An electronic device comprises a photonic integrated circuit (PIC) including at least one waveguide, an emitting lens disposed on the PIC to emit light from the at least one waveguide in a direction substantially parallel to a first surface of the PIC, and an optical element disposed on the PIC and having a reflective surface configured to direct light emitted from the emitting lens in a direction away from the first surface of the PIC.

An electronic device comprises a photonic integrated circuit (PIC) including at least one optical signal source, an emitting lens disposed on the PIC to steer light emitted by the at least one optical signal source in a direction substantially parallel to a first surface of the PIC, and an optical element disposed on the PIC and having a curved surface in a shape of a quarter cylinder that is configured to steer light emitted from the emitting lens in a direction substantially orthogonal to the first surface of the PIC.

An optical resonator system includes a multi-strip waveguide structure having spaced semiconductor strips for guiding an IR radiation, a STP resonance structure (STP=slab tamm-plasmon-polariton), wherein the STP resonance structure includes an alternating arrangement of semiconductor strips and interjacent dielectric strips and includes a metal strip adjacent to the semiconductor strip at a boundary region of the STP resonance structure, wherein the metal strip and the adjacent semiconductor strip are arranged to provide a metal-semiconductor interface, and wherein the semiconductor strips of the multi-strip waveguide structure and the semiconductor strips of the STP resonance structure are arranged perpendicular to each other, and an optical coupling structure having a semiconductor layer, wherein the semiconductor layer is arranged between the multi-strip waveguide structure and the STP resonance structure for optically coupling the IR radiation between the multi-strip waveguide structure and the STP resonance structure.

The chemical sensing device comprises a substrate of semiconductor material, integrated circuit components and a photodetector formed in the substrate, a dielectric on the substrate, a wiring in the dielectric, and a source of electromagnetic radiation, a waveguide and a fluorescent sensor layer arranged in or above the dielectric. A portion of the waveguide is arranged to allow the electromagnetic radiation emitted by the source of electromagnetic radiation to be coupled into the waveguide. A further portion of the waveguide is arranged between the photodetector and the fluorescent sensor layer.

An apparatus comprises: a photonic integrated circuit comprising an optical phased array, a first focusing element at a fixed position relative to the optical phased array and configured to couple an optical beam to or from the optical phased array, and a second focusing element at a fixed position relative to the first focusing element and configured to couple the optical beam to or from the first focusing element. At least one of the first or second focusing element is externally coupled to the photonic integrated circuit, and the first and second focusing elements have different effective focal lengths.

In various embodiments, the beam parameter product and/or numerical aperture of a laser beam is adjusted utilizing a step-clad optical fiber having a central core, a first cladding, an annular core, and a second cladding.

A photonic integrated circuit including having a semiconductor substrate having integrated a semiconductor light source, the semiconductor light source comprising: an optically active section comprising a gain section and configured to support a first number of wavelengths, an optically passive section comprising a passive waveguide optically coupled to the optically active section and a passive section mirror optically coupled to the passive waveguide, wherein the optically passive section is configured to support a second number of wavelengths that is lower than the first number; and the optically passive section further comprising a signal shifting structure configured to shift a signal of the light supported by the passive waveguide.

MicroLEDs may be used in providing intra-chip optical communications and/or inter-chip optical communications, for example within a multi-chip module or semiconductor package containing multiple integrated circuit semiconductor chips. In some embodiments the integrated circuit semiconductor chips may be distributed across different shelves in a rack. The optical interconnections may make use of optical couplings, for example in the form of lens(es) and/or mirrors. In some embodiments arrays of microLEDs and arrays of photodetectors are used in providing parallel links, which in some embodiments are duplex links.

An optical device includes a first substrate, a second substrate, a plurality of separation walls, one or more optical waveguides, and one or more spacers. The first substrate has a surface which extends in a first direction and a second direction intersecting the first direction. The second substrate faces the first substrate. The plurality of separation walls are positioned between the first substrate and the second substrate and extend in the first direction. The one or more optical waveguides are positioned between the first substrate and the second substrate and include one or more dielectric members which are positioned between the plurality of separation walls and which extend in the first direction. The one or more spacers are directly or indirectly sandwiched between the first substrate and the second substrate and positioned around the one or more optical waveguides.

An integrated photonics device that emits light out towards a measured sample value is disclosed. The device can include a discrete optical unit that attaches to a supporting layer. The discrete optical unit can include mirror(s), optics, detector array(s), and traces. The supporting layer can include one or more cavities having facet walls. Light emitter(s) can emit light that propagate through waveguide(s). The emitted light can exit the waveguide(s) (via termination point(s)), enter the one or more cavities at the facet walls, and be received by receiving facets of the discrete optical unit. The mirror(s) of the discrete optical unit can redirect the received light towards collimating optics, which can direct the light out of the device through the system interface. The discrete optical unit can be formed separately from the supporting layer or bonded to the supporting layer after the mirror, optics, detector arrays, and traces are formed.