An integrated optical device includes: a mounting base; an optical semiconductor device which is provided on a surface of the mounting base; a substrate; and an optical waveguide which is provided on a surface of the substrate, wherein an incident surface of the optical waveguide is disposed to face an emission surface of the optical semiconductor device, wherein light emitted from the optical semiconductor device is able to be incident to the optical waveguide, wherein the optical semiconductor device is connected to the mounting base through a metal layer, wherein the mounting base is connected to the substrate through the other metal layer, and wherein a mounting base bottom surface on the side opposite to a surface of the mounting base and a substrate bottom surface on the side opposite to a surface of the substrate are provided on the substantially same plane.

Devices and methods are described for selecting a level of entanglement between two nondegenerate photons. The method may include receiving two non degenerate photons through a single input port of a directional photonic coupler; adjusting one of a first-order coupler dispersion M or a power splitting ratio η (λ00) of the directional optical coupler to select a Δη; and, emitting the photons from corresponding output ports of the directional optical coupler, wherein the emitted photons have a spectral entanglement corresponding to the selected Δη.

A silicon photonics integrated chip includes the transmit-input waveguide unit, the splitter unit, the modulator unit, the transmit-output waveguide unit, the receive-input waveguide unit and the receiving detector unit integrated inside the chip. A silicon photonics multi-channel parallel optical component and a coupling method of the silicon photonics multi-channel parallel optical component are also provided. The integrated silicon photonics chip is adopted, the transmitting part still uses two-way DC laser group, the receiving chip is integrated inside the silicon photonics chip, and the optical interface adopts the mature FA-MPO in the industry. It has the advantages of mature technology, high degree of integration, relatively low cost, fewer coupling processes, etc., it is one of the advantageous choices for rates above 400 G.

Example embodiments relate to multilayer integrated photonic structures. An example multilayer integrated photonic structure includes a propagation region formed in a first photonic layer. The propagation region includes a plurality of waveguides and a slab region in which the plurality of waveguides terminates. The multilayer integrated photonic structure also includes an outcoupling structure formed in a second photonic layer on top of the first photonic layer. The outcoupling structure is configured to couple light into and out of the multilayer integrated photonic structure. Additionally, the multilayer integrated photonic structure includes a reflector configured to optically couple the slab region of the first photonic layer and the second photonic layer. The reflector includes a first reflector element included in the slab region of the first photonic layer and a second reflector element included in the second photonic layer. The first and second reflector element are in optical communication with each other.

The present disclosure relates to a fiber optic assembly including a flexible substrate and a plurality of optical fibers having affixed segments bonded to the flexible substrate along fiber routing paths. The optical fibers having first ends positioned at route termination locations corresponding to optical connection locations. The fiber optic assembly also includes a planar lightguide circuit chip having lightguides optically connected to second ends of the optical fibers including a silicon substrate and a core layer supported by the silicon substrate. Optical signal paths are defined that extend continuously from the first ends of the optical fibers through the second ends of the optical fibers to the lightguides without any optical fiber splices being located along the optical signal paths. The optical device also includes a spring mounted to the planar lightguide circuit chip for biasing the optical fiber into the alignment groove.

A loss-based wavelength meter includes a first photodiode configured to measure power of monochromatic light; and a loss section having a monotonic wavelength dependency, wherein a wavelength of the monochromatic light is determined based on measurements of the first photodiode after the monochromatic light has gone through the loss section. This provides a compact implementation that may be used in integrated optics devices using silicon photonics as well as other embodiments.

Structures for an optical power splitter/combiner and methods of forming a structure for an optical power splitter/combiner. A first waveguide core is positioned adjacent to a second waveguide core. The first waveguide core includes a first end surface and a first tapered section that tapers toward the first end surface. The second waveguide core includes a second end surface and a second tapered section that tapers toward the second end surface. A third waveguide core is positioned in a different level than the first waveguide core and the second waveguide core. The third waveguide core includes a third end surface and a third tapered section that tapers toward the third end surface. The third tapered section includes a portion laterally positioned between the first tapered section of the first waveguide core and the second tapered section of the second waveguide core.

A reflective structure includes an input/output port and an optical splitter coupled to the input/output port. The optical splitter has a first branch and a second branch. The reflective structure also includes a first resonant cavity optically coupled to the first branch of the optical splitter. The first resonant cavity comprises a first set of reflectors and a first waveguide region disposed between the first set of reflectors. The reflective structure further includes a second resonant cavity optically coupled to the second branch of the optical splitter. The second resonant cavity comprises a second set of reflectors and a second waveguide region disposed between the second set of reflectors.

A bricked sub-wavelength periodic waveguide and a modal adapter, power divider and polarization splitter that use the waveguide. The waveguide includes blocks disposed periodically with a period “L.sub.z” on a substrate and which alternate with a covering material. The first blocks have a width “a.sub.x” and the second blocks have a width “b.sub.x”, alternating on the substrate according to a period “L.sub.x”, the second blocks being shifted a distance “d.sub.z” the first blocks in the direction of propagation. A modal adapter, a power divider and a polarization splitter all use the periodic waveguide and can operate with larger wave periods without leaving the sub-wavelength regime.

A photonic integrated circuit (“PIC”) bandpass filter with polarization diversity can comprise a polarization management stage operable to receive a polarization diverse light input and to output an intermediate beam having a uniform polarization, and a filter stage operable to receive the intermediate beam from the polarization management stage, to filter the intermediate beam, and to output a filter output beam. Energy from both an in-plane polarization and an out-of-plane polarization of the polarization diverse light input can thereby be transferred to the filter stage.