The present approaches relate to the fabrication of non-rectangular (e.g., non-square) light imager panels having comparable active areas to rectangular light imager panels but manufactured using fewer c-Si wafers. Such light imager panels may be generally squircle shaped (e.g., a square or rectangle with one or more rounded corners and may be manufactured using conventional crystalline silicon (c-Si) wafers, such as 8″ wafers.

An imaging system is provided. A method for installing the imaging system is provided. The imaging system may include a first modality imaging apparatus. The first modality imaging apparatus may have a detector including a scintillator unit, a photodetector unit, a circuit unit, a supporting block, and a supporting board. The supporting block may be disposed on an end of the scintillator unit. The supporting board may be disposed between the photodetector unit and the circuit unit.

The present disclosure relates to a system for imaging. The system may include a supporting assembly and a detector assembly. The supporting assembly may include a detection region to accommodate a subject. The detector assembly may surround the detection region. The detector assembly may be configured to detect radiation rays emitted from the subject located within the detection region. The detector assembly may include a plurality of detector rings. Each detector ring may include a scintillator array and a plurality of photosensors. The plurality of detector rings may be arranged on the supporting assembly in an axial direction of the supporting assembly to form an axial field of view (FOV) having a length no less than 0.75 meters.

A PET scanner includes a ring of detector modules encircling an imaging region. Each of the detector modules includes one or more sensor avalanche photodiodes (APDs) that are biased in a breakdown region in a Geiger mode. The sensor APDs output pulses in response to light from a scintillator corresponding to incident photons. A reference APD also biased in a breakdown region in a Geiger mode is optically shielded from light and outputs a voltage that is measured by an analog to digital converter. Based on the measurement, a bias control feedback loop directs a variable voltage generator to adjust a bias voltage applied to the APDs such that a difference between a voltage of a breakdown pulse and a preselected logic voltage level is minimized.

Detector module designs for radiographic include first and second layers of scintillator rods or pixel arrays oriented in first and second directions. The first and second directions are transversely oriented to define a light sharing region between the first and second layers. Encoding features may be disposed in, on or between the first and second layers, and configured to modulate propagation of optical signals therealong or therebetween.

Detector module designs for radiographic imaging include first and second layers of scintillator rods or pixel arrays oriented in first and second directions. The first and second directions are transversely oriented to define a light sharing region between the first and second layers. Encoding features may be disposed in, on or between the first and second layers, and configured to modulate propagation of optical signals therealong or therebetween.

A gamma-ray detector includes a plurality of modular one-dimensional arrays of monolithic detector sub-modules. Each monolithic detector sub-module includes a scintillator layer, a light-spreading layer, and a photodetector layer. The photodetector layer comprises a two-dimensional array of photodetectors that are arranged in columns and rows. A common printed circuit board is electrically coupled to the photodetectors of the monolithic detector sub-modules of a corresponding modular one-dimensional array. The photodetectors can be electrically coupled in a split-row configuration or in a checkerboard configuration. The photodetectors can also have a differential readout.

A scintillator layer (206) includes a plurality of scintillator pixels (337), walls of non-scintillation material (336) surrounding each of the plurality of scintillator pixels, and at least one electrically conductive interconnect (224) for a pixel, wherein the at least one electrically conductive interconnect extends within a wall of the pixel along an entire depth of the wall. A multi-energy detector array (114) includes a detector tile (116) with an upper scintillator layer (202), an upper photosensor (204) optically coupled to the upper scintillator layer, a lower scintillator layer (206) electrically coupled to the upper photosensor, and a lower photodetector (208) optically and electrically coupled to the lower scintillator layer. The lower scintillator layer includes at least one scintillator pixel (337) surrounded by at least one wall of non-scintillation material (336), and the wall includes at least one electrically conductive interconnect (224) that extends from a top edge of the wall to a bottom edge of the wall.

Various methods and systems are provided for an imaging detector array. In one example, a detector module of the array has a central slit separating a first tile from a second tile of the detector module. An integrated circuit is located along a first side of the first tile and along a first side of the second tile and flex cable coupled to the integrated circuit of the first portion extends through the central slit of the detector module.

An imaging system is provided. A method for installing the imaging system is provided. The imaging system may include a first modality imaging apparatus. The first modality imaging apparatus may have a detector including a scintillator unit, a photodetector unit, a circuit unit, a supporting block, and a supporting board. The supporting block may be disposed on an end of the scintillator unit. The supporting board may be disposed between the photodetector unit and the circuit unit.