Patent classifications
G02B2006/12142
Photonic Systems Comprising an Asymmetric Coupler and Methods of Fabrication
The present disclosure is directed toward photonic elements comprising rib-waveguide-based ring resonators having high coupling efficiency between their bus and ring waveguides within the coupling region of the ring resonator, as well as operability over a wide spectral range. Embodiments disclosed herein employ a small-diameter ring waveguide and a bus waveguide that collectively define an asymmetrical coupler having a coupling region at which the optical confinement of the bus waveguide is stronger on side of the bus waveguide distal to the ring waveguide than on the side of the bus waveguide that is proximal to the ring waveguide. In some embodiments, in the coupling region, the bus waveguide has ridge and an inner bus-slab portion that is shared with the ring waveguide, while the outer bus-slab portion is at least partially removed to give rise to stronger optical confinement at the outer edge of the ridge of the bus waveguide.
FABRICATION METHOD FOR PHOTONIC DEVICES
Electro-optical devices and methods for constructing electro-optical devices such as a switch or phase shifter. An electrode layer is deposited on a substrate layer, a waveguide structure is deposited on the electrode layer, a first cladding layer is deposited on the waveguide structure, and the first cladding layer is planarized and bonded to a wafer. The substrate layer is removed and the electrode layer is etched to split the electrode layer into a first electrode separated from a second electrode. A second cladding layer is deposited on the etched electrode layer. The first and second electrodes may be composed of a material with a large dielectric constant, or they may be composed of a material with a large electron mobility. The device may exhibit a sandwich waveguide architecture where an electro-optic layer is disposed between two strip waveguides.
Photonic devices
Photonic devices having Al.sub.1-xSc.sub.xN and Al.sub.yGa.sub.1-yN materials, where Al is Aluminum, Sc is Scandium, Ga is Gallium, and N is Nitrogen and where 0<x≤0.45 and 0≤y≤1.
Active region-less polymer modulator integrated on a common PIC platform and method
A monolithic PIC including a monolithic laser formed in/on a platform and a polymer modulator monolithically built onto the platform and optically coupled to the laser. The modulator includes a first cladding layer, a passive core region with a surface abutting a surface of the first cladding layer, the core region extending to define an input and an output for the modulator. A shaped electro-optic polymer active component has a surface abutting a surface of a central portion of the core region. The active component is polled to align dipoles and promote modulation of light and has a length that extends only within a modulation area defined by modulation electrodes. A second cladding layer encloses the active component and is designed to produce adiabatic transition of light waves traveling in the core region into the active component to travel the length thereof and return to the core region.
Method and system for a frequency diverse distributed Mach-Zehnder Interferometer
A frequency diverse distributed Mach-Zehnder Interferometer may include an optical modulator on a chip, with the modulator comprising a plurality of diodes arranged along a waveguide and with each diode driven by two or more drivers. An optical signal may be received in the waveguide, and a first modulating electrical signal may be applied to a first of the plurality of diodes using a first driver and a second modulating electrical signal may be applied to the first of the plurality of diodes using a second driver. The first electrical signal may be different from the second modulating electrical signal. The second electrical signal may have a larger voltage swing than the first electrical signal. The first electrical signal voltage swing may be 0.85 volts and the second electrical signal voltage swing may be 1.5 volts, for example. The first and second electrical signals may have different frequencies.
Multi-speed transceiver system
A multi-speed transceiver device includes a chassis having an optical cable connector coupled to a transceiver processor, and an optical waveguide coupling. A data receiving subsystem in the chassis couples the transceiver processor to the optical waveguide coupling, includes data receiving optical waveguides, and transmits first data received from the transceiver processor to the optical waveguide coupling over a number of the data receiving optical waveguides that depends on a first data transmission speed at which the first data was received. A data transmission subsystem in the chassis couples the transceiver processor to the optical waveguide coupling, includes data transmission optical waveguides, and receives second data via the optical waveguide coupling and over a number of the data transmission optical waveguides that depends on a second data transmission speed at which the second data was received, and then transmits that second data to the transceiver processor.
Semiconductor device and including an optical waveguide and method of manufacturing the same
A semiconductor device includes a semiconductor substrate having a first surface, a second surface opposite to the first surface, and having a first recess portion formed on the first surface, a first cladding layer located in the first recess portion, and a first optical waveguide formed on the first cladding layer. The first optical waveguide overlaps with the first cladding layer in plan view.
DISSIPATING HEAT FROM AN ACTIVE REGION OF AN OPTICAL DEVICE
A device, such as an electroabsorption modulator, can modulate a light intensity by controllably absorbing a selectable fraction of the light. The device can include a substrate. A waveguide positioned on the substrate can guide light. An active region positioned on the waveguide can receive guided light from the waveguide, absorb a fraction of the received light, and return a complementary fraction of the received light to the waveguide. Such absorption produces heat, mostly at an input portion of the active region. The input portion of the active region can be thermally coupled to the substrate, which can dissipate heat from the input portion, and can help avoid thermal runaway of the device. The active region can be thermally isolated from the substrate away from the input portion, which can maintain a relatively low thermal mass for the active region, and can increase efficiency when heating the active region.
Controlled tunneling waveguide integration (CTWI) for effective coupling between different components in a photonic chip
The invention describes an integrated photonics platform comprising a plurality of at least three vertically-stacked waveguides which enables light transfer from one waveguide of the photonic structure into another waveguide by means of controlled tunneling method. The light transfer involves at least three waveguides wherein light power flows from initial waveguide into the final waveguide while tunneling through the intermediate ones. As an exemplary realization of the controlled tunneling waveguide integration, the invention describes a photonic integrated structure consisting of laser guide as upper waveguide, passive guide as middle waveguide, and modulator guide as lower waveguides. Controlled tunneling is enabled by the overlapped lateral tapers formed on the same or different vertical waveguide levels. In the further embodiments, the controlled tunneling platform is modified to implement wavelength-(de)multiplexing, polarization-splitting and beam-splitting functions.
SPOT SIZE CONVERTER, SEMICONDUCTOR OPTICAL DEVICE
A spot size converter includes: a first semiconductor waveguide structure having a first width enabling single mode propagation; a second semiconductor waveguide structure having a second width greater than the first width, a second semiconductor waveguide structure including an end face for optically coupling with an external waveguide; a third semiconductor waveguide structure having a third width greater than the first and second widths, the third semiconductor waveguide structure being optically coupled to the second semiconductor waveguide structure; and a single tapered waveguide having a first end portion connected to the third semiconductor waveguide structure, and a second end portion connected to the first semiconductor waveguide structure, the single tapered waveguide having a width gradually changing in a direction from the first end portion to the second end portion.