A low loss high extinction ratio on-chip polarizer is disclosed. The polarizer includes an input waveguide taper having an outer waveguiding region that widens in the direction of light propagation along at least a portion of the taper length, and a core waveguiding region that narrows in the direction of light propagation along at least a portion of the taper length, so as to selectively squeeze out light of undesired modes into the outer regions while preserving light of a desired mode in the waveguide core. An output filter section is provided to prevent light from reentering the output waveguide after being squeezed out. An integrated light absorber/deflector may be coupled to the outer waveguiding regions.

The present disclosure relates to semiconductor structures and, more particularly, to waveguide attenuators and methods of manufacture. The structure includes: a main bus waveguide structure; a first hybrid waveguide structure evanescently coupled to the main bus waveguide structure and comprising a first geometry of material; and a second hybrid waveguide structure evanescently coupled to the main bus waveguide structure and comprising a second geometry of the material.

Methods and systems for selectively illuminated integrated photodetectors with configured launching and adaptive junction profile for bandwidth improvement may include a photonic chip comprising an input waveguide and a photodiode. The photodiode comprises an absorbing region with a p-doped region on a first side of the absorbing region and an n-doped region on a second side of the absorbing region. An optical signal is received in the absorbing region via the input waveguide, which is offset to one side of a center axis of the absorbing region; an electrical signal is generated based on the received optical signal. The first side of the absorbing region may be p-doped. P-doped and n-doped regions may alternate on the first and second sides of the absorbing region along the length of the photodiode. The absorbing region may comprise germanium, silicon, silicon/germanium, or similar material that absorbs light of a desired wavelength.

Fabricating a photonic integrated circuit includes fabricating structures in one or more silicon layers. At least a first silicon layer comprises: one or more photonic structures, where the photonic structures include one or more waveguides and one or more photodetectors, and one or more light absorbing structures, where at least some of the light absorbing structures include doped silicon. Fabricating the photonic integrated circuit also includes fabricating at least one waveguide in the photonic integrated circuit for receiving light into at least one of the silicon layers.

The invention provides an automotive lighting device with a circuit support, an optics support, a holder support and a microlenses support. The optics support includes optical elements, each one being arranged in front of one of the solid-state light sources of the printed circuit board. The optics support further includes positioning protrusions configured to fit the positioning housings of the circuit support. The holder support includes a plurality of opaque walls, a first coupler and a second coupler. Each opaque wall is located between two optical elements. The microlenses support includes a plurality of groups of microlenses, each group having a plurality of microlenses arranged to receive the light projected by one optical elements. The first coupler is configured to couple the holder support to the circuit support. The second coupler is intended to retain the microlenses support.

The present disclosure relates to semiconductor structures and, more particularly, to spiral waveguide absorbers and methods of manufacture. The structure includes: a photonics component; and a waveguide absorber with a grating pattern coupled to a node of the photonics component.

An optical power converter device (200, 300) comprises a semiconductor waveguide structure having a first end facet (F1) configured to receive an incident light beam, and one or more light absorbing layers (210a) with a total thickness of substantially less than 100 nm and configured to absorb light guided by the waveguide structure. The device further comprises a cathode (202) and an anode (204) in contact with substantially the entire length of the waveguide structure in the direction of propagation of light from the first end facet for outputting generated electrical power. An optical power converting system (1000) comprising the optical power converter device is also provided, as is a method of operating the optical power converter.

An embodiment optical test circuit includes a first optical circuit and a second optical circuit formed on a substrate, an input optical waveguide optically connected to the first optical circuit and the second optical circuit, and an output optical waveguide optically connected to the first optical circuit and the second optical circuit. The optical test circuit also includes a light emitting diode optically connected to the input optical waveguide, and a photodiode optically connected to the output optical waveguide.

The present disclosure relates to semiconductor structures and, more particularly, to a photonic chip security structure and methods of manufacture. The structure includes an optical component and a photonic chip security structure having a vertical wall composed of light absorbing material surrounding the optical component.

Embodiments of the disclosure provide an integrated circuit (IC) structure, including an absorber layer separated from an optical grating coupler by a cladding material. The absorber is positioned to receive light reoriented through the optical grating coupler.