The present invention concerns an optical coupling device including at least one supporting layer comprising a first support wall and a second support wall. The at least one supporting layer comprises at least one bridging waveguide for coupling electromagnetic radiation to and from an optical resonator or optical device, the at least one bridging waveguide extending between the first support wall and the second support wall.

A novel apparatus for bonding of two polished substrates includes a plasma source in a ultra-high vacuum (UHV) chamber and a wafer-guiding element to control and guide wafers in the UHV chamber, where after a plasma activation process the wafers are guided and pressed against each other to form a covalent bond between wafer surfaces. The plasma activation process involves deposition of mono-layer or sub-monolayer metallic atom on the surface of substrates. After deposition of metallic layers, a high-force actuation presses the wafers and forms a covalent bond between the wafers. Then, the bonded wafer pair is ion-sliced or thinned to form single crystalline optical thin film. An annealing process oxidizes the deposited metallic layers and produces optically-transparent single crystalline thin film. An optical waveguide may be fabricated by this thin film while utilizing an electro-optic effect to produce optical modulators and other photonic devices.

An electro-optic waveguide device may include a slot waveguide including a lower high-refractive-index layer with a first refractive index and an upper high-refractive-index layer with a second refractive index, wherein the lower high-refractive-index layer and the upper high-refractive-index layer have conductivity and are disposed to face each other with a gap; and a slot part formed as a low-refractive-index layer, wherein the low-refractive-index layer is formed of a material producing an electro-optic effect and has a third refractive index lower than the first refractive index and the second refractive index, wherein the low-refractive-index layer is formed in the gap to come into contact with the lower high-refractive-index layer and the upper high-refractive-index layer, and wherein one of the lower high-refractive-index layer or the upper high-refractive-index layer includes a stretch stretching on both sides of a contact portion with the slot part in a width direction intersecting a transmission direction.

A method for manufacturing a waveguide aperture to block stray light from a facet of an integrated optical device include obtaining a wafer with one or more integrated optical devices formed thereon and with a cleaved facet; positioning a mask in front of the cleaved facet, thereby masking at least a portion of the waveguide aperture of at least one the one or more integrated optical devices; and applying a light-blocking coating to the cleaved facet with the mask masking the portion of each of the one or more integrated optical devices.

A bidirectional optical module includes a TOSA, a ROSA and an optical filter. The TOSA includes a light emitting unit and a thin film LiNbOx modulator, and the thin film LiNbOx modulator is optically coupled with the light emitting unit. The ROSA is connected with the TOSA. The optical filter is provided for a fiber port which the TOSA shares with the ROSA.

A highly-efficient ridge waveguide includes a base substrate of a single-crystal and a core substrate made of a nonlinear optical medium, the base substrate and the core substrate being directly bonded, and includes a thin film layer formed on a surface of the core substrate on the upper side of a periodically polarization-reversed structure, and becomes a wavelength conversion element. A direct bonding method through thermal diffusion is applied to bonding. The core substrate has a ridge structure formed in a light propagating direction and a reversed structure formed by processing this. A surface of the core substrate is ground and a thin film layer is formed on the ground surface. A core formed by digging a core layer of the core substrate in an unbonded state is provided on an upper surface of an undercladding layer of the base substrate in a bonded state. Two side surfaces of the core are in contact with an air layer.

Integration method of a large-scale silicon-based lithium niobate film electro-optic modulator array. By using the method, the difficulty of a fabrication process of a lithium niobate crystal layer is reduced, requirements on precision of bonding lithium niobate and silicon is reduced, and fabrication and bonding of the large-scale array lithium niobate crystal layer can be completed at one time, so that production efficiency of the silicon-based lithium niobate film electro-optic modulator array is greatly improved; through design and optimization of the structure of the silicon crystal layers, light can be naturally alternated and mutually transmitted in silicon waveguides and lithium niobate waveguides, and a high-performance electro-optic modulation effect of the lithium niobate film is achieved.

An electro-optic modulator. The modulator is made as a plurality of discrete elements, and adjacent elements abut such that there are no free space optics between adjacent discrete elements. The modulator comprises a radio frequency, RF, element configured to modulate light passing through the element based on an electrical RF input. The plurality of discrete elements comprises a first set of discrete elements fabricated from thin film lithium niobate, TFLN, and a second set of discrete elements fabricated from silicon photonics, SiPh. The first set of discrete elements comprises the RF element.

A photonic integrated circuit may include a substrate and an optical waveguide integrated with the substrate. The optical waveguide may include a bend section, wherein a bend shape of the bend section is defined by a curvature function to suppress waveguide mode conversion.

An optical waveguide element includes an optical waveguide which is formed on one surface of a substrate, an incidence part for light to be incident on the optical waveguide or an emission part for emitting light from the optical waveguide which is disposed in an end portion of the substrate, and a dielectric film which is formed on the optical waveguide of at least one of the incidence part and the emission part, and the vicinity thereof. Regarding the dielectric film, dielectric films including a dielectric film formed of a first material having an index of refraction higher than an index of refraction of the substrate and a dielectric film formed of a second material having an index of refraction lower than the index of refraction of the substrate are alternately laminated.