An optical aperture system is provided that includes a photonic integrated circuit. The photonic integrated circuit includes a plurality of apertures, a plurality of optical phase shifters coupled to respective apertures of the plurality of apertures, an optical splitter-combiner coupled to the plurality of optical phase shifters, an optical switch coupled to the optical splitter-combiner, a light source coupled to the optical switch, and a photodetector coupled to the optical switch. The optical aperture system further includes a controller configured to execute a first set of instructions to control the plurality of optical phase shifters and the light source in accordance with a first operating mode of a plurality of operating modes of the optical aperture system, and a processor configured to execute a second set of instructions to process an output of the photodetector in accordance with the first operating mode of the optical aperture system.

The invention relates to a process for fabricating an optoelectronic system (1) comprising an optical device (60) coupled to an integrated photonic circuit (20), comprising producing a lower waveguide (13.1) from the thin single-crystal-silicon layer (13) of a first SOI substrate (10), then joining a second SOI substrate (40) thereto and producing an intermediate waveguide (43.1) from the thin single-crystal-silicon layer (43) of the second SOI substrate (40).

Embodiments disclosed herein include electronic packages and methods of forming such electronic packages. In an embodiment, an electronic package comprises a first layer, where the first layer comprises glass. In an embodiment, a second layer is over the first layer, where the second layer comprises a mold material. In an embodiment, a first photonics integrated circuit (PIC) is within the second layer. In an embodiment, a second PIC is within the second layer, and a waveguide is in the first layer. In an embodiment, the waveguide optically couples the first PIC to the second PIC.

A photonic integrated circuit, comprising a semiconductor photonic substrate having integrated therein: at least one light receiving input; at least one optical splitter to branch light received at the at least one light receiving input to a first light path and a second light path; wherein, the photonic integrated circuit, in the first light path, includes: at least one first amplifier structure to amplify the light in the first light path to provide first amplified light; at least one first light output to output the first amplified light from the at least one first amplifier structure; and at least one first photo detector to receive light from the outside of the photonic integrated circuit, the at least one first photo detector being located next to the at least one first light output; wherein, the photonic integrated circuit, in the second light path, includes: at least one second amplifier structure to amplify the light in the second light path to provide second amplified light; at least one second light output to output the second amplified light from the at least one second amplifier structure; and at least one second photo detector to receive light from the outside of the photonic integrated circuit, the at least one second photo detector being located next to the at least one second light output.

An IC device includes a heat spreader, an electronic component over the heat spreader, an optical component over the electronic component, a multilayer structure over the optical component, and a redistribution structure over the multilayer structure. The multilayer structure includes a waveguide optically coupled to the optical component. The redistribution structure is electrically coupled to the electronic component by vias through the optical component and the multilayer structure.

Example implementations described herein are directed to an interface configured to redirect light between a connector connected to a printed optical board (POB) via an optical waveguide, and a photonic integrated circuit (PIC), the interface involving two-dimensionally distributed waveplates (TDWs) having multiple layers of p-doped and n-doped silicon, the TDWs configured to be driven to change a dielectric constant at a two dimensional location on the TDWs such that the received light is redirected at the two dimensional location.

In some implementations, a photonic transmission structure includes a first cladding structure; a first active structure disposed over the first cladding structure; and a second cladding structure disposed over the first active structure. The first active structure includes a non-alkali, oxide solution that includes a cation that is niobium.

The present disclosure is directed towards aligning a photonic integrated circuit (PIC) through providing a PIC with a marker waveguide, wherein a marker waveguide is a waveguide having: a first end located at the edge of the PIC wherein the first end is coupled to an edge coupling; and a second end coupled to a grating coupler or a device coupler, wherein: the grating coupler or device coupler is configured to receive light and couple the light to the waveguide to illuminate the waveguide to facilitate the correct alignment of the edge coupler to an external component.

An embodiment of the present invention relates to an optical element comprising a plurality of perturbing centers arranged in a scattering plane of the optical element. The optical element comprises at least two oriented groups of oriented perturbing centers, wherein a group-individual orientation is assigned to each oriented group, wherein the perturbing centers of each oriented group are oriented in accordance with the same group-individual orientation), and wherein the group-individual orientations are angled relatively to one another. The oriented groups are interweaved. Adjacent perturbing centers belong to different groups and are angled to each other.

An optical connection structure includes a PLC that is an optical waveguide chip including an optical waveguide and at least one groove formed on a substrate, and at least one optical fiber that is fitted into the at least one groove of the PLC. The PLC includes the optical waveguide, at least one grating coupler that is optically connected to the optical waveguide, and the at least one groove formed at a position in a vicinity of the at least one grating coupler in a cladding layer in which the optical waveguide is formed. An optical fiber of the at least one optical fiber is fitted into a groove of the at least one groove such that an end surface of the optical fiber is located in a vicinity of a grating coupler of the at least one grating coupler, the optical fiber being optically connected to the grating coupler.