An optical waveguide comprises at least two TIR surface and contains a grating. Input TIR light with a first angular range along a first propagation direction undergoes at least two diffractions at the grating. Each diffraction directs light into a unique TIR angular range along a second propagation direction.

An optical waveguide comprises at least two TIR surface and contains a grating. Input TIR light with a first angular range along a first propagation direction undergoes at least two diffractions at the grating. Each diffraction directs light into a unique TIR angular range along a second propagation direction.

A semiconductor device includes a substrate, a trench in the substrate, the trench having an inclined sidewall, a reflective layer over the inclined sidewall, a grating structure over the substrate, and a waveguide in the trench. The waveguide is configured to guide optical signals between the grating structure and the reflective layer.

A semiconductor device includes a substrate, a trench in the substrate, the trench having an inclined sidewall, a reflective layer over the inclined sidewall, a grating structure over the substrate, and a waveguide in the trench. The waveguide is configured to guide optical signals between the grating structure and the reflective layer.

Techniques are provided for single edge coupling of chips with integrated waveguides. For example, a package structure includes a first chip with a first critical edge, and a second chip with a second critical edge. The first and second chips include integrated waveguides with end portions that terminate on the first and second critical edges. The second chip includes a signal reflection structure that is configured to reflect an optical signal propagating in one or more of the integrated waveguides of the second chip. The first and second chips are edge-coupled at the first and second critical edges such that the end portions of the integrated waveguides of the first and second chips are aligned to each other, and wherein all signal input/output between the first and second chips occurs at the single edge-coupled interface.

Techniques are provided for single edge coupling of chips with integrated waveguides. For example, a package structure includes a first chip with a first critical edge, and a second chip with a second critical edge. The first and second chips include integrated waveguides with end portions that terminate on the first and second critical edges. The second chip includes a signal reflection structure that is configured to reflect an optical signal propagating in one or more of the integrated waveguides of the second chip. The first and second chips are edge-coupled at the first and second critical edges such that the end portions of the integrated waveguides of the first and second chips are aligned to each other, and wherein all signal input/output between the first and second chips occurs at the single edge-coupled interface.

Optical alignment of an optical connector to input/output couplers of a photonic integrated circuit can be achieved by first actively aligning the optical connector successively to two loopback alignment features formed in the photonic chip of the PIC, optically unconnected to the PIC, and then moving the optical connector, based on precise knowledge of the positions of the loopback alignment features relative to the input/output couplers of the PIC, to a position aligned with the input/output couplers of the PIC and locking it in place.

Aspects of the present disclosure are directed toward designs and methods improving optical sensing, wavelength division multiplexed (WDM) telecommunication transceivers, WDM add/drops, and spectrometer techniques that may benefit from a stable wavelength reference. The disclosed designs and methods are useful in the manufacture of a stable wavelength reference that may compensate for temperature variations.

Aspects of the present disclosure are directed toward designs and methods improving optical sensing, wavelength division multiplexed (WDM) telecommunication transceivers, WDM add/drops, and spectrometer techniques that may benefit from a stable wavelength reference. The disclosed designs and methods are useful in the manufacture of a stable wavelength reference that may compensate for temperature variations.

When routing light on photonic integrated circuit (PIC) chips optical back-reflection and scattering can be highly detrimental to the desired application. Unused ports of optical devices, such as MMI, DC, Y-junction, PD, etc. are a cause for back-reflection and scattering, whereby the scattered light could get picked up by adjacent components, e.g. photodetectors. Management of stray light on the PIC is needed to prevent the undesired coupling between various components and to reduce noise. A dump taper may be used to guide and scatter stray light away from sensitive components or fully absorb the light while maintaining very low reflection from the taper. A doped dump taper may be used to passively absorb light reaching the unused port, thereby eliminating unwanted reflection and scattering. Alternatively, an undoped taper may be used to scatter light away from sensitive components while maintaining very low back-reflection.