According to one embodiment, a radiation detector includes a base body, a first radiation detection element, and a second radiation detection element. The base body includes a first surface. The first surface includes first and second partial regions. A first direction from the first partial region toward the second partial region is along the first surface. The first radiation detection element is fixable to the first partial region. The second radiation detection element includes a first detecting part fixable to the second partial region. The first detecting part includes first and second end portions. A second direction from the first end portion toward the second end portion crosses the first surface. The second end portion is between the first end portion and the second partial region in the second direction. The first radiation detection element does not overlap the first end portion in the first direction.

Techniques are provided for x-ray sensing for intraoral tomography. A methodology implementing the techniques according to an embodiment includes detecting an x-ray pulse based on energy received at one or more pixels of a pixel array. The method also includes integrating the energy received at each of the pixels of the array of pixels, in response to the detection, wherein the energy received at each of the pixels is associated with the x-ray pulse. The method further includes multiplexing readouts of analog signals from the array of pixels into two or more parallel channels. The method further includes simultaneously converting (or otherwise in parallel) the analog signals of each of the channels into digital signals and storing the digital signals in memory as frames of data. The method may further include, for example, transmitting the frames of data from the memory, over a Universal Serial Bus, to an imaging system.

A manufacturing method of a radiation imaging apparatus is provided. The radiation imaging apparatus includes a sensor substrate and a scintillator that are bonded by a bonding member. The manufacturing method includes: preparing a support substrate on which the scintillator has been formed; bonding the sensor substrate and the scintillator via the bonding member; and separating the support substrate after the bonding. The bonding is performed under reduced pressure.

A radiation detector according to an embodiment of the disclosure includes a substrate, a plurality of pixels arranged on the substrate, the plurality of pixels each including a switching element and a photoelectric conversion element, a scintillator arranged to cover the photoelectric conversion element of each of the plurality of pixels, and a storage device configured to store inspection image data acquired by irradiating the plurality of pixels with visible light before forming the scintillator or a calibration parameter based on the inspection image data.

Provided is a technique of image pickup without being affected by leakage current on an active matrix substrate that includes photoelectric conversion elements. An active matrix substrate 1 includes photoelectric conversion elements that are respectively provided with respect to a plurality of pixels defined by gate lines and data lines 10, and a bias line 13 supplying a bias voltage to each photoelectric conversion element. Further, the active matrix substrate 1 further includes a plurality of data protection circuit units 16a that are connected with the data lines 10, respectively, and a first common line 17a that is connected with the data protection circuits 16a and has a potential equal to or lower than those of the data lines 10, outside the image pickup area composed of a plurality of pixels. The data protection circuit unit 16a includes a first data non-linear element 161a, and the first data non-linear element 161a is connected in a reverse bias state between the first common line 17a and the data lines 10.

Among other things, a detector unit for a detector array of a radiation imaging modality is provided. In some embodiments, the detector unit comprises a radiation detection sub-assembly and an electronics sub-assembly. The electronics sub-assembly comprises electronic circuitry, embedded within a molding compound, configured to digitize analog signals yielded from the radiation detection sub-assembly and/or to otherwise process such analog signals. The electronics sub-assembly also comprises a substrate, such as a printed circuit board, configured to route signals between the electronic circuitry and a photodetector array of the radiation detection sub-assembly and/or to route signals between the electronic circuitry and digital processing components, such as an image generator, for example.

The present specification describes an improved multi-energy radiation detector. In one embodiment, the signal generated by the detection medium is converted to digital form directly at the point of signal collection. This avoids the need for power intensive high bandwidth amplifiers and analog-to-digital converters, as it integrates the sensing device and signal processing onto the same silicon substrate to reduce the number of components in the system. In one embodiment, a single photon avalanche diode (SPAD) is coupled directly to a threshold detector to achieve an intrinsically low power and low noise detector.

A detector detects at least one neutron. The detector includes at least one thin absorption layer each including an absorption material for absorbing the neutron and then radioactively decaying into energetic byproducts. The detector includes at least one emission layer each including a solid scintillation material for converting the energetic byproducts into photons. The detector includes a sensor for detecting the photons.

An apparatus for detecting radiation for obtaining density information of a structure, the apparatus including: at least one detector (10), the detector (10) including: a scintillator (12) including a scintillating material for emitting light in response to incident radiation (14), and a photodetector (16) for receiving light emitted by the scintillating material (12) and outputting an electrical signal in response to light received from the scintillating material (12), wherein the photodetector (16) includes at least one silicon photomultiplier (16a). The invention reduces the volume of the apparatus and therefore provides particular advantages for use in scanning pipelines and other structures located deep subsea.

Embodiments include a device, comprising: a column line; a plurality of pixels; each pixel coupled to the column line; a comparator having an input coupled to the column line and configured to compare a signal from the column line to a threshold; and control logic coupled to the pixels and configured to selectively couple each pixel to the column line after a sampling period for each pixel.