A microLED may be used to generate light for intra-chip or inter-chip communications. The microLED, or an active layer of the microLED, may be embedded in a waveguide. The waveguide may include a lens.

In some embodiments, optical systems with a reflector and a lens proximate a light output opening of the reflector provide light output with high spatial uniformity and high efficiency. The reflectors are shaped to provide substantially angularly uniform light output and the lens is configured to transform this angularly uniform light output into spatially uniform light output. The light output may be directed into a spatial light modulator, which modulates the light to project an image.

MicroLEDs may be used in providing intra-chip optical communications and/or inter-chip optical communications, for example within a multi-chip module or semiconductor package containing multiple integrated circuit semiconductor chips. In some embodiments the integrated circuit semiconductor chips may be distributed across different shelves in a rack. The optical interconnections may make use of optical couplings, for example in the form of lens(es) and/or mirrors. In some embodiments arrays of microLEDs and arrays of photodetectors are used in providing parallel links, which in some embodiments are duplex links.

Described herein are photonic communication platforms that can overcome the memory bottleneck problem, thereby enabling scaling of memory capacity and bandwidth well beyond what is possible with conventional computing systems. Some embodiments provide photonic communication platforms that involve use of photonic modules. Each photonic module includes programmable photonic circuits for placing the module in optical communication with other modules based on the needs of a particular application. The architecture developed by the inventors relies on the use of common photomask sets (or at least one common photomask) to fabricate multiple photonic modules in a single wafer. Photonic modules in multiple wafers can be linked together into a communication platform using optical or electronic means.

A photonic device includes a PCB having an integrated circuit mounted thereon, with a cap mounted to the PCB and carrying a lens positioned over the integrated circuit. The cap is formed by: an outer wall mounted to the PCB, extending upwardly from the PCB, and surrounding a portion of the integrated circuit; a first retention structure extending inwardly from the outer wall and across the integrated circuit, the first retention structure having a hole defined therein; and a second retention structure having a hole defined therein, the second retention structure being affixed within the first retention structure such that the hole in the second retention structure is axially aligned with the hole in the first retention structure. The lens is mechanically constrained within the cap between the first retention structure and the second retention structure.

A monolithic fiber-lens array includes a number of optical fibers integrated into a fiber block and multiple lens elements integrated into a lens block. The fiber block is coupled to the lens block via a transparent adhesive layer, and the tips of the optical fibers are aligned with respective focal points of the lens elements.

Systems and methods for fabricating a semiconductor chip with an integrated laser diode (or other optical component). An example method may comprise fabricating a recess shaped to receive the optical component. The method may also comprise metallizing at least one surface of the recess. The method may also comprise coupling the optical component to the at least one metallized surface of the recess. The component may comprise a laser diode comprising a p-type semiconductor and an n-type semiconductor. The n-type semiconductor may be electrically coupled to the at least one metallized surface of the recess. The method may also comprise optically coupling an optical output of the laser diode (or other optical component) to an optical input of a photonic interface of the chip with a photonic wire bond and/or at least one polymer lens.

Described herein are photonic communication platforms that can overcome the memory bottleneck problem, thereby enabling scaling of memory capacity and bandwidth well beyond what is possible with conventional computing systems. Some embodiments provide photonic communication platforms that involve use of photonic modules. Each photonic module includes programmable photonic circuits for placing the module in optical communication with other modules based on the needs of a particular application. The architecture developed by the inventors relies on the use of common photomask sets (or at least one common photomask) to fabricate multiple photonic modules in a single wafer. Photonic modules in multiple wafers can be linked together into a communication platform using optical or electronic means.

The technology relates to cosharding tables within a distributed storage system. A data table including one or more rows may be received. Each row in the data table may include an identifier key and pieces of data. Each piece of data in the data table may be indexed into individual rows of an index table, wherein each row in the index table includes data associated with the identifier key of the data table from which the piece of data in the respective row was indexed. The index table may be sharded into splits, wherein the sharding includes assigning each row of the index table into one of the splits based on the identifier key of the data table from which the piece of data in the respective row was indexed. The splits may be stored into two or more portions of the distributed storage system.

An optical device comprises a waveguide core layer that includes a planar lens structure having a first end and a second end, with the planar lens structure including a plurality of lens tapers extending from at least one of the first or seconds ends in a convex-shaped array. The waveguide core layer also includes a waveguide slab that adjoins with the planar lens structure, such that the waveguide slab is in optical communication with the plurality of lens tapers. The plurality of lens tapers are configured to adiabatically transition an index of refraction from a first index value, external to the planar lens structure, to a second index value, internal to the planar lens structure.