G02B2006/12109

ELECTROMAGNETIC WAVE RESONATOR TUNING
20210117846 · 2021-04-22 ·

An apparatus for facilitating electromagnetic wave resonator tuning is disclosed, including first, second, and third spaced apart resonator portions, the second portion disposed between the first and third to form an electromagnetic wave resonator having a resonant frequency, wherein the first and second portions define a first volume therebetween and the second and third define a second volume therebetween, a first actuator coupled to the first portion, the second, or both, the first actuator configured to adjust a width of the first volume, and a second actuator coupled to the second portion, the third, or both, the second actuator configured to adjust a width of the second volume, wherein the actuators are configured to decrease the widths of the first and second volumes or increase the widths of the first and second volumes to adjust the resonant frequency of the resonator. Other apparatuses, methods, and systems are also disclosed.

MULTIBAND PHOTONIC INTEGRATED CIRCUIT (PIC) I AND Q DEMODULATOR
20210124106 · 2021-04-29 ·

An apparatus includes a first modulator configured to modulate a radio frequency (RF) input signal onto a first optical signal and a second modulator configured to modulate a local oscillator (LO) signal onto a second optical signal. The apparatus also includes a photonic integrated circuit having an optical demodulator configured to generate, using the modulated optical signals, I and Q signals representing a demodulated version of the RF input signal. The optical demodulator may include an optical filter bank having multiple optical filters, where different optical filters are configured to pass different frequencies or frequency ranges. The optical filters may include at least one narrowband optical filter and/or one or more tunable optical filters.

The narrowband optical filter(s) may be configured to isolate global navigation satellite system-related signals. The tunable optical filter(s) may be configured to isolate signals over a frequency range of about 900 MHz to about 12 GHz.

SILICON PHOTONIC COMPONENTS FABRICATED USING A BULK SUBSTRATE
20210132461 · 2021-05-06 ·

Structures including a photodetector and methods of fabricating such structures. A substrate, which is composed of a semiconductor material, includes a first trench, a second trench, and a pillar of the semiconductor material that is laterally positioned between the first trench and the second trench. A first portion of a dielectric layer is located in the first trench and a second portion of the dielectric layer is located in the second trench. A waveguide core is coupled to the pillar at a top surface of the substrate.

Silicon photonic components fabricated using a bulk substrate

Structures including a photodetector and methods of fabricating such structures. A substrate, which is composed of a semiconductor material, includes a first trench, a second trench, and a pillar of the semiconductor material that is laterally positioned between the first trench and the second trench. A first portion of a dielectric layer is located in the first trench and a second portion of the dielectric layer is located in the second trench. A waveguide core is coupled to the pillar at a top surface of the substrate.

Waveguide architecture for photonic neural component

A photonic neural component includes optical transmitters, optical receivers, inter-node waveguides formed on a board, transmitting waveguides configured to receive optical signals emitted from the optical transmitters and transmit the received optical signals to the inter-node waveguides, mirrors to partially reflect optical signals propagating on the inter-node waveguides, receiving waveguides configured to receive reflected optical signals produced by the mirrors and transmit the reflected optical signals to the optical receivers, and filters configured to apply weights to the reflected optical signals. The transmitting waveguides and receiving waveguides are formed on the board such that one of the transmitting waveguides and one of the receiving waveguides crosses one of the inter-node waveguides with a core of one of the crossing waveguides passing through a core or clad of the other.

FIBER MODULE

A fiber module (1B) according to the present disclosure includes an input-side optical fiber (11), an output-side optical fiber (12), a ferrule (20) in which the input-side optical fiber and the output-side optical fiber are insertable in both ends and a groove (32) is formed in a direction orthogonal to a longitudinal direction (D1) in the middle of the longitudinal direction, a dielectric multilayer film filter (30) inserted in the groove, and an input-side GI fiber (15) and an output-side GI fiber (16) joined by fusion to respective terminal portions of the input-side optical fiber and the output-side optical fiber. The dielectric multilayer film filter is interposed between an end surface (15f) of the input-side GI fiber and an end surface (16f) of the output-side GI fiber in the longitudinal direction.

POST-FABRICATION TRIMMING OF SILICON RING RESONATORS VIA INTEGRATED ANNEALING
20210048581 · 2021-02-18 ·

Methods for post-fabrication trimming of a silicon ring resonator are disclosed. Methods include fabricating a heating element, positioned within 2 microns of the silicon ring resonator, subjecting the silicon ring resonator to energetic ion implantation, and annealing the silicon ring resonator, using the heating element. The energetic ion implantation shifts a resonance of the silicon ring resonator towards the red side of the electro-magnetic spectrum. The annealing shifts the resonance of the silicon ring resonator towards the blue side of the electro-magnetic spectrum.

OPTICAL MICRODISKS FOR INTEGRATED DEVICES

Apparatus and methods for improving optical signal collection in an integrated device are described. A microdisk can be formed in an integrated device and increase collection and/or concentration of radiation incident on the microdisk and re-radiated by the microdisk. An example integrated device that can include a microdisk may be used for analyte detection and/or analysis. Such an integrated device may include a plurality of pixels, each having a reaction chamber for receiving a sample to be analyzed, an optical microdisk, and an optical sensor configured to detect optical emission from the reaction chamber. The microdisk can comprise a dielectric material having a first index of refraction that is embedded in one or more surrounding materials having one or more different refractive index values.

END DEVICE OF OPTICAL WAVEGUIDE AND OPTICAL FILTER
20210063641 · 2021-03-04 ·

A first optical waveguide is formed on a semiconductor substrate in such a way that the first optical waveguide is surrounded by clad layers. An outside portion of the first optical waveguide is formed as a terminator, which includes a taper portion and a bending structure portion. The taper portion has a width, which is gradually reduced in a direction to a forward end of the first optical waveguide. The taper portion coverts a light confinement condition from a strong condition to a weak condition in the direction to the forward end of the first optical waveguide. The bending structure portion has an arc shape extending from an outside end of the taper portion on a plane parallel to a surface of the semiconductor substrate.

EFFICIENTLY COMBINING MULTIPLE TAPS OF AN OPTICAL FILTER

An optical filter comprises an array of waveguides fabricated on an optical integrated circuit (PIC). The array comprises individual waveguides, each of which receive light inputs, e.g., individual taps of a multi-tap optical filter used in an interference cancellation circuit. Typically, the output(s) of the individual waveguides are located at an exit (edge) of the PIC. At least one second waveguide in the array is patterned on the PIC in a converged configuration such that the light transiting these waveguides co-propagates and interacts across given portions of the respective waveguides before exiting the waveguide array along a common facet, thereby generating or inhibiting one of intermodulation products, and harmonics. This structural configuration enables the generation of various modes of transmission at the PIC exit, enabling more efficient transfer of the energy, e.g., to an associated photodetector (PD) that provides conversion of the energy to the RF domain.