An intact semiconductor wafer (wafer) includes a plurality of die. Each die has a top layer including routings of conductive interconnect structures electrically isolated from each other by intervening dielectric material. A top surface of the top layer corresponds to a top surface of the wafer. Below the top layer, each die has a device layer including optical devices and electronic devices. Each die has a cladding layer below the device layer and on a substrate of the wafer. Each die includes a photonic test port within the device layer. For each die, a light transfer region is formed within the intact wafer to extend through the top layer to the photonic test port within the device layer. The light transfer region provides a window for transmission of light into and out of the photonic test port from and to a location on the top surface of the wafer.

An optical switch includes a bus waveguide supported by a substrate, a coupling waveguide suspended over the bus waveguide, a reaction electrode coupled with, and adjacent to, the coupling waveguide, an actuation electrode supported by the substrate and configured to control a position of the coupling waveguide relative to the bus waveguide via the reaction electrode, and an optical antenna coupled with the coupling waveguide and disposed at a fixed distance from the bus waveguide. When a voltage difference between the reaction electrode and the actuation electrode is less than a lower threshold, the coupling waveguide is positioned a first distance from the bus waveguide, when the voltage difference between the reaction electrode and the actuation electrode is greater than an upper threshold, the coupling waveguide is positioned a second distance from the bus waveguide, and the second distance is less than the first distance.

Power consumption in MZI-based integrated photonic switches or filters throughout the operational life can be reduced by reducing fabrication-induced phase misalignment between the unpowered operational mode of the switch or filter and the predominant switch state, and/or by enabling low-power compensation for any such misalignment. In various embodiments, misalignment is reduced by increasing the width of the waveguides implementing the interferometer arms of the MZI, and/or by structuring a region containing the MZI symmetrically to diminish stress-induced misalignment. In some embodiments, phase tuners are used to actively compensate for any phase misalignment, with a tuner drive voltage substantially lower than used to switch to the non-dominant state.

MEMS-actuated optical switches can be implemented on photonic chips. These switches are compact, essentially planar, simple to implement and include only one moving MEMS component per switch. The switches exhibit low optical loss, require low power to operate, and are simple to control and easy to integrate with other optical devices. Each switch has two optical waveguides that are optically coupled in an ON switch state and not coupled in an OFF switch state. An end or a medial section of one of the two waveguides may translate between the ON and OFF states to affect the coupling. Alternatively, a coupling frustrator may translate between the ON and OFF states to affect the coupling.

Hybrid optical integration places very strict manufacturing tolerances and performance requirements upon the multiple elements to exploit passive alignment techniques as well as having additional processing requirements. Alternatively, active alignment and soldering/fixing where feasible is also complex and time consuming with 3, 4, or 6-axis control of each element. However, microelectromechanical (MEMS) systems can sense, control, and activate mechanical processes on the micro scale. Beneficially, therefore the inventors combine silicon MEMS based micro-actuators with silicon CMOS control and drive circuits in order to provide alignment of elements within a silicon optical circuit either with respect to each other or with other optical elements hybridly integrated such as compound semiconductor elements. Such inventive MEMS based circuits may be either maintained as active during deployment or powered off once the alignment has been “locked” through an attachment/retention/latching process.

A process is provided for the high-yield heterogeneous integration of ‘quantum micro-chiplets’ (QMCs, diamond waveguide arrays containing highly coherent color centers) with an aluminum nitride (AlN) photonic integrated circuit (PIC). As an example, the process is useful for the development of a 72-channel defect-free array of germanium-vacancy (GeV) and silicon-vacancy (SiV) color centers in a PIC. Photoluminescence spectroscopy reveals long-term stable and narrow average optical linewidths of 54 MHz (146 MHz) for GeV (SiV) emitters, close to the lifetime-limited linewidth of 32 MHz (93 MHz). Additionally, inhomogeneities in the individual qubits can be compensated in situ with integrated tuning of the optical frequencies over 100 GHz. The ability to assemble large numbers of nearly indistinguishable artificial atoms into phase-stable PICs is useful for development of multiplexed quantum repeaters and general-purpose quantum computers.

A display may have an array of display pixels that generate an image. A coherent fiber bundle may be mounted on the display pixels. The coherent fiber bundle may have a first surface that is adjacent to the display pixels and a second surface that is visible to a viewer. The coherent fiber bundle may contain fibers that carry light from the first surface to the second surface. The second surface may be planar or may have a central planar region and curved edge regions that run along opposing sides of the central planar region. The fibers may have cross-sectional surface areas with a first aspect ratio on the first surface and a second aspect ratio that is greater than the first aspect ratio on the second surface.

An electro-wetting optical device includes an optical switch that uses a coupling region proximate a waveguide in a substrate. The device uses two optical liquids, providing first and second refractive indices respectively. At least one of the optical liquids is deuterated. Under a first switching configuration the first optical liquid is positioned at the coupling region so as to provide a first effective refractive index for light propagating along the first waveguide and under a second switching configuration the second optical liquid is positioned at the coupling region so as to provide a second effective refractive index for light propagating along the first waveguide.

Data center interconnections, which encompass WSCs as well as traditional data centers, have become both a bottleneck and a cost/power issue for cloud computing providers, cloud service providers and the users of the cloud generally. Fiber optic technologies already play critical roles in data center operations and will increasingly in the future. The goal is to move data as fast as possible with the lowest latency with the lowest cost and the smallest space consumption on the server blade and throughout the network. Accordingly, it would be beneficial for new fiber optic interconnection architectures to address the traditional hierarchal time-division multiplexed (TDM) routing and interconnection and provide reduced latency, increased flexibility, lower cost, lower power consumption, and provide interconnections exploiting scalable optical modular optically switched interconnection network as well as temporospatial switching fabrics allowing switching speeds below the slowest switching element within the switching fabric.

A large-scale single-photonics-based optical switching system that occupies an area larger than the maximum area of a standard step-and-repeat lithography reticle is disclosed. The system includes a plurality of identical switch blocks, each of is formed in a different reticle field that no larger than the maximum reticle size. Bus waveguides of laterally adjacent switch blocks are stitched together at lateral interfaces that include a second arrangement of waveguide ports that is common to all lateral interfaces. Bus waveguides of vertically adjacent switch blocks are stitched together at vertical interfaces that include a first arrangement of waveguide ports that is common to all vertical interfaces. In some embodiments, the lateral and vertical interfaces include waveguide ports having waveguide coupling regions that are configured to mitigate optical loss due to stitching error.