A probe structure includes a monolithically integrated waveguide and lens. The probe is based on SU-8 as a guiding material. A waveguide mold is defined using wet etching of silicon using a silicon dioxide mask patterned with 45° angle with respect to the silicon substrate edge and an aluminum layer acting as a mirror is deposited on the silicon substrate. A lens mold is made using isotropic etching of the fused silica substrate and then aligned to the silicon substrate. A waveguide polymer such as SU-8 2025 is flowed into the waveguide mask+lens mold (both on the same substrate) by decreasing its viscosity and using capillary forces via careful temperature control of the substrate.

The disclosure relates to a high-density optical waveguide structure, a printed circuit board and a preparation method thereof. The high-density optical waveguide structure comprises an undercladding layer, a core layer and an upper cladding layer in sequence; wherein, the lower cladding layer is arranged at intervals. The trench is filled with an optical waveguide material to form a core layer. The waveguide structure integrates an optical waveguide into a PCB to realize photoelectric interconnection. The waveguide structure can better achieve higher parallel interconnection density, maintain good signal integrity, reduce device and device size, and at the same time, consume less power. The structure is configured to easily dissipate heat, enabling a simpler physical architecture and design, maximizing the wiring space of printed circuit boards, facilitating the fabrication of ultra-fine wire boards; and improving the wiring density and reliability of existing manufacturing methods.

Provided is a resin composition for optical waveguide cores, the resin composition including liquid epoxy resin, and solid epoxy resin, in which a coefficient of variation calculated from a weighted average value of a refractive index of the liquid epoxy resin and a refractive index of the solid epoxy resin is 2.10% or less.

The present invention provides a polymer optical waveguide containing: a core; and a cladding having a refractive index lower than that of the core, provided around the core, in which the polymer optical waveguide has a core-coupling section where at least a part of the cladding is not present along a light propagation direction of the polymer optical waveguide and an application type removal film A provided so as to come into contact with the core of the core-coupling section.

A guide transition device including a light source designed to generate a light beam, a light input port on a first plane and coupled to receive the light beam from the light source, a light output port on a second plane different than the first plane, the light output port designed to couple a received light beam to output equipment and plane shifting apparatus coupled to receive the light beam from the light input port on the first plane and to shift or transfer the light beam to the second plane. The plane shifting apparatus is coupled to transfer the light beam to the light output port on the second plane.

Embodiments of the disclosure are generally directed to systems and methods for switchable electroactive devices for head-mounted displays (HMDs). In particular, a method may include (1) applying an electric field to an electroactive element of an electroactive device via electrodes of the electroactive device that are electrically coupled to the electroactive element to compress the electroactive element, which comprises a polymer material defining nanovoids, such that an average size of the nanovoids is decreased and a density of the nanovoids is increased in the electroactive element, wherein the electroactive device is positioned at a distance from a user's eye, and (2) emitting image light from an emissive device positioned such that at least a portion of the image light is incident on a surface of the electroactive device facing the user's eye.

A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a photonic die, an encapsulant and a wave guide structure. The photonic die includes: a substrate, having a wave guide pattern formed at front surface; and a dielectric layer, covering the front surface of the substrate, and having an opening overlapped with an end portion of the wave guide pattern. The encapsulant laterally encapsulates the photonic die. The wave guide structure lies on the encapsulant and the photonic die, and extends into the opening of the dielectric layer, to be optically coupled to the wave guide pattern.

A plurality of waveguide display substrates, each waveguide display substrate having a cylindrical portion having a diameter and a planar surface, a curved portion opposite the planar surface defining a nonlinear change in thickness across the substrate and having a maximum height D with respect to the cylindrical portion, and a wedge portion between the cylindrical portion and the curved portion defining a linear change in thickness across the substrate and having a maximum height W with respect to the cylindrical portion. A target maximum height D.sub.t of the curved portion is 10.sup.−7 to 10.sup.−6 times the diameter, D is between about 70% and about 130% of D.sub.t, and W is less than about 30% of D.sub.t.

Embodiments relate to a polymer waveguide including a substrate, a cladding layer made of a first polymer, formed on the substrate, wherein a first monomer is polymerized into the first polymer, and the cladding layer has a groove for the waveguide by removing part of the cladding layer, and a core accommodating graphene therein, formed on the groove, a method for manufacturing the same, and a passively mode-locked laser based on the polymer waveguide.

An example device includes a nanovoided polymer element, which may be located at least in part between the electrodes. In some examples, the nanovoided polymer element may include anisotropic voids, including a gas, and separated from each other by polymer walls. The device may be an electroactive device, such as an actuator having a response time for a transition between actuation states. The gas may have a characteristic diffusion time (e.g., to diffuse half the mean wall thickness through the polymer walls) that is less than the response time. The nanovoids may be sufficiently small (e.g., below 1 micron in diameter or an analogous dimension), and/or the polymer walls may be sufficiently thin, such that the gas interchange between gas in the voids and gas absorbed by the polymer walls may occur faster than the response time, and in some examples, effectively instantaneously.