A transimpedance amplifier and photodiode that has a bias voltage node established at a bias voltage and a ground node/plane that connects, over a short distance as compared to the prior art, to a photodiode and a transimpedance amplifier. The photodiode is in a substrate and configured to receive and convert an optical signal to an electrical current. The photodiode has an anode terminal and a cathode terminal which is connected to the bias voltage node. One or more capacitors in or on the substrate and connected between the bias node and the ground node. The transimpedance amplifier has an input connected to the anode terminal of the photodiode and an output that presents a voltage representing the optical signal to an output path. The transimpedance amplifier and the photodiode are both electrically connected in a flip chip configuration and the ground plane creates a coplanar waveguide.

A system and method for packing optical and electronic components. A module includes an electronic integrated circuit and a plurality of photonic integrated circuits, connected to the electronic integrated circuit by wire bonds or by wire bonds and other conductors. A metal cover of the module is in thermal contact with the electronic integrated circuit and facilitates extraction of heat from the electronic integrated circuit. Arrays of optical fibers are connected to the photonic integrated circuits.

A receptacle for receiving and securing a plural of fiber optical connectors holding two or more LC-type optical ferrules with a fiber therein. A receptacle retainer assembly with a pair of opposing hooks at a first end to accept and secure a connector within receptacle, and a second end with a latch to secure to a fiber stub holder comprising a plural of fiber stubs.

An assembly with optical gain assisted optical transposer is provided. The optical transposer which optically couples a fibre array unit and a photonic integrated circuit. The optical transposer includes one or more optical gain elements which are configured to provide optical compensation, for example optical gain to mitigate optical losses associated with multistage photonic integrated devices. According to some embodiments, the optical gain element is a semiconductor optical amplifier (SOA). According to some embodiments the photonic integrated circuit is a SiPh PIC.

In one aspect, the disclosure relates to self-healing systems including at least a structural polymer, a plurality of optical fibers or polymer waveguides embedded in the structural polymer, and a plurality of micro-channels through the structural polymer, wherein the micro-channels are configured to deliver a curing composition to at least one site of damage in the system. In another aspect, the curing composition can include a photo-polymerizable liquid monomer, and, optionally, a sensitizer, a photo-initiator, and/or a toughening agent, articles comprising the same, and methods of in situ self-healing of damage including Mode-I fractures using visible irradiation from the optical fibers or polymer waveguides to photo-polymerize the liquid monomer.

According to various aspects of the present disclosure, an apparatus is provided. In an aspect, the apparatus includes an optical transceiver having a first port, a second port and an optical switch coupled to the first port and the second port. The optical switch is switchable between a unidirectional port operation mode and a bidirectional port operation mode. When the optical switch is in the unidirectional port operation mode, the first port is configured to send a first optical signal, and the second port configured to receive a second optical signal. When the optical switch is in the bidirectional port operation mode, the first port configured to send the first optical signal and receive the second optical signal, and the second port configured to receive a third optical signal and not send the first signal. Furthermore, a second bidirectional port operation mode is supported with the second port configured to send the first optical signal and receive the second optical signal, and the first port configured to receive a third optical signal and not send the first signal.

In one aspect, the disclosure relates to multi-material fibers capable of distributedly measuring temperature and pressure in which the methods comprise a thermal drawing step, and the methods of fabricating the disclosed fibers. The fibers can be utilized in methods of temperature and pressure mapping or sensing comprising electrical reflectometry for interrogation. Further disclosed are devices comprising a disclosed fiber with the multi-point detection capability with simple one-end connection. Also disclosed are articles, e.g., smart clothing, wound dressing, robotic skin and other industrial products, comprising a disclosed fiber or a fabric comprising a disclosed fiber. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present disclosure.

A transimpedance amplifier and photodiode that has a bias voltage node established at a bias voltage and a ground node/plane that connects, over a short distance as compared to the prior art, to a photodiode and a transimpedance amplifier. The photodiode is in a substrate and configured to receive and convert an optical signal to an electrical current. The photodiode has an anode terminal and a cathode terminal which is connected to the bias voltage node. One or more capacitors in or on the substrate and connected between the bias node and the ground node. The transimpedance amplifier has an input connected to the anode terminal of the photodiode and an output that presents a voltage representing the optical signal to an output path. The transimpedance amplifier and the photodiode are both electrically connected in a flip chip configuration and the ground plane creates a coplanar waveguide.

This disclosure describes circuit boards configured for optical data transmission using fibers of the reinforcing material of the circuit board substrate as optical fibers. The disclosure is directed to circuit boards that include a plurality of fibers and a dielectric matrix material. Each fiber of the plurality of fibers includes a core material substantially transparent to a wavelength range of interest and a cladding material. The refractive index of the cladding material is less than a refractive index of the core material. The plurality of fibers are interwoven in a weave. The weave is at least partially encapsulated by the dielectric matrix material. The weave provides structural support for the circuit board and a plurality of optical paths for optical signals.

An assembly with optical gain assisted optical transposer is provided. The optical transposer which optically couples a fibre array unit and a photonic integrated circuit. The optical transposer includes one or more optical gain elements which are configured to provide optical compensation, for example optical gain to mitigate optical losses associated with multistage photonic integrated devices. According to some embodiments, the optical gain element is a semiconductor optical amplifier (SOA). According to some embodiments the photonic integrated circuit is a SiPh PIC.