Methods of fabricating optical devices with high refractive index materials are disclosed. The method includes forming a first oxide layer on a substrate and forming a patterned template layer with first and second trenches on the first oxide layer. A material of the patterned template layer has a first refractive index. The method further includes forming a first portion of a waveguide and a first portion of an optical coupler within the first and second trenches, respectively, forming a second portion of the waveguide and a second portion of the optical coupler on a top surface of the patterned template layer, and depositing a cladding layer on the second portions of the waveguide and optical coupler. The waveguide and the optical coupler include materials with a second refractive index that is greater than the first refractive index.

In a duplex optical connector plug 10A, when one of first and second optical connector assemblies 11a, 11b is rotated around its axis in a clockwise direction or a counterclockwise direction, a rotational force of one of first and second gears is transmitted to the other of the gears by an intermediate gear. Thereby, interlockingly with the one of the optical connector assemblies 11a, 11b, the other of the optical connector assemblies 11a, 11b is rotated around its axis in the clockwise direction or the counterclockwise direction which is the same direction as the optical connector assemblies 11a, 11b.

In a duplex optical connector plug 10A, when one of first and second optical connector assemblies 11a, 11b is rotated around its axis in a clockwise direction or a counterclockwise direction, a rotational force of one of first and second gears is transmitted to the other of the gears by an intermediate gear. Thereby, interlockingly with the one of the optical connector assemblies 11a, 11b, the other of the optical connector assemblies 11a, 11b is rotated around its axis in the clockwise direction or the counterclockwise direction which is the same direction as the optical connector assemblies 11a, 11b.

A manufacturing method for an integrated structure of a waveguide and an active component is proposed. The manufacturing method includes providing a substrate including a dielectric layer and a semiconductor layer, and the semiconductor layer includes a waveguide region, a transition region and an active component region; etching the semiconductor layer to form a plurality of waveguide trenches; depositing a waveguide material on the semiconductor layer to form a deposition layer, and the waveguide trenches are filled with the waveguide material; performing an ion implantation process on the semiconductor layer to form a first doped portion and a second doped portion; etching the waveguide region, the transition region and the active component region to form a waveguide structure, a transition structure and an active component structure; depositing a cover layer on the dielectric layer; forming two via holes and two contact pads in the cover layer.

An augmented reality device includes a projector, projector optics optically coupled to the projector, and a substrate structure including a substrate having an incident surface and an opposing exit surface and a first variable thickness film coupled to the incident surface. The substrate structure can also include a first combined pupil expander coupled to the first variable thickness film, a second variable thickness film coupled to the opposing exit surface, an incoupling grating coupled to the opposing exit surface, and a second combined pupil expander coupled to the opposing exit surface.

Processes for making high multiplex arrays for use in analyzing discrete reactions at ultra high multiplex with reduced optical noise, and increased system flexibility. The high multiplex arrays include substrates having integrated optical components that increase multiplex capability by one or more of increasing density of reaction regions, improving transmission of light to or collection of light from discrete reactions regions. Integrated optical components include reflective optical elements which re-direct illumination light and light emitted from the discrete regions to more efficiently collect emitted light. Particularly preferred applications include single molecule reaction analysis, such as polymerase mediated template dependent nucleic acid synthesis and sequence determination.

Methods of fabricating optical devices with high refractive index materials are disclosed. The method includes forming a first oxide layer on a substrate and forming a patterned template layer with first and second trenches on the first oxide layer. A material of the patterned template layer has a first refractive index. The method further includes forming a first portion of a waveguide and a first portion of an optical coupler within the first and second trenches, respectively, forming a second portion of the waveguide and a second portion of the optical coupler on a top surface of the patterned template layer, and depositing a cladding layer on the second portions of the waveguide and optical coupler. The waveguide and the optical coupler include materials with a second refractive index that is greater than the first refractive index.

Aspects of the present disclosure relate generally to systems and methods for use in the implementation and/or operation of preparing photonic integrated circuits (PICs). Specifically, the method include coupling a dicing tape to a first side of a wafer. The method also includes performing a first laser processing step to form a modified layer by applying at least one laser beam of a wavelength that has transmissivity through the wafer along a first projected dicing line to define a first facet and performing a second laser processing step to form the modified layer by applying the at least one laser beam to the wafer along a second projected dicing line to define a second facet. The method further includes expanding the dicing tape to divide the wafer from the modified layer along at least the first projected dicing line and the second projected dicing line into PIC chips.

The present disclosure relates to a method for manufacturing one or more optical engine packages, each optical engine package comprising a silicon photonic die. The method includes receiving a substrate comprising a package portion and a cutting area adjacent to the package portion, assembling the optical engine package on the substrate such that an edge-coupled waveguide of the silicon photonic die overlaps a boundary between the cutting area and the package portion, and cutting the optical engine package and the substrate in the cutting area to expose the edge-coupled waveguide for optical coupling thereof to an optical fiber core.

The present disclosure relates to a method for manufacturing one or more optical engine packages, each optical engine package comprising a silicon photonic die. The method includes receiving a substrate comprising a package portion and a cutting area adjacent to the package portion, assembling the optical engine package on the substrate such that an edge-coupled waveguide of the silicon photonic die overlaps a boundary between the cutting area and the package portion, and cutting the optical engine package and the substrate in the cutting area to expose the edge-coupled waveguide for optical coupling thereof to an optical fiber core.