A structure and method for providing alignment aids that are co-fabricated with the optical emission output from a laser pedestal are described. In embodiments, the alignment aids are formed using processes and masking layers that produce a ridge waveguide laser structure. The use of same masking processes for the laser and the alignment aids provides lithographic level precision in the positioning of the alignment aids in relation to the optical output from the laser device. Optoelectrical die formed with the alignment aids may be used with complementary interposer structures to enable alignment of optical output from lasers formed on the optoelectrical die with optical devices on the interposer.

Described herein are IC devices that include hybrid lasers formed with a bonding layer. Hybrid lasers include an active light-emitting region coupled to a waveguide. In a hybrid laser, the waveguide and the light-emitting regions are formed separately from different materials, e.g., the waveguide is a single-crystal silicon, and the light-emitting region includes III-V semiconductors. An amorphous group IV material, such as silicon or germanium, is advantageously used to bond the light-emitting region to the waveguide.

A signal transmission structure configured to transmit signals between an image module and an application processor is provided. An optoelectronic composite board including a circuit board and an optical waveguide module, and is configured to simultaneously transmit digital signals between the image module and the application processor in the form of electric and optical signals. By using the signal transmission structure having both electric and optical signals, transferring of a larger quantity of signals is enabled and transmission of digital data is accelerated.

A photonic system includes a first photonic circuit having a first face and a second photonic circuit having a second face. The first photonic circuit comprises first wave guides, and, for each first wave guide, a second wave guide covering the first wave guide, the second wave guides being in contact with the first face and placed between the first face and the second face, the first wave guides being located on the side of the first face opposite the second wave guides. The second photonic circuit comprises, for each second wave guide, a third wave guide covering the second wave guide. The first photonic circuit comprises first positioning devices projecting from the first face and the second photonic circuit comprises second positioning devices projecting from the second face, at least one of the first positioning devices abutting one of the second positioning devices in a first direction.

A hybrid electrical and optic system-on-chip (SOC) device configured for both electrical and optic communication includes a substrate, an electrical device configured for electrical communication arranged on the substrate, a photonics device configured for optic communication arranged on the substrate, and a self-test module arranged on the substrate. The self-test module is configured to receive a loop-back signal indicative of an optical signal output from the photonics device and calibrate the photonics device based on the loop-back signal.

In various embodiments, the beam parameter product and/or numerical aperture of a laser beam is adjusted utilizing a step-clad optical fiber having a central core, a first cladding, an annular core, and a second cladding.

Described herein are photonic communication platforms that can overcome the memory bottleneck problem, thereby enabling scaling of memory capacity and bandwidth well beyond what is possible with conventional computing systems. Some embodiments provide photonic communication platforms that involve use of photonic modules. Each photonic module includes programmable photonic circuits for placing the module in optical communication with other modules based on the needs of a particular application. The architecture developed by the inventors relies on the use of common photomask sets (or at least one common photomask) to fabricate multiple photonic modules in a single wafer. Photonic modules in multiple wafers can be linked together into a communication platform using optical or electronic means.

An optical module includes a circuit board, a substrate, a laser assembly, and a silicon photonic chip. The silicon photonic chip is electrically connected to the circuit board through the substrate so as to ground the silicon photonic chip. The substrate includes a body, a first support step, and a second support step. The first support step is disposed at an end of the body. The second support step is disposed at another end of the body. The circuit board includes a first metal layer and a second metal layer. The first metal layer is disposed on a surface of the circuit board proximate to the first support step and is electrically connected to the first support step. The second metal layer is disposed on a surface of the circuit board proximate to the second support step and is electrically connected to the second support step.

A planar light circuit comprises a substrate and a first pixel. The first pixel comprises a first number N of laser diodes, a first waveguide located on the substrate, a first number N of inlets which couple the first number N of laser diodes to the first waveguide and a first outlet. The first waveguide couples the first number N of inlets to the first outlet.

An arrangement comprises the planar light circuit. The arrangement is realized as data glasses.

An exemplary multi quantum well structure may include a silicon platform having a pit formed in the silicon platform, a chip positioned inside the pit, a first waveguide formed in the chip, and a second waveguide formed in the silicon platform. The pit may be defined at least in part by a sidewall and a base. The chip may include a first side and a first recess in the first side. The first side may be defined in part by a first cleaved or diced facet. The first recess may be defined in part by a first etched facet. The first waveguide may be configured to guide an optical beam to pass through the first etched facet. The second waveguide may be configured to guide the optical beam to pass through the sidewall. The second waveguide may be optically aligned with the first waveguide.