Patent classifications
G02B2006/12197
GRATING, METHOD FOR MANUFACTURING GRATING, AND METHOD FOR RECYCLING GRATING
A grating for line-narrowing a laser beam that is outputted from a laser apparatus at a wavelength in a vacuum ultraviolet region may include: a grating substrate; a first aluminum metal film formed above the grating substrate, the first aluminum metal film having grooves in a surface thereof; and a first protective film formed by an ALD method above the first aluminum metal film.
STRUCTURES FOR INTEGRATED SILICON PHOTONICS OPTICAL GYROSCOPES
Disclosed herein are configurations and methods to produce very low loss waveguide structures, which can be single-layer or multi-layer. These waveguide structures can be used as a sensing component of a small-footprint integrated optical gyroscope. By using pure fused silica substrates as both top and bottom cladding around a SiN waveguide core, the propagation loss can be well below 0.1 db/meter. Low-loss waveguide-based gyro coils may be patterned in the shape of a spiral (circular or rectangular or any other shape), that may be distributed among one or more of vertical planes to increase the length of the optical path while avoiding the increased loss caused by intersecting waveguides in the state-of-the-art designs. Low-loss adiabatic tapers may be used for a coil formed in a single layer where an output waveguide crosses the turns of the spiraling coil.
Method for modification of surface of optical fiber preform
The present disclosure provides a method for modification of surface of an initial optical fiber preform. The initial optical fiber preform is manufactured using at least one preform manufacturing process. The surface of the initial optical fiber preform is treated with 50-70 liters of chlorine per square meter of the surface of the initial optical fiber preform. The surface of the initial optical fiber preform is flame polished using a flame polishing module. The treatment of the surface of the initial optical fiber preform with chlorine and flame polishing of the surface of the initial optical fiber preform collectively converts the initial optical fiber preform into a modified optical fiber preform.
METHOD OF POLISHING A SURFACE OF A WAVEGUIDE
A method of polishing a target surface of a waveguide to achieve perpendicularity relative to a reference surface is disclosed. The method includes i) providing a polishing apparatus having a polishing plate with a flat surface defining a reference plane, and an adjustable mounting apparatus configured to hold the waveguide during polishing at a plurality of angular orientations; ii) positioning an optical alignment sensor and a light reflecting apparatus such that a first collimated light beam is reflected off of a surface parallel to the reference plane, and a second perpendicular collimated light beam is reflected off of the reference surface; iii) aligning the waveguide within the polishing apparatus such that the reflections received by the optical alignment sensor align within the optical alignment sensor, thereby being indicative of perpendicularity between the reference plane and the reference surface; and iv) polishing the target surface of the aligned waveguide.
BIASED TOTAL THICKNESS VARIATIONS IN WAVEGUIDE DISPLAY SUBSTRATES
A plurality of waveguide display substrates, each waveguide display substrate having a cylindrical portion having a diameter and a planar surface, a curved portion opposite the planar surface defining a nonlinear change in thickness across the substrate and having a maximum height D with respect to the cylindrical portion, and a wedge portion between the cylindrical portion and the curved portion defining a linear change in thickness across the substrate and having a maximum height W with respect to the cylindrical portion. A target maximum height D.sub.t of the curved portion is 10.sup.-7 to 10.sup.-6 times the diameter, D is between about 70% and about 130% of D.sub.t, and W is less than about 30% of D.sub.t.
Co-manufacturing of silicon-on-insulator waveguides and silicon nitride waveguides for hybrid photonic integrated circuits
A method of co-manufacturing silicon waveguides, SiN waveguides, and semiconductor structures in a photonic integrated circuit. A silicon waveguide structure can be formed using a suitable process, after which it is buried in a cladding. The cladding is polished, and a silicon nitride layer is disposed to define a silicon nitride waveguide. The silicon nitride waveguide is buried in a cladding, and annealed. Thereafter, cladding above the silicon waveguide structure can be trenched through, and low-temperature operations can be performed to or with an exposed surface of the silicon waveguide structure.
METHOD AND SYSTEM FOR VARIABLE OPTICAL THICKNESS WAVEGUIDES FOR AUGMENTED REALITY DEVICES
An augmented reality device includes a projector, projector optics optically coupled to the projector, and an eyepiece optically coupled to the projector optics. The eyepiece includes an eyepiece waveguide characterized by lateral dimensions and an optical path length difference as a function of one or more of the lateral dimensions.
STRUCTURES FOR INTEGRATED SILICON PHOTONICS OPTICAL GYROSCOPES WITH STRUCTURAL MODIFICATIONS AT WAVEGUIDE CROSSING
Disclosed herein are configurations and methods to produce very low loss waveguide structures, which can be single-layer or multi-layer. These waveguide structures can be used as a sensing component of a small-footprint integrated optical gyroscope. By using pure fused silica substrates as both top and bottom cladding around a SiN waveguide core, the propagation loss can be well below 0.1 db/meter. Low-loss waveguide-based gyro coils may be patterned in the shape of a spiral (circular or rectangular or any other shape), that may be distributed among one or more of vertical planes to increase the length of the optical path while avoiding the increased loss caused by intersecting waveguides in the state-of-the-art designs. Low-loss adiabatic tapers may be used for a coil formed in a single layer where an output waveguide crosses the turns of the spiraling coil.
METHOD FOR MANUFACTURING A PHOTONIC CHIP
This method comprises: before bonding a substrate to a layer of encapsulated semiconductor material in which a first part of an optical component is produced, producing indented pads inside a buried layer of silicon oxide, with each of these pads comprising an embedded face that extends parallel to an interface between the buried layer and the layer of encapsulated semiconductor material to a predetermined depth inside the buried layer, with each of the embedded faces being made of a material different from silicon oxide; then thinning the buried layer in order to leave a residual silicon oxide layer on the layer of encapsulated semiconductor material, with this thinning comprising an operation involving thinning the buried layer, with this thinning stopping as soon as the embedded face of the pads is exposed.
BIASED TOTAL THICKNESS VARIATIONS IN WAVEGUIDE DISPLAY SUBSTRATES
A plurality of waveguide display substrates, each waveguide display substrate having a cylindrical portion having a diameter and a planar surface, a curved portion opposite the planar surface defining a nonlinear change in thickness across the substrate and having a maximum height D with respect to the cylindrical portion, and a wedge portion between the cylindrical portion and the curved portion defining a linear change in thickness across the substrate and having a maximum height W with respect to the cylindrical portion. A target maximum height D.sub.t of the curved portion is 10.sup.−7 to 10.sup.−6 times the diameter, D is between about 70% and about 130% of D.sub.t, and W is less than about 30% of D.sub.t.