A process for manufacturing an optical system includes forming a first hydrophobic surface at a semiconductor substrate, providing a first drop of transparent material having a first shape on the first hydrophobic surface, and allowing the first drop to harden to form a first optical element having the first shape. The optical system may be a particle detector, and the process may optionally further include forming a light source at the semiconductor substrate configured to generate a light beam that passes through the first optical element and a cavity to a photodetector.

A signal processing system (SPS) and related method. The system comprises an input interface (IN) for receiving at least two data sets, comprising a first data set and second data set. The first data set is generated by an X-ray detector sub-system (XDS) at a first pixel size and the second data set generated at a second pixel size different from the first pixel size. An estimator (EST) is configured to compute, based on the two data sets, an estimate of a charge sharing impact.

According to an embodiment, a method comprises: configuring a panel plate as an entrance window for high energy electromagnetic, for example x-ray or gamma ray, radiation; attaching a bias plate on the panel plate, wherein the bias plate is configured to conduct electricity and pass the radiation through it; and attaching an array of tiles, where in each tiles comprises a direct conversion compound semiconductor sensor and a readout integrated circuit, IC, layer on the bias plate so that the direct conversion compound semiconductor sensor is configured on the bias plate; wherein the direct conversion compound semiconductor sensor is configured to convert photons of the high energy electromagnetic, for example x-ray or gamma ray, radiation into an electric current; and wherein the readout IC layer is situated next to the direct conversion compound semiconductor sensor and configured to receive the electric current and process the electric current. Other embodiments relate to a detector comprising an array of assemblies, and an imaging system comprising: an x-ray source and the detector.

An apparatus suitable for detecting X-ray is disclosed. In one example, the apparatus comprises an X-ray absorption layer comprising a first pixel and a second pixel, and a controller. The controller is configured for determining that carriers generated by a single X-ray photon are collected by the first pixel and the second pixel. The controller is also configured for determining energy of the single X-ray photon based on a first voltage detected from the first pixel and a second voltage detected from the second pixel. The first voltage and the second voltage are caused by the single X-ray photon.

An apparatus suitable for detecting X-ray is disclosed. In one example, the apparatus comprises an X-ray absorption layer and a controller. The X-ray absorption layer comprises a first pixel and a second pixel. The controller is configured for determining that carriers generated by a first X-ray photon are collected by the first pixel and the second pixel, and resetting signals associated with the carriers collected by the first pixel and the second pixel.

An active matrix substrate includes a photoelectric conversion element in a pixel P defined by a gate line and a data line. The photoelectric conversion element is connected with a bias line, and the bias line is connected with a bias terminal that supplies a bias voltage to the bias line. The bias terminal is connected with a first protection circuit that is formed with a nonlinear element. The first protection circuit is connected in a reverse-biased state between a first line to which a predetermined voltage higher than the bias voltage is supplied, and the bias terminal.

Radiation detectors and methods of use thereof that produce more accurate results. A region of the radiation detector is covered by a conversion layer. A reference region is covered by a light barrier material such as a metal, and not the conversion layer. The reference region incurs less radiation damage than the region under the conversion layer. The dark current produced by the reference region can be used to more accurately calibrate the detector, provide real time normalization of the current produced by the conversion layer region, and determine when the detector has been damaged sufficiently to be replaced.

The present disclosure provides a method for analyzing the signal of a neutral atom imaging unit, including: preparing a neutral atom imaging unit, which includes a semiconductor detector array and modulation grids disposed at intervals in front of the semiconductor detector array; preparing a neutral atom source plane, energetic neutral atoms emitted by the neutral atom source plane are received by the semiconductor detector array after passing through the modulation grids, and the modulation grids form a projection on the semiconductor detector array; obtaining a response function of the imaging unit according to the projection; calculating the data signal obtained by the neutral atom imaging unit; and performing inversion imaging on the neutral atom emission source according to the response function of the imaging unit and the data signal. The method well inverts the neutral atom emission source to obtain the intensity and size of the neutral atom emission source.

A flexible DR detector assembly bendable along one axis and not bendable along a second axis is used with an x-ray source for radiographic imaging of a human anatomy, veterinary anatomy, or industrial equipment.

A method for calibrating a nuclear medicine tomography detector module using principal component analysis is based on the idea that calibration beam data lies on a one-dimensional path within the higher dimensional dataspace of output data. The module includes a weighted multiplexing circuit that generates a small number of multiplexed signals for each photon event. Calibration data for the module is generated and analyzed using several iterations of principal component analyses, to filter scattering events, noise, and other spurious signals. The direction of depth-of-interaction information has been found in the high-dimensional dataspace to be indicated by the primary principal component of the calibration data. The primary principal components, principal components from filtered datasets, intermediate thresholds, and DOI or inner product values are recorded for calibrating the module.