G01T1/20181

RADIATION IMAGE DETECTOR
20210223412 · 2021-07-22 · ·

Provided is a radiation image detector, including: a substrate; a continued radiation conversion layer configured to convert radiation into visible light; an optical image detector on the substrate and between the radiation conversion layer and the substrate, wherein the optical image detector comprises an array of photosensitive pixels; a light-shielding structure located on a side of the plurality of photosensitive pixels facing away from the substrate, wherein the light-shielding structure has a plurality of openings to allow the visible light to reach the photosensitive pixels; and a light-collecting structure located between the radiation conversion layer and the light-shielding structure and comprising a plurality of convex lenses, wherein each convex lens has its optical axis perpendicular to the light-shielding structure and passing through one of the plurality of openings.

MODULAR PET DETECTOR
20210223414 · 2021-07-22 ·

A gamma-ray detector includes a plurality of modular one-dimensional arrays of monolithic detector sub-modules. Each monolithic detector sub-module includes a scintillator layer, a light-spreading layer, and a photodetector layer. The photodetector layer comprises a two-dimensional array of photodetectors that are arranged in columns and rows. A common printed circuit board is electrically coupled to the photodetectors of the monolithic detector sub-modules of a corresponding modular one-dimensional array. The photodetectors can be electrically coupled in a split-row configuration or in a checkerboard configuration. The photodetectors can also have a differential readout.

Radiation detector scintillator with an integral through-hole interconnect
11041966 · 2021-06-22 · ·

A scintillator layer (206) includes a plurality of scintillator pixels (337), walls of non-scintillation material (336) surrounding each of the plurality of scintillator pixels, and at least one electrically conductive interconnect (224) for a pixel, wherein the at least one electrically conductive interconnect extends within a wall of the pixel along an entire depth of the wall. A multi-energy detector array (114) includes a detector tile (116) with an upper scintillator layer (202), an upper photosensor (204) optically coupled to the upper scintillator layer, a lower scintillator layer (206) electrically coupled to the upper photosensor, and a lower photodetector (208) optically and electrically coupled to the lower scintillator layer. The lower scintillator layer includes at least one scintillator pixel (337) surrounded by at least one wall of non-scintillation material (336), and the wall includes at least one electrically conductive interconnect (224) that extends from a top edge of the wall to a bottom edge of the wall.

Imaging devices

An imaging device includes: a first scintillator layer; an array of detector elements, wherein the array of detector elements comprises a first detector element; a second scintillator layer configured to receive radiation after the radiation has passed through the first scintillator layer and the array of detector elements, wherein the array of detector elements is located between the first scintillator layer and the second scintillator layer; a first electrode located closer to the first scintillator than the second scintillator; and a second electrode situated between the second scintillator and the first detector element; the first detector element configured to generate a first electrical signal in response to light from the first scintillator layer, and to generate a second electrical signal in response to light from the second scintillator layer; the second electrode configured to allow the light from the second scintillator layer to reach the first detector element.

Data processing apparatus, data processing method, and non-transitory computer-readable storage medium for storing data processing program
11846737 · 2023-12-19 · ·

A data processing apparatus according to an embodiment includes acquisition circuitry and specification circuitry. The acquisition circuitry is configured to acquire a detector signal containing a first component that is based on Cherenkov light and a second component that is based on scintillation light. The specification circuitry is configured to specify timing information about generation of the detector signal by curve fitting to the first component.

Handheld Backscatter Scanning Systems With Different Detector Panel Configurations
20210132239 · 2021-05-06 ·

The present specification provides a detector for an X-ray imaging system. The detector includes at least one high resolution layer having high resolution wavelength-shifting optical fibers, each fiber occupying a distinct region of the detector, at least one low resolution layer with low resolution regions, and a single segmented multi-channel photo-multiplier tube for coupling signals obtained from the high resolution fibers and the low resolution regions.

RADIATION IMAGING APPARATUS AND RADIATION IMAGING SYSTEM
20210132240 · 2021-05-06 ·

A radiation imaging apparatus including: a first scintillator layer configured to convert a radiation (R) which has entered the first scintillator layer into light; a second scintillator layer configured to convert a radiation transmitted through the first scintillator layer into light; a fiber optic plate (FOP) provided between the first scintillator layer and the second scintillator layer; and an imaging portion configured to convert the light generated in the first scintillator layer and the light generated in the second scintillator layer into an electric signal.

DETECTOR MODULES, DETECTORS AND MEDICAL IMAGING DEVICES
20210072410 · 2021-03-11 ·

Detector modules, detectors and medical imaging devices are provided. One of the detector modules includes: a support and a plurality of detector sub-modules arranged on the support along an extension direction in which the support extends. Each of the detector sub-modules has a first area and a second area in the extension direction. A detecting device is disposed in the first area, and a functional module is disposed in the second area. The functional module is electrically connected to the detecting device for receiving an electrical signal from the detecting device. The plurality of detector sub-modules includes a first detector sub-module and a second detector sub-module that are arranged adjacent to each other in the extension direction, and the first area of the first detector sub-module at least partially overlaps with the second area of the second detector sub-module.

Bragg peak detector using scintillators and method of operating the same
10926111 · 2021-02-23 · ·

Provided is a real-time detector of a Bragg peak, comprising: an emitter configured to emit a particle beam toward a target region in a first direction, thereby creating emission of electromagnetic radiation in the target region; a first detection module comprising a stack of first scintillators and first photosensors respectively connected to the first scintillators and configured to detect the electromagnetic radiation and convert into a first signal; a second detection module comprising a stack of second scintillators and second photosensors respectively connected to the second scintillators and configured to detect the electromagnetic radiation and convert into a second signal; and a coincidence detection circuit configured to determine an end point of the particle beam with respect to the first direction based on the first signal and the second signal.

RADIATION DETECTOR, RADIOGRAPHIC IMAGING APPARATUS, AND MANUFACTURING METHOD
20210215836 · 2021-07-15 · ·

Provided is a radiation detector including a substrate including a sensor unit layer having a plurality of pixels for accumulating electric charges generated depending on light converted from radiation in a pixel region of a flexible base material; a conversion layer that is provided on a surface side of the base material provided with the pixel region to convert the radiation into light; and a fixing member that is provided closer to the substrate side than the conversion layer to fix the sensor unit layer to the base material.