light is reflected from the optical cavity to a proximal end of the single-mode optical waveguide where it can be received for generating a signal. At least a portion of the ultrasound probe is configured to rotate so that the ultrasound beam is transmitted in a rotating direction.

A guidewire providing imaging and light for photoactivation of therapeutic agents. Using optical fibers with Bragg gratings, electromagnetic waves are coupled to photoacoustic materials thereby providing acoustic energy for imaging tissues. The reflected acoustic waves can be sensed with photoreflective materials coupled to different optical fibers. Additional optical fibers allow photoactivated therapeutics to be activated in proximity to the imaged tissues. The photoactivated therapeutics may be administered intravenously or with a drug-delivery catheter.

Described are transducer assemblies and imaging devices comprising: a microelectromechanical systems (MEMS) die including a plurality of piezoelectric elements; a complementary metal-oxide-semiconductor (CMOS) die electrically coupled to the MEMS die by a first plurality of bumps and including at least one circuit for controlling the plurality of piezoelectric elements; and a package secured to the CMOS die by an adhesive layer and electrically connected to the CMOS die.

A transducer assembly includes: a microelectromechanical systems (MEMS) die including a plurality of piezoelectric elements; a complementary metal-oxide-semiconductor (CMOS) die electrically coupled to the MEMS die by a first plurality of bumps and including at least one circuit for controlling the plurality of piezoelectric elements; and a package secured to the CMOS die by an adhesive layer and electrically connected to the CMOS die.

Provided herein are imaging systems such as a system for quantitative tomography and a laser optoacoustic ultrasonic imaging system assembly (LOUISA) for imaging a tissue region, for example, a breast, in a subject. Generally, the system components are a laser that emits instant pulses of laser light in a wavelength cycling mode, fiberoptic bundles or optical arc-shaped fiber bundles configured to deliver laser light, an imaging module with an imaging tank, an optoacoustic array(s) of ultrawide-band ultrasonic transducers and ultrasound array(s) of ultrasonic transducers and a coupling medium and an electronics subsystem. Also provided is a method for imaging quantitative functional parameters and/or molecular parameters and anatomical structures in a volumetric tissue region of interest, such as a breast, in a subject utilizing the system for quantitative tomography.

Aspects of the technology described herein relate to a pipeline configured to pipeline ultrasound signals from multiple analog front-ends (AFEs) to a digital portion of an ultrasound processing unit. The ultrasound signals may be digital ultrasound signals from analog-to-digital converters of the multiple AFEs. The pipeline may include first pipelining circuitry in a first AFE and second pipelining circuitry in a second AFE. The first pipelining circuitry may be configured to output a first digital ultrasound signal from the first pipelining circuitry to the digital portion of the UPU, receive a second digital ultrasound signal from second pipelining circuitry, and output the second digital ultrasound signal from the first pipelining circuitry to the digital portion of the UPU. De-interleaving circuitry may be coupled to the first pipelining circuitry and configured to de-interleave the first digital ultrasound signal and the second digital ultrasound signal outputted by the first pipelining circuitry.