Integration method of a large-scale silicon-based lithium niobate film electro-optic modulator array. By using the method, the difficulty of a fabrication process of a lithium niobate crystal layer is reduced, requirements on precision of bonding lithium niobate and silicon is reduced, and fabrication and bonding of the large-scale array lithium niobate crystal layer can be completed at one time, so that production efficiency of the silicon-based lithium niobate film electro-optic modulator array is greatly improved; through design and optimization of the structure of the silicon crystal layers, light can be naturally alternated and mutually transmitted in silicon waveguides and lithium niobate waveguides, and a high-performance electro-optic modulation effect of the lithium niobate film is achieved.

Glass-as-a-Platform (GaaP) assemblies are provided. Embodiments of the GaaP assembly comprise a first glass plate and a second glass plate, each disposed under one or more switch ASICs and one or more opto-electronic devices co-packaged on the same substrate. Each glass plate includes a plurality of waveguides. The co-packaged substrate is disposed on top of one or more of the first glass plate and second glass plate, the first glass plate configured to couple to one or more opto-electronic devices and the second glass plate configured to couple to one or more other opto-electronic devices. A faceplate interface end of each glass plate is configured to connect to one or more optical cable connectors. The glass plates are configured to route optical signals to and from one or more opto-electronic devices and one or more optical cable connectors through the one or more waveguides and openings in the co-packaged substrate.

Low loss fiber-to-chip interfaces for lithium niobate photonic integrated circuits are provided. An optical circuit includes a waveguide comprising an electro-optical material. The waveguide includes an elevated ridge and a slab underlying the elevated ridge, the elevated ridge and the slab extending along a central axis toward an optical interface. The elevated ridge and the slab each have a plurality of cross-sections along the central axis, each cross-section having a width measured perpendicular to the central axis, wherein the width of elevated ridge is smaller than the width of the slab for every cross-section along the central axis. The elevated ridge includes a tapered portion having a first taper, wherein the cross-section of the elevated portion decreases along the central axis toward the optical interface. The slab includes a tapered portion having a second taper, wherein the cross-section of the slab decreases along the central axis toward the optical interface. The slab extends beyond the elevated ridge along the central axis to the optical interface.

A wavelength checker includes an optical waveguide chip. A known arrayed-waveguide diffraction grating is formed on the optical waveguide chip. The wavelength checker includes a light conversion unit made of a conversion material that converts infrared light into visible light. The light conversion unit is arranged on an output side of a plurality of first output waveguides of the optical waveguide chip to be capable of receiving light emitted from the plurality of first output waveguides. The light conversion unit is formed on a side surface of a support facing an output end surface of the optical waveguide chip. The support is fixed to a main board.

A transparent display includes a display including a transparent substrate and a patterned diamond layer formed on the transparent substrate to at least in part define a diamond waveguide. At least two electronic devices can be connected by the diamond waveguide, and can include a sensor, a transducer, or electronic circuitry, including communication, control, or data processing electronic circuitry.

A groove having any length is manufactured in a quartz-based waveguide chip without limitation of a chip size. A marker indicating a planned cutting line extending from a connection end surface of a quartz-based waveguide chip in an in-chip plane direction is formed in advance by processing a core layer of the waveguide of the quartz-based waveguide chip, an irradiation position of laser light is aligned with a position of a starting point of the marker in a state where quartz-based waveguide chip is placed on a stage, and a groove is manufactured in the connection end surface of the quartz-based waveguide chip by moving the stage in the extending direction of the marker while irradiating the quartz-based waveguide chip with the laser light from an upper side.

An integrated optical device includes a substrate. A waveguide includes a lithium niobate. A TiO.sub.2 coating is disposed at least in part over a longitudinal surface of the waveguide as a coated waveguide supported by the substrate. A silicon oxide substantially can cover and surround the waveguide in cross section over a longitudinal direction of said waveguide as an optical cladding. A method for substantially eliminating optical damage in lithium niobate devices is also described.

A transparent display includes a display including a transparent substrate and a patterned diamond layer formed on the transparent substrate to at least in part define a diamond waveguide. At least two electronic devices can be connected by the diamond waveguide, and can include a sensor, a transducer, or electronic circuitry, including communication, control, or data processing electronic circuitry.

A silicon- and optical phased array-based integrated optically adjustable delay line, comprising, an optical phased array transmitting unit, a slab waveguide transmitting unit, and an optical phased array receiving unit that are sequentially arranged. By the optical phase control transmitting unit, the phase difference between channels is regulated and controlled via a phase shifter to change a far-field interference light spot and form a wave beam with directivity to regulate and control an incident angle of an optical signal entering the slab waveguide, thus changing the propagation path length of the optical signal. Finally, the optical signal is received by a corresponding optical phased array receiving unit to obtain different delay amounts. Large adjustable delay amount is realized and the delay line has the advantages of simple structure and control and high integration level with high application value in optical communication and microwave photonic and optical signal processing.

The optical fibers disclosed is a single mode optical fiber comprising a core region and a cladding region surrounding and directly adjacent to the core region. The core region can have a radius r.sub.1 in a range from 3 μm to 7 μm and a relative refractive index profile Δ.sub.1 having a maximum relative refractive index Δ.sub.1max in the range from 0.25% to 0.50%. The cladding region can include a first outer cladding region and a second outer cladding region surrounding and directly adjacent to the first outer cladding region. The first outer cladding region can have a radius r.sub.4a. The second outer cladding region can have a radius r.sub.4b less than or equal to 45 μm and comprising silica based glass doped with titania.