An optical assembly may include a platform disposed within a housing that has a limited space. The platform may be tilted by a first angle to fit a fiber array into the limited space of the housing. The optical assembly may also include a silicon photonics device mounted on the tilted platform. The silicon photonics device may include a grating coupler. The optical assembly may also include the fiber array directly coupled to the grating coupler on the silicon photonics device at a coupling position that deviates from a vertical coupling position by a second angle.

There is provided an optical system for coupling light into a waveguide. The optical system comprising a coupler arranged at a portion of the waveguide. The coupler has a surface with a grating structure for directing light into the waveguide formed therein. A cladding layer embeds the coupler and an optical path changing structure is formed in the cladding layer. The optical path changing structure has a refractive surface and a reflective surface, each forming an acute angle with respect to the surface of the coupler. Light which enters the optical path changing structure through the refractive surface will be refracted and directed towards the reflective surface. The reflective surface is arranged to reflect the light such that it is directed towards the grating structure of the coupler along a direction suitable for efficient coupling of light into the waveguide.

An optical device module includes a substrate, an interlayer insulating layer on the substrate, an optical waveguide on the interlayer insulating layer, an optical device on the optical waveguide, and a prism disposed between the optical device and the optical waveguide. The prism has a refractive index greater than a refractive index of the optical waveguide.

A semiconductor package includes a first die stack structure and a second die stack structure, an insulating encapsulation, a redistribution structure, at least one prism structure and at least one reflector. The first die stack structure and the second die stack structure are laterally spaced apart from each other along a first direction, and each of the first die stack structure and the second die stack structure comprises an electronic die; and a photonic die electronically communicating with the electronic die. The insulating encapsulation laterally encapsulates the first die stack structure and the second die stack structure. The redistribution structure is disposed on the first die stack structure, the second die stack structure and the insulating encapsulation, and electrically connected to the first die stack structure and the second die stack structure. The at least one prism structure is disposed within the redistribution structure and optically coupled to the photonic die. The at least one reflector is disposed on the at least one prism structure.

A wavelength division multiplexing filter and methods of forming the same include an optical dielectric filter having multiple dielectric layers. The optical dielectric filter has a high reflectivity at a first wavelength and a high transmissivity at one or more additional wavelengths. The dielectric layers include a structure of layers following the pattern L-[M/2-H-M/2]N-L, where L layers include a first dielectric material, H layers include a second dielectric material, M/2 layers have a mixture of the first and second dielectric material and have a thickness half that needed to provide reflectivity at the first wavelength, and N is a number of repetitions for the structure in brackets.

A wavelength division multiplexing filter and methods of forming the same include an optical dielectric filter formed on a substrate and having a plurality of dielectric layers. The optical dielectric filter has a high reflectivity at a first wavelength and a high transmissivity at one or more additional wavelengths. The substrate has a high thermal tolerance, such that the substrate is not damaged by temperatures at which the plurality of dielectric layers are formed.

A variable optical attenuator (VOA) may include an input collimator with an input fiber connected on one side and an output collimator with an output fiber connected on one side, where the collimators are on a same surface of a VOA enclosure. A retroreflector may receive a light beam from the input collimator and reflect the light beam to the output collimator. The VOA may include an attenuation element positioned between the input collimator and the retroreflector and/or another attenuation element positioned between the retroreflector and the output collimator to provide variable attenuation to the light beam. The attenuation elements may be moved to set an attenuation level by one or more adjustment elements such as a miniature motor. The attenuation element may include a gradient index (GRIN) element, a polarizer, a neutral density filter, or a wavelength tunable filter.

A wavelength division multiplexing filter and methods of forming the same include an optical dielectric filter formed on a substrate and having a plurality of dielectric layers. The optical dielectric filter has a high reflectivity at a first wavelength and a high transmissivity at one or more additional wavelengths. The substrate has a high thermal tolerance, such that the substrate is not damaged by temperatures at which the plurality of dielectric layers are formed.

A rectifier comprising a metal-insulator-metal (MIM) structure. The insulator may be a native oxide with an adjacent layer of graphene. In one implementation, the rectifier is used in an electromagnetic energy collector consisting of a planar waveguide formed of multiple material layers having at least two different dielectric constants. MIM rectifiers are aligned with mirrors are formed within the waveguide core. In some arrangements, a plurality of MIM rectifiers are disposed in a column or 3D array beneath each mirror.

A photonic device and related method for forming a photonic device. In some embodiments, a method of fabricating a photonic device includes forming a layer stack over a substrate. In some cases, the layer stack includes a lower cladding layer, a core layer disposed over the lower cladding layer, and an upper cladding layer disposed over the core layer. In some examples, the method further includes patterning the layer stack to form a waveguide for the photonic device. In some cases, the waveguide includes the core layer, and the core layer includes a lateral surface having a convex profile.