There are provided a radiation detector module, a radiation detector, and a radiographic imaging apparatus which make it possible to increase the row number while suppressing a length in a body-axis direction. The radiation detector module includes a detector substrate on which a scintillator, a photodiode, and AD conversion chips are loaded, and a control substrate which supplies power to the detector substrate and controls the operation of an AD conversion unit (AFE) of each AD conversion chip of the detector substrate. The plurality of radiation detector modules configure a radiation detector which suppresses the length in the body-axis direction by connecting together the two substrates so as to form a two-stage structure by stacking connectors.

The present disclosure relates to the use of X-ray detector cassettes that may be abutted or overlapped to form a detector assembly suitable for imaging objects that are too large to image using a single X-ray detector cassette. Such a detector assembly may be customized in terms of the size and/or shape of the field-of-view (FOV). In certain embodiments the radiation-sensitive electronics (e.g., readout electronics) are positioned to the side of the X-ray detecting components (e.g., scintillator, TFT array, and so forth), allowing the cassette to be thin relative to other detector devices and allowing the electronics to remain outside the X-ray beam path.

The invention concerns a scintillation detector with which high count rates and/or high resolutions are possible. The scintillator of the claimed scintillation detector is formed from pixels (2), which are separated from each other by interstices (4). Alternatively or additionally, the surface of the scintillator is divided by grooves into pixels (2). Such a structure enables not only a particularly high resolution. When multiple detector modules are used, it also allows high count rates in the range of roughly 20 MHz.

A radiation counting device is provided that includes a scintillator, a pixel circuit, and an analog-to-digital conversion circuit. In the radiation counting device, the scintillator generates a photon when radiation is incident. In the radiation counting device, the pixel circuit converts the photon into charge, stores the charge over a predetermined period, and generates an analog voltage in accordance with the amount of stored charge. In the radiation counting device, the analog-to-digital conversion circuit converts the analog voltage into a digital signal in a predetermined quantization unit less than the analog voltage generated from the one photon.

This disclosure describes an imaging radiation detection module with novel configuration of the scintillator sensor allowing for simultaneous optimization of the two key parameters: detection efficiency and spatial resolution, that typically cannot be achieved. The disclosed device is also improving response uniformity across the whole detector module, and especially in the edge regions. This is achieved by constructing the scintillation modules as hybrid structures with continuous (also referred to as monolithic) scintillator plate(s) and pixellated scintillator array(s) that are optically coupled to each other and to the photodetector. There are two basic embodiments of the novel hybrid structure: (1) the monolithic scintillator plate is at the entrance for the incoming radiation, preferably gamma rays, and the pixellated array placed behind the plate, all in optical contact with the photodetector, (2) the order of the scintillator components is reversed with the pixellated scintillation plate placed in front of the monolithic plate.

A photon detector includes a sensor array of optical sensors disposed in a plane and four substantially identical scintillation crystal bars. Each optical sensor is configured to sense luminescence. Each of the four scintillator crystal bars being a rectangular prism with four side surfaces and first and second end surfaces, each scintillation bar has two side surfaces which each face a side surface of another scintillation bar, and each scintillation crystal bar generating a light scintillation in response to interacting with a received gamma photon. A first layer (80) is disposed in a first plane disposed between and adjacent facing side surfaces of the four substantially identical scintillation crystal bars with a light sharing portion (82) adjacent the first end surface and a reflective portion (84) adjacent the second end surface. A second layer (68) is disposed in a second plane orthogonal to the first plane and disposed between and adjacent facing side surfaces of the four substantially identical scintillation crystal bars with a light sharing portion (88) adjacent the second end surface and a reflective portion (90) adjacent the first end surface.

Various methods and systems are provided for an imaging detector array. In one example, a detector module of the array has a central slit separating a first tile from a second tile of the detector module. An integrated circuit is located along a first side of the first tile and along a first side of the second tile and flex cable coupled to the integrated circuit of the first portion extends through the central slit of the detector module.

The present approaches relate to the fabrication of non-rectangular (e.g., non-square) light imager panels having comparable active areas to rectangular light imager panels but manufactured using fewer c-Si wafers. Such light imager panels may be generally squircle shaped (e.g., a square or rectangle with one or more rounded corners and may be manufactured using conventional crystalline silicon (c-Si) wafers, such as 8″ wafers.

Fabrication and use of an X-ray detector scan interface having separate enable and reset lines for each line (e.g., row) of pixels is described. In certain implementations, the respective enable and reset lines are connected such that activation of an enable line for a given line of pixels is concurrent with activation of a reset line for a different (e.g., preceding) row of pixels. In this manner, readout of one row of pixels is performed in conjunction with resetting the row of pixels readout in the preceding operation. In another technical implementation, a non-rectangular detector is divided into quadrants, with alternating quadrants configured for scan module or data module operations such that no quadrant has overlapping scan and data interconnections at the connection finger regions.

Disclosed herein is a method for forming a radiation detector. The method comprises forming a radiation absorption layer and bonding an electronics layer to the radiation absorption layer. The electronics layer comprises an electronic system configured to process electrical signals generated in the radiation absorption layer upon absorbing radiation photons. The method for forming the radiation absorption layer comprises forming a trench into a first surface of a semiconductor substrate; doping a sidewall of the trench; forming a first electrical contact on the first surface; forming a second electrical contact on a second surface of the semiconductor substrate. The second surface is opposite the first surface. The method further comprises dicing the semiconductor substrate along the trench.