The photonic integrated device for converting a light signal into sound comprises-a substrate having a substrate surface, an optical waveguide on the substrate surface, a photo-acoustic conversion body, comprising at least one volume of fractionally light absorbing material or formed entirely of fractionally light absorbing material, wherein a width of the photo-acoustic conversion body is greater than a width of the optical waveguide and means for enhancing distribution of light from the optical waveguide over the photo-acoustic conversion body.

A tap coupler includes a mode generation unit, a separation unit, and an output unit. The mode generation unit generates, in accordance with a discontinuous portion disposed on a travelling path of signal light that is propagating, a first mode of the signal light and a second mode that is different from the first mode. The separation unit separates, when the first mode and the second mode are input from the mode generation unit, the first mode and the second mode. The output unit outputs branch light in accordance with a transition of the second mode received from the separation unit.

An example device comprises: a substrate comprising a waveguide material having a waveguide refractive index (RI.sub.WG); a first layer of oxide on the substrate having an RI.sub.1 lower than the RI.sub.WG; a waveguide on the first oxide layer, the waveguide comprising the waveguide material having the RI.sub.WG; a second oxide layer on the waveguide and the first oxide layer, the second oxide layer having a second RI.sub.2 higher than the RI.sub.1 and less than the RI.sub.WG, the first oxide layer, the waveguide and the second oxide layer forming an end face for light coupling, and the waveguide extending inwards from the end face and increasing in effective RI from the end face; and an index matching material on the second oxide layer that encapsulates at least the second oxide layer and the end face, a respective RI of the index matching material being about index matched to the RI.sub.1.

Disclosed are semiconductor packages and manufacturing method of the semiconductor packages. In one embodiment, a semiconductor package includes a substrate, a first waveguide, a semiconductor die, and an adhesive layer. The first waveguide is disposed on the substrate. The semiconductor die is disposed on the substrate and includes a second waveguide aligned with the first waveguide. The adhesive layer is disposed between the first waveguide and the second waveguide.

Example implementations described herein are directed to a system involving one or more photonic integrated circuits having multi-mode waveguides and connected to a printed optical board through the use of multi-mode waveguide connectors described herein. The printed optical board can include an embedded multi-mode waveguide bus to facilitate optical signal to and from the photonic integrated circuits. The system can also include a chiplet such as a photonic integrated circuit with a single mode waveguide configured to connect to an optical fiber cable.

A photonic circulator deployed on a chip-scale light-detection and ranging (LiDAR) device includes a first arm that includes a first waveguide that is bonded onto a first member at a first bonding region, and a second arm that includes a second waveguide that is bonded onto a second member at a second bonding region. A first thermo-optic phase shifter is arranged on the first member and collocated with the first waveguide, and a second thermo-optic phase shifter is arranged on the second member and collocated with the second waveguide. The magneto-optic material and the first thermo-optic phase shifter of the first member cause a first phase shift in a first light beam travelling through the first waveguide, and the magneto-optic material and the second thermo-optic phase shifter of the second member cause a second phase shift in a second light beam travelling through the second waveguide.

Provided is a waveguide photodetector including a semiconductor substrate, a first optical waveguide and a second optical waveguide, which are sequentially laminated on the semiconductor substrate, in which each of the first optical waveguide and the second optical waveguide includes a first portion and a second portion, and the first portion extends from the second portion in a first direction parallel to a top surface of the semiconductor substrate, a refractive index matching layer disposed on the second portion of the second optical waveguide, a clad layer disposed on the refractive index matching layer, and an absorber disposed between the refractive index matching layer and the clad layer. Here, the second optical waveguide has a first conductive-type, the clad layer has a second conductive-type opposite to the first conductive-type, and the refractive index matching layer includes a first semiconductor layer that is an intrinsic semiconductor layer.

One illustrative backscattering generator disclosed herein includes a low-reflection waveguide structure, a slot waveguide structure comprising a first waveguide, a second waveguide and a slot located between the first waveguide and the second waveguide, and a variable direction coupler operatively coupled to the low-reflection waveguide structure and the slot waveguide structure.

A waveguide structure and a method for splitting light is described. The method may include optically coupling a first waveguide and a second waveguide, where the optical coupling may be wavelength insensitive. The widths of the first and second waveguides may be non-adiabatically varying and the optical coupling may be asymmetric between the first and second waveguides. A gap between the first and second waveguides may also be varied non-adiabatically and the gap may depend on the widths of the first and second waveguides. The optical coupling between the first and second waveguides may also occur in the approximate wavelength range of 800 nanometers to 1700 nanometers.

A light source or projector for a near-eye display includes a light source subassembly optically coupled to a waveguide concentrator. The light source subassembly may include several semiconductor chips each hosting an array of emitters such s superluminescent light-emitting diodes. The semiconductor chips may be disposed side-by-side, with their emitting sides or facets coupled to the waveguide concentrator, which provides a tight array of output light ports on a common output plane of the concentrator. The output diverging beams at the array of output light ports are coupled to a collimator, which collimates the beams and couples them to an angular scanner for scanning the collimated light beams together across the field of view of the display.