A light detection and ranging (LiDAR) device comprising: a laser emitting chip configured to emit laser, a laser detecting chip configured to detect laser, an emitting optic module configured to guide laser generated from the laser emitting chip to the outside of the LiDAR device, a detecting optic module configured to guide laser received from the outside of the LiDAR device to the laser detecting chip, an emitting optic holder located between the laser emitting chip and the emitting optic module, and an at least one emitting optic fixer located between the emitting optic holder and the emitting optic module, wherein the at least one emitting optic fixer is configured to fix a relative position between the laser emitting chip and the emitting optic module.

An optical interconnect structure including a base substrate, an optical waveguide, a first reflector, a second reflector, a dielectric layer, a first lens, and a second lens is provided. The optical waveguide is embedded in the base substrate. The optical waveguide includes a first end portion and a second end portion opposite to the first end portion. The first reflector is disposed between the base substrate and the first end portion of the optical waveguide. The second reflector is disposed between the base substrate and the second end portion of the optical waveguide. The dielectric layer covers the base substrate and the optical waveguide. The first lens is disposed on the dielectric layer and located above the first end portion of the optical waveguide. The second lens is disposed on the dielectric layer and located above the second end portion of the optical waveguide.

An optical device comprises a waveguide core layer that includes a planar lens structure having a first end and a second end, with the planar lens structure including a plurality of lens tapers extending from at least one of the first or seconds ends in a convex-shaped array. The waveguide core layer also includes a waveguide slab that adjoins with the planar lens structure, such that the waveguide slab is in optical communication with the plurality of lens tapers. The plurality of lens tapers are configured to adiabatically transition an index of refraction from a first index value, external to the planar lens structure, to a second index value, internal to the planar lens structure.

A microLED may be used to generate light for intra-chip or inter-chip communications. The microLED, or an active layer of the microLED, may be embedded in a waveguide. The waveguide may include a lens.

Embodiments include a fiber to photonic chip coupling system including a collimating lens which collimate a light transmitted from a light source and an optical grating including a plurality of grating sections. The system also includes an optical dispersion element which separates the collimated light from the collimating lens into a plurality of light beams and direct each of the plurality of light beams to a respective section of the plurality of grating sections. Each light beam in the plurality of light beams is diffracted from the optical dispersion element at a different wavelength a light beam of the plurality of light beams is directed to a respective section of the plurality of grating sections at a respective incidence angle based on the wavelength of the light beam of the plurality of light beams to provide optimum grating coupling.

Integrated-optics systems are presented in which an active-material stack is disposed on a coupling layer in a first region to collectively define an OA waveguide that supports an optical mode of a light signal. The coupling layer is patterned to define a coupling waveguide and a passive waveguide, which are formed as two abutting, optically coupled segments of the coupling layer. The lateral dimensions of the active-material stack are configured to control the shape and vertical position of the optical mode at any location along the length of the OA waveguide. The active-material stack includes a taper that narrows along its length such that the optical mode is located completely in the coupling waveguide where the coupling waveguide abuts the passive waveguide. In some embodiments, the passive layer is optically coupled with the OA waveguide and a silicon waveguide, thereby enabling light to propagate between them.

Embodiments include a fiber to photonic chip coupling system including a collimating lens which collimate a light transmitted from a light source and an optical grating including a plurality of grating sections. The system also includes an optical dispersion element which separates the collimated light from the collimating lens into a plurality of light beams and direct each of the plurality of light beams to a respective section of the plurality of grating sections. Each light beam in the plurality of light beams is diffracted from the optical dispersion element at a different wavelength a light beam of the plurality of light beams is directed to a respective section of the plurality of grating sections at a respective incidence angle based on the wavelength of the light beam of the plurality of light beams to provide optimum grating coupling.

An integrated optical beam steering device includes a planar Luneburg lens that collimates beams from different inputs in different directions within the lens plane. It also includes a curved (e.g., semi-circular or arced) grating coupler that diffracts the collimated beams out of the lens plane. The beams can be steered in the plane by controlling the direction along which the lens is illuminated and out of the plane by varying the beam wavelength. Unlike other beam steering devices, this device can operate over an extremely wide field of view—up to 180°—without any aberrations off boresight. In other words, the beam quality is uniform in all directions, unlike with aplanatic lenses, thanks to the circular symmetry of the planar Luneburg lens, which may be composed of subwavelength features. The lens is also robust to misalignment and fabrication imperfections and can be made using standard CMOS processes.

Disclosed is an optical module, including a lower housing, an upper housing covering the lower housing, a circuit board, a first metal base, a second metal base, a silicon photonic chip, and a light emission module including a laser chip and an optical path assembly. The first metal base is disposed on one side of the upper housing. The second metal base is disposed on one side of the lower housing. The circuit board with a hollow region is disposed on the second metal base. The silicon photonic chip is disposed on the second metal base exposed from the hollow region. The laser chip is disposed on the first metal base. The optical path assembly is disposed on the first metal base and/or on the second metal base exposed from the hollow region, and guides a third optical signal emitted by the laser chip to the silicon photonic chip.

Arrays of integrated analytical devices and their methods for production are provided. The arrays are useful in the analysis of highly multiplexed optical reactions in large numbers at high densities, including biochemical reactions, such as nucleic acid sequencing reactions. The devices allow the highly sensitive discrimination of optical signals using features such as spectra, amplitude, and time resolution, or combinations thereof. The devices include an integrated diffractive beam shaping element that provides for the spatial separation of light emitted from the optical reactions.