Embodiments include a photonic device with a compensation structure. The photonic device includes a waveguide with a refractive index which changes according to the thermo-optic effect as a temperature of the photonic device fluctuates. The compensation structure is positioned on the photonic device to counteract or otherwise alter the thermo-optic effect on the refractive index of the waveguide in order to prevent malfunctions of the photonic device.

Described herein are one or more methods for integrating an optical component into an integrated photonics device. The die including a light source, an outcoupler, or both, may be bonded to a wafer having a cavity. The die can be encapsulated using an insulating material, such as an overmold, that surrounds its edges. Another (or the same) insulating material can surround conductive posts. Portions of the die, the overmold, and optionally, the conductive posts can be removed using a grinding and polishing process to create a planar top surface. The planar top surface enables flip-chip bonding and an improved connection to a heat sink. The process can continue with forming one or more additional conductive layers and/or insulating layers and electrically connecting the p-side and n-side contacts of the laser to a source.

A tunable solid state laser device are described comprising a semiconductor based gain chip and a silicon photonic filter chip with tuning capability. The silicon photonic filter chip can comprises an input-output silicon waveguide, at least two ring resonators formed with silicon waveguides, one or more connecting silicon waveguides interfacing with the ring resonators, a separate heater associated with each ring resonator, a temperature sensor configured to measure the chip temperature, and a controller connected to the temperature sensor and the separate heaters and programmed with a feedback loop to maintain the filter temperature to provide the tuned frequency. The one or more connecting silicon waveguides are configured to redirect light resonant with each of the at least two ring resonators back through the input-output silicon waveguide. Corresponding methods are described for the control of the laser frequency. Improved structures of the SiPho multiple filter chip involve a Zagnac interferometer.

Structures including an optical component and methods of fabricating a structure including an optical component. The structure includes an optical component having a waveguide core, and multiple features positioned adjacent to the waveguide core. The waveguide core contains a first material having a first thermal conductivity, and the features contain a second material having a second thermal conductivity that is greater than the first thermal conductivity.

A waveguide structure including a waveguide having a thermally controllable section, and a method of manufacturing the structure. The waveguide structure comprises a plurality of layers. The layers comprise, in order: a substrate (306), a sacrificial layer (305), a lower cladding layer (303), a waveguide core layer (302), and an upper cladding layer (301). The lower cladding layer, waveguide core layer, and upper cladding layer form the waveguide, the waveguide has a waveguide core. The waveguide structure has a continuous via (307) passing through the upper cladding layer, waveguide core layer, and lower cladding layer and running parallel to the waveguide ridge (304) along substantially the whole length of the thermally controllable section. The waveguide structure also has a thermally insulating region (308) in the sacrificial layer extending at least from the via to beyond the waveguide ridge along the whole length of the thermally controllable section. The sacrificial layer comprises a sacrificial material outside of the thermally insulating region, and a thermally insulating gap (308) or thermally insulating material separating the lower cladding layer and substrate inside the thermally insulating region. The structure is manufactured by providing a wet etch to the sacrificial layer through the via in order to remove material from at least the thermally insulating region.

Thermal isolation elements are provided in wafer-bonded silicon photonics that include a photonic platform, including a heating element and an optical waveguide that are disposed between a first surface and a second surface (opposite to the first surface) of the photonic platform; a substrate, including a third surface and a fourth surface (opposite to the third surface); wherein the first surface of the photonic platform is bonded to the third surface of the substrate; and wherein a cavity is defined by a trench in one or more of: the first surface and extending towards, but not reaching, the second surface, and the third surface and extending towards, but not reaching, the fourth surface; wherein the cavity is filled with a gas of a known composition at a predefined pressure; and wherein the cavity is aligned with the optical waveguide and the heating element.

A photonic system includes a waveguide. The photonic system further includes a micro ring modulator (MRM) spaced from the waveguide. The photonic system further includes a heater configured to increase a temperature of the MRM in response to the heater receiving a first voltage. The photonic system further includes a cooling element configured to decrease a temperature of the MRM in response to the cooling element receiving a second voltage.

Disclosed are methods of making a planar optical waveguide, the method including depositing an uncured waveguide material on a substrate, the uncured waveguide material having a first temperature when deposited and the uncured waveguide material having a density dependent on the temperature thereof; changing the temperature of at least a portion of the uncured waveguide material to a second temperature before curing, after curing, during curing or any combination thereof; and curing the uncured waveguide material to form the planar optical waveguide.

The purpose of the present invention is to improve gap tolerance in a directional coupler. Toward that purpose, this directional coupler has two waveguides facing across a gap, the directional coupler being characterized in that a desired gap and directional coupler length are provided from among gaps and directional coupler lengths in which the branch ratio of the directional coupler is at the maximum or in the vicinity of the maximum, a difference being provided in the propagation coefficients of the two waveguides in the coupling region to achieve the desired branch ratio.

A photonic dosimeter accrues cumulative dose and includes: a substrate; a waveguide disposed on the substrate and that: receives a primary input light; transmits secondary input light from the primary input light to a dosimatrix; receives a secondary output light from the dosimatrix; and produces primary output light from the secondary output light; the dosimatrix disposed on the substrate and in optical communication with the waveguide and that: receives the secondary input light from the waveguide; produces the secondary output light that is communicated to the waveguide; and includes an active element that undergoes conversion from a prime state to a dosed state in response to receipt, by the active element, of a dose of radiation; and a cover layer disposed on waveguide and the dosimatrix.