An optical modulator includes a substrate having a first face and a second face; an input port provided on the first face; a first waveguide provided on the substrate, the waveguide being connected to the input port; a first coupler provided on the substrate, the first coupler being optically connected to the first waveguide; an output port provided on the first face of the substrate, the output port being optically connected to the first coupler; and a first anti-reflection coating provided on the second face. The first face and the second face are arranged along a first direction. The first face and the second face extend in a direction intersecting the first direction. The first coupler extends in the first direction.

An optical semiconductor device includes a first optical coupler including a first input port and a second input port, a first optical branching device including a first output port and a second output port, a second optical coupler including a third input port and a fourth input port, a second optical branching device including a third output port and an fourth output port, a first single mode waveguide configured to connect the second input port and the first output port, a second single mode waveguide configured to connect the second output port and the third input port, a third single mode waveguide configured to connect the fourth input port and the third output port, and a fourth single mode waveguide configured to connect the fourth output port and the first input port.

Structures for a waveguide bend and methods of fabricating a structure for a waveguide bend. A waveguide bend is connected to a waveguide core. A slab layer, which is thinner than the waveguide bend, is coupled to the waveguide core and the waveguide bend. The slab layer includes a first curved opening and a second curved opening that is positioned between the first curved opening and a side surface of the waveguide bend. A section of the slab layer is positioned between the first and second curved openings. The first curved opening has a first radius, and the second curved opening has a second radius that is greater than or less than the first radius of the first curved opening.

Structures for a waveguide bend and methods of fabricating a structure for a waveguide bend. A waveguide bend is connected to a waveguide core. A slab layer, which is thinner than the waveguide bend, is coupled to the waveguide core and the waveguide bend. The slab layer includes a first curved opening and a second curved opening that is positioned between the first curved opening and a side surface of the waveguide bend. A section of the slab layer is positioned between the first and second curved openings. The first curved opening has a first radius, and the second curved opening has a second radius that is greater than or less than the first radius of the first curved opening.

An optical waveguide includes: a plurality of linear portions arranged in parallel to each other; a plurality of arcuate portions, in the folded portion of the optical waveguide, concentrically arranged about a predetermined center position as a center on the substrate at intervals narrower than intervals between the plurality of linear portions, each of the arcuate portions having a central angle that increases as each of the arcuate portions is closer to the center position; and a plurality of connecting portions respectively connecting the plurality of linear portions and the plurality of arcuate portions, at least one group of the connecting portions bending in a direction opposite to a direction where each of the arcuate portions bends.

In an embodiment, a device includes: a first and second integrated circuit die; and a hybrid redistribution structure including: a first photonic die; a second photonic die; a first dielectric layer laterally surrounding the first photonic die and the second photonic die, the first integrated circuit die and the second integrated circuit die being disposed adjacent a first side of the first dielectric layer; conductive features extending through the first dielectric layer and along a major surface of the first dielectric layer, the conductive features electrically coupling the first photonic die to the first integrated circuit die, the conductive features electrically coupling the second photonic die to the second integrated circuit die; a second dielectric layer disposed adjacent a second side of the first dielectric layer; and a waveguide disposed between the first dielectric layer and the second dielectric layer, the waveguide optically coupling the first and second photonic dies.

The present disclosure relates to semiconductor structures and, more particularly, to rib waveguide structures and methods of manufacture. The structure includes: a waveguide structure comprising one or more bends, an input end and an output end; and grating structures which are positioned adjacent to the one or more bends of the waveguide structure.

An optical modulator includes a substrate having a first face and a second face; an input port provided on the first face; a first waveguide provided on the substrate, the waveguide being connected to the input port; a first coupler provided on the substrate, the first coupler being optically connected to the first waveguide; an output port provided on the first face of the substrate, the output port being optically connected to the first coupler; and a first anti-reflection coating provided on the second face. The first face and the second face are arranged along a first direction. The first face and the second face extend in a direction intersecting the first direction. The first coupler extends in the first direction.

In an embodiment, a device includes: a first and second integrated circuit die; and a hybrid redistribution structure including: a first photonic die; a second photonic die; a first dielectric layer laterally surrounding the first photonic die and the second photonic die, the first integrated circuit die and the second integrated circuit die being disposed adjacent a first side of the first dielectric layer; conductive features extending through the first dielectric layer and along a major surface of the first dielectric layer, the conductive features electrically coupling the first photonic die to the first integrated circuit die, the conductive features electrically coupling the second photonic die to the second integrated circuit die; a second dielectric layer disposed adjacent a second side of the first dielectric layer; and a waveguide disposed between the first dielectric layer and the second dielectric layer, the waveguide optically coupling the first and second photonic dies.

Structures for a waveguide bend and methods of fabricating a structure for a waveguide bend. A waveguide core has a first section, a second section, and a waveguide bend connecting the first section with the second section. The waveguide core includes a first side surface extending about an inner radius of the waveguide bend and a second side surface extending about an outer radius of the waveguide bend. A curved strip is arranged over the waveguide bend adjacent to the first side surface or the second side surface.