Embodiments of the present disclosure provide a flat panel detector and a method of manufacturing the same. The flat panel detector includes: a conversion layer configured to convert rays into a light having a first wavelength; and a plurality of imaging units. At least one of the imaging units includes: a photo sensor configured for receiving the light and converting the light to an electrical signal; and a light guider located a side of the photo sensor adjacent to the ray conversion layer, the light guider having a light entry surface adjacent to the ray conversion layer and a light exit surface adjacent to the photo sensor, the light entry surface being configured to receive the light from the ray conversion layer and having an area greater than an area of the light exit surface, and an orthogonal projection of the light exit surface in a direction perpendicular to the ray conversion layer at least partially overlapping that of the photo sensor.

A radiation detector includes an array of detector pixels each including an array of detector cells. Each detector cell includes a photodiode biased in a breakdown region and digital circuitry coupled with the photodiode and configured to output a first digital value in a quiescent state and a second digital value responsive to photon detection by the photodiode. Digital triggering circuitry is configured to output a trigger signal indicative of a start of an integration time period responsive to a selected number of one or more of the detector cells transitioning from the first digital value to the second digital value. Readout digital circuitry accumulates a count of a number of transitions of detector cells of the array of detector cells from the first digital state to the second digital state over the integration time period.

The present disclosure relates to an X-ray detector. The X-ray detector includes the first and second gate lines arranged to be spaced apart from each other on a substrate, a data line and a bias line that are arranged to be spaced apart from each other in a direction intersecting the first and second gate lines, and define a unit pixel area, a storage capacitor that is arranged in the unit pixel area and has one end connected to a ground, a phototransistor that is turned on by a reset signal applied to the first gate line and provides a signal generated by an incident light source to the storage capacitor, and a thin film transistor that is turned on by a gate signal applied to the second gate line to provide a charge stored in the storage capacitor to the data line.

A radiation detector module including a scintillator element configured to generate optical signals in response to incident radiation. A photodetector is coupled to at least a first surface of the scintillator element, the photodetector configured to convert the optical signals into output characterizing the radiation. An acoustic array is coupled to at least a second surface of the scintillator element, the acoustic array configured to convert acoustic signals generated in the scintillator element into output characterizing acoustic energy deposited therein.

An apparatus (e.g., an imaging system) includes a circuit, including: a p-i-n diode having a cathode coupled to a cathode bias voltage or ground; a charge transistor having a first source/drain terminal coupled to an anode of the diode; a storage capacitor having a first terminal coupled to a second source/drain terminal of the charge transistor and a second terminal coupled to the cathode; an amplification transistor having a gate terminal coupled to the first terminal of the storage capacitor and a first source/drain terminal coupled to a reference voltage; a read transistor having a first source/drain terminal coupled to a second source/drain terminal of the amplification transistor; a data line having a first terminal coupled to a second source/drain terminal of the read transistor; and a readout circuit coupled to a second terminal of the data line, providing an output voltage corresponding to charge on the storage capacitor.

An X-ray detector includes a detection unit to convert X-rays into a signal value and an evaluation unit. The detection unit and the evaluation unit are configured in a common component, the extent of the component along a first direction being not greater than the extent of the detection unit. The evaluation unit includes at least one correction unit to correct the signal values, a computation unit to control the correction, and a memory unit to store at least one correction parameter. The evaluation unit is designed such that the signal values are corrected as a function of the at least one correction parameter. A method and detector group are also disclosed.

A detection panel and a manufacturing method of the same are provided. The detection panel includes: a photosensitive element configured to sense a first light beam incident to the photosensitive element to generate a photosensitive signal; a drive circuit configured to be coupled to the photosensitive element to acquire the photosensitive signal from the photosensitive element, the drive circuit including a switch element; and a reflective grating which is on a side of the drive circuit where the first light beam is incident, and is configured to reflect at least a portion of the first light beam incident toward the switch element.

A radiation imaging apparatus is provided. The apparatus includes a substrate in which conversion elements are arranged and which transmits light beams, a first scintillator arranged on a first surface side of the substrate, and a second scintillator arranged on a second surface side opposite to the first surface. The conversion elements include first conversion elements and second conversion elements. The first conversion elements are arranged so as to receive light beams from the first scintillator and the second scintillator. A light-shielding layer is arranged between the first scintillator and each of the second conversion elements so as to set light amounts of the second conversion elements from the first scintillator smaller than those of the first conversion elements from the first scintillator, and the second conversion elements are arranged to receive a light beam from the second scintillator.

A radiation counting device is provided that includes a scintillator, a pixel circuit, and an analog-to-digital conversion circuit. In the radiation counting device, the scintillator generates a photon when radiation is incident. In the radiation counting device, the pixel circuit converts the photon into charge, stores the charge over a predetermined period, and generates an analog voltage in accordance with the amount of stored charge. In the radiation counting device, the analog-to-digital conversion circuit converts the analog voltage into a digital signal in a predetermined quantization unit less than the analog voltage generated from the one photon.

An active matrix substrate includes a photoelectric conversion element 12, a first planarizing film 107, a first inorganic insulating film 108a, and a bias wire 16. The first planarizing film 107 covers the photoelectric conversion element 12 and has a first opening 107h at a position at which the first opening 107h overlaps with the photoelectric conversion element 12 in plan view. The first inorganic insulating film 108a has a second opening on an inner side of the first opening h and covers a surface of the first planarizing film 107. The bias wire 16 is provided on a first inorganic insulating film 108a and is connected to the photoelectric conversion element 12 via the second opening CH2.