A fiber optic based sensing system and method includes a. functionalized optical fiber based sensor including an engineered sensing layer, a light source structured to generate light and couple the light into an input of the functionalized optical fiber based sensor, and an interrogator including a photodetector coupled to the functionalized optical fiber based sensor to receive transmitted or reflected tight, a transimpedance amplifier (TIA) circuit coupled to an output of the photodetector, a controller coupled to an output of the TIA circuit, and a transmitter (e.g., a wired or wireless transmitter) coupled to the controller.

An electronic device may have a display with pixels configured to display an image. The pixels may be overlapped by a cover layer. The display may have peripheral edges with curved cross-sectional profiles. An inactive area in the display may be formed along a peripheral edge of the display or may be surrounded by the pixels. Electrical components such as optical components may be located in the inactive area. An image transport layer may be formed from a coherent fiber bundle or Anderson localization material. The image transport layer may overlap the pixels, may have an opening that overlaps portions of the inactive area, may have an output surface that overlap portions of the inactive area, and/or may convey light associated with optical components in the electronic device.

Position controlled waveguides and methods of manufacturing the same are disclosed. An example apparatus includes a substrate with a channel that extends into a first surface of the substrate to a second surface of the substrate, wherein the second surface is recessed relative to the first surface; buffer material having a first index of refraction on the second surface of the substrate; and a waveguide on the buffer material, the waveguide having a second index of refraction that is higher than the first index of refraction.

The invention relates to field of optical chips. An optical transmission chip being used for wavefront shaping of multimode transmission optical fibers, includes intensity regulation and control unit, phase regulation and control unit, time delay regulation and control unit and polarization regulation and control unit, which are all integrated on same substrate, and cascaded according to preset sequence. The intensity regulation and control unit is connected with light input unit. The polarization regulation and control unit is connected with light output unit. A number of light output units is N, N is positive integer. Modulation of intensity, phase, time delay and polarization of optical modes is realized by utilizing integrated design method, pre-compensation of optical modes is effectively realized in multimode transmission system, and signal quality of multimode transmission system is improved. The optical chip has advantages of being low in cost, good in stability and high in integration level.

A photonic system includes a photonic device, a first set of bulk optics components, a second set of bulk optics components, and optical fill material. The photonic device includes a semiconductor substrate, a dielectric layer, a first set of optical ports, a second set of optical ports, and one or more overflow structure between the first and second set of optical ports. The semiconductor substrate includes a top side, a bottom side, and a lateral side. The dielectric layer includes a top side, a bottom side on the top side of the semiconductor substrate, and a lateral side. The optical fill material fills a first interface between the first set of bulk optics components and the first set of optical ports. The one or more overflow structures provide one or more voids to receive optical fill material that overflows from the first interface.