A multi-chip photonic assembly includes first and second photonic integrated circuits having first and second waveguides vertically stacked such that first vertical dimensions of the first and second waveguides occupy different horizontal planes in the stack. At least one of the first and second waveguides has a region that has a second vertical dimension that is larger than the first vertical dimension and either horizontally overlaps the other waveguide and/or vertically contacts the other waveguide. Light moving through one of the waveguides from the first vertical dimension to the other vertical dimension changes modes vertically so that the light moves from one waveguide to the other.

Embodiments described herein may be related to apparatuses, processes, and techniques directed to dense integration of PICs in a substrate using an optical fanout structure that includes waveguides formed within a substrate to optically couple with the PICs at an edge of the substrate. One or more PICs may then be electrically with dies such as processor dies or memory dies. The one or more PICs may be located within a cavity in the substrate. The substrate may be made of glass or silicon. Other embodiments may be described and/or claimed.

Structures for managing light polarization on a photonics chip and methods of forming a structure for managing light polarization on a photonics chip. A single-mode waveguiding structure is formed that includes a first waveguide core region and a second waveguide core region positioned above the first waveguide core region. The second waveguide core region includes a first section, a second section connected to the first section, and a third section connected to the second section. The second section has a first width at an intersection with the first section and a second width at an intersection with the third section. The second width is greater than the first width. The first and second waveguide core regions contain materials of different composition.

A method of fabricating a composite integrated optical device includes providing a substrate comprising a silicon layer, forming a waveguide in the silicon layer, and forming a layer comprising a metal material coupled to the silicon layer. The method also includes providing an optical detector, forming a metal-assisted bond between the metal material and a first portion of the optical detector, forming a direct semiconductor-semiconductor bond between the waveguide, and a second portion of the optical detector.

An embodiment of the present invention relates to an optical element comprising a plurality of perturbing centers arranged in a scattering plane of the optical element. The optical element comprises at least two oriented groups of oriented perturbing centers, wherein a group-individual orientation is assigned to each oriented group, wherein the perturbing centers of each oriented group are oriented in accordance with the same group-individual orientation), and wherein the group-individual orientations are angled relatively to one another. The oriented groups are interweaved. Adjacent perturbing centers belong to different groups and are angled to each other.

An electronic device comprises a photonic integrated circuit (PIC) including at least one waveguide, an emitting lens disposed on the PIC to emit light from the at least one waveguide in a direction substantially parallel to a first surface of the PIC, and an optical element disposed on the PIC and having a reflective surface configured to direct light emitted from the emitting lens in a direction away from the first surface of the PIC.

An optical connection structure includes a PLC that is an optical waveguide chip including an optical waveguide and at least one groove formed on a substrate, and at least one optical fiber that is fitted into the at least one groove of the PLC. The PLC includes the optical waveguide, at least one grating coupler that is optically connected to the optical waveguide, and the at least one groove formed at a position in a vicinity of the at least one grating coupler in a cladding layer in which the optical waveguide is formed. An optical fiber of the at least one optical fiber is fitted into a groove of the at least one groove such that an end surface of the optical fiber is located in a vicinity of a grating coupler of the at least one grating coupler, the optical fiber being optically connected to the grating coupler.

An optical integrated device includes a substrate and a waveguide that has a hollow structure. The waveguide includes a first waveguide and a second waveguide that is optically coupled to the first waveguide and that has a smaller relative refractive index difference than that of the first waveguide and converts a mode diameter to a mode diameter of an optical fiber in accordance with travelling of light. The optical integrated device includes a dent portion that is formed in the vicinity of the dicing line on the substrate such that the width of the output end surface is smaller than the core width of the optical fiber that is optically coupled to the output end surface in the state in which the dicing end surface of the substrate protrudes farther than the output end surface of the second waveguide in the axial direction of the optical waveguide.

An optoelectronic device includes a substrate and at least three emitters, which are disposed on the substrate and are configured to emit respective beams of light. A plurality of waveguides are disposed on the substrate and have respective input ends coupled to receive the beams of light from respective ones of the emitters, and curve adiabatically from the input ends to respective output ends of the waveguides, which are arranged on the substrate in an array having a predefined pitch. Control circuitry is configured to apply a temporal modulation independently to each of the beams of light.

High density fiber interfaces for silicon photonics based integrated-optics products are provided via a system or device that includes: a prism configured to reflect, via a lensed reflecting surface, a plurality of optical signals between a first surface and a second surface at a non-normal angle of incidence; a photonic interposer including a plurality of grating couplers corresponding to the plurality of optical signals that are arranged in a two-dimensional array and that are optically connected directly to the first surface of the prism; and a plurality of optical fibers that are arranged in the two-dimensional array and that are optically connected directly to the second surface of the prism.