A radiation detector including: a substrate formed with plural pixels that accumulate electrical charges generated in response to light converted from radiation in a pixel region at an opposite-side surface of a base member to a surface including a fine particle layer; the base member being flexible and is made of resin and that includes a fine particle layer containing inorganic fine particles having a mean particle size of from 0.05 μm to 2.5 μm, a conversion layer provided at the surface of the base member provided with the pixel region and configured to convert the radiation into light; and a reinforcement substrate provided to at least one out of a surface on the substrate side of a stacked body configured by stacking the substrate and the conversion layer, or a surface on the conversion layer side of the stacked body.

Detection substrate, detection panel and photoelectric detection device are provided. The detection substrate includes: a detection region and a non-detection region surrounding the detection region, wherein the detection region includes a plurality of detection units in an array and a plurality of bias voltage lines; each of the detection units includes: a driving circuit, and a photoelectric conversion circuit electrically connected with the driving circuit; wherein the bias voltage lines are electrically connected with the photoelectric conversion circuits; the non-detection region comprises: input terminals electrically connected with the bias voltage lines, and voltage compensation circuits electrically connected between the input terminals and the bias voltage lines; and the voltage compensation circuits are configured to offset a voltage generated by the photoelectric conversion circuits under ambient light in a manufacturing process of the detection substrate.

Some embodiments include a method, comprising: attaching a carrier substrate to a side of at least one semiconductor substrate, the at least one semiconductor substrate including photodetectors on the side; thinning the at least one semiconductor substrate while the at least one semiconductor substrate is attached to the carrier substrate; attaching an optical substrate to the at least one semiconductor substrate while the at least one semiconductor substrate is attached to the carrier substrate; and removing the carrier substrate from the at least one semiconductor substrate.

A radiation imaging apparatus including: a first scintillator layer configured to convert a radiation (R) which has entered the first scintillator layer into light; a second scintillator layer configured to convert a radiation transmitted through the first scintillator layer into light; a fiber optic plate (FOP) provided between the first scintillator layer and the second scintillator layer; and an imaging portion configured to convert the light generated in the first scintillator layer and the light generated in the second scintillator layer into an electric signal.

A PET detecting module may include a scintillator array configured to receive a radiation ray and generate optical signals in response to the received radiation ray. The scintillator array may have a plurality of rows of scintillators arranged in a first direction and a plurality of columns of scintillators arranged in a second direction. A first group of light guides may be arranged on a top surface of the scintillator array along the first direction. The light guide count of the first group of light guides may be less than the row count of the plurality of rows of scintillators. A second group of light guides may be arranged on a bottom surface of the scintillator array. The light guide count of the second group of light guides may be less than the column count of the plurality of columns of scintillators.

A radiation-sensing device is provided. The radiation-sensing device includes a substrate, a first scintillator layer, a second scintillator layer, and an array layer. The first scintillator is disposed on a first side of the substrate, and includes a plurality of first blocking walls and a plurality of first scintillator elements. The plurality of first scintillator elements are located between the plurality of first blocking walls. The second scintillator layer is disposed on a second side of the substrate, and the second side is opposite to the first side. The array layer is located between the first scintillator layer and the second scintillator layer, and has a plurality of photosensitive elements. In addition, a projection of at least one of the plurality of first blocking walls on the substrate overlaps with a projection of at least one of the plurality of photosensitive elements on the substrate.

A PET detecting module may include a scintillator array configured to receive a radiation ray and generate optical signals in response to the received radiation ray. The scintillator array may have a plurality of rows of scintillators arranged in a first direction and a plurality of columns of scintillators arranged in a second direction. A first group of light guides may be arranged on a top surface of the scintillator array along the first direction. The light guide count of the first group of light guides may be less than the row count of the plurality of rows of scintillators. A second group of light guides may be arranged on a bottom surface of the scintillator array. The light guide count of the second group of light guides may be less than the column count of the plurality of columns of scintillators.

A method and apparatus for testing the response of protective headgear 104 to impact forces. A high-speed cineradiography imaging system 100 is used to obtain full-field, time-resolved internal monitoring and measurement of headgear component (pads 140 and liners 142) deformation and interaction with a head surrogate (headform 102), deformation of headform components, and stress and strain transfer into the headform. Radiopaque contrast materials (144 & 148) and integration techniques are used to highlight specific regions of interest within the headgear and headform components during the impact loading events.

An X-ray sensing apparatus includes a first photodiode array for imaging a first area, a second photodiode array for imaging a second area that overlaps a portion of the first area, and a light-blocking layer coupled to the first photodiode array that prevents at least a portion of visible light emitted by a scintillator layer of the X-ray sensing apparatus from reaching the second photodiode array. The light-blocking layer includes a first feature that is imagable by the second photodiode array and indicates a position along a first direction and a second feature that is imagable by the second photodiode array and indicates a position along a second direction that is different than the first direction.

A protection film covering a scintillator has at least a plurality of metal atoms, an oxygen atom, and a hydrophobic functional group, a certain metal atom of the plurality of metal atoms is bonded to the other metal atom of the plurality of metal atoms through the oxygen atom, the hydrophobic functional group has a carbon atom, and the carbon atom is bonded to any one of the plurality of metal atoms.