Patent classifications
G02B6/124
MULTIPLEXER
To provide a multiplexer that makes it possible to achieve a reduction in size and that minimizes the influence of the expansion of laser light on a multiplexing unit. A multiplexer is provided with a plurality of waveguides, multiplexing units that are provided at an intermediate location within the waveguides, and laser light sources, wherein: the first multiplexing unit is arranged at a position that is closest to the laser light sources; and the laser light sources that have an optical axis at a position that is separated from the transmission axis of the visible light that is introduced into the first multiplexing unit are arranged so that the optical axis is inclined with respect to the transmission axis and the outer periphery of laser light that expands at a predetermined expansion angle passes in front of the first multiplexing unit.
PHOTONICS GRATING COUPLER AND METHOD OF MANUFACTURE
A structure for coupling an optical signal between an integrated circuit photonic structure and an external optical fiber is disclosed as in a method of formation. The coupling structure is sloped relative to a horizontal surface of the photonic structure such that light entering or leaving the photonic structure is substantially normal to its upper surface.
PHOTONICS GRATING COUPLER AND METHOD OF MANUFACTURE
A structure for coupling an optical signal between an integrated circuit photonic structure and an external optical fiber is disclosed as in a method of formation. The coupling structure is sloped relative to a horizontal surface of the photonic structure such that light entering or leaving the photonic structure is substantially normal to its upper surface.
Light emission apparatus
A light emission apparatus includes a laser diode configured to emit a light; a laser driver electrically coupled to the laser diode, the laser driver being configured to drive the laser diode to generate the light; and an optical module arranged to receive the light emitted by the laser diode, the optical module comprising at least one optical element and being configured to adjust the light and emits a transmitting light; wherein the transmitting light emits from the optical module with an illumination angle and the optical module adjusts the light to vary the illumination angle.
Light emission apparatus
A light emission apparatus includes a laser diode configured to emit a light; a laser driver electrically coupled to the laser diode, the laser driver being configured to drive the laser diode to generate the light; and an optical module arranged to receive the light emitted by the laser diode, the optical module comprising at least one optical element and being configured to adjust the light and emits a transmitting light; wherein the transmitting light emits from the optical module with an illumination angle and the optical module adjusts the light to vary the illumination angle.
Methods and sensor for measuring strain
A method of measuring strain includes providing laminated material having ply layers, and a thickness along a direction orthogonal to the ply layers, and a strain sensor embedded between adjacent ply layers, wherein: the strain sensor includes first and second planar optical waveguide, each of the waveguides having a waveguiding core defining an optical propagation direction parallel to the laminated material and a Bragg grating in the waveguiding core, the optical propagation directions of the optical waveguides being non-parallel; interrogating the first optical waveguide Bragg grating with transverse electric (TE) and transverse magnetic (TM) polarized light, to obtain a TE spectral response and a TM spectral response; interrogating the second optical waveguide Bragg grating with TE and TM polarized light to obtain a TE spectral response and a TM spectral response; and processing the TE spectral responses and the TM spectral responses to extract a through-thickness component of strain.
Methods and sensor for measuring strain
A method of measuring strain includes providing laminated material having ply layers, and a thickness along a direction orthogonal to the ply layers, and a strain sensor embedded between adjacent ply layers, wherein: the strain sensor includes first and second planar optical waveguide, each of the waveguides having a waveguiding core defining an optical propagation direction parallel to the laminated material and a Bragg grating in the waveguiding core, the optical propagation directions of the optical waveguides being non-parallel; interrogating the first optical waveguide Bragg grating with transverse electric (TE) and transverse magnetic (TM) polarized light, to obtain a TE spectral response and a TM spectral response; interrogating the second optical waveguide Bragg grating with TE and TM polarized light to obtain a TE spectral response and a TM spectral response; and processing the TE spectral responses and the TM spectral responses to extract a through-thickness component of strain.
TOTAL OR LOCAL THICKNESS VARIATION FOR OPTICAL DEVICES
Embodiments of the present disclosure generally relate to methods for forming a waveguide. Methods may include measuring a waveguide substrate, the waveguide having a substrate thickness distribution; and depositing an index-matched layer onto a surface of the waveguide, the index-matched layer having a first surface disposed on the waveguide substrate and a second surface opposing the first surface, wherein the index-matched layer is disposed only over a portion of the waveguide substrate, and a device slope of a second surface of the index-matched layer is substantially the same as the waveguide slope of the first surface of the waveguide.
TOTAL OR LOCAL THICKNESS VARIATION FOR OPTICAL DEVICES
Embodiments of the present disclosure generally relate to methods for forming a waveguide. Methods may include measuring a waveguide substrate, the waveguide having a substrate thickness distribution; and depositing an index-matched layer onto a surface of the waveguide, the index-matched layer having a first surface disposed on the waveguide substrate and a second surface opposing the first surface, wherein the index-matched layer is disposed only over a portion of the waveguide substrate, and a device slope of a second surface of the index-matched layer is substantially the same as the waveguide slope of the first surface of the waveguide.
Optical phased array light shaping
An apparatus comprises: a photonic integrated circuit comprising an optical phased array, a first focusing element at a fixed position relative to the optical phased array and configured to couple an optical beam to or from the optical phased array, and a second focusing element at a fixed position relative to the first focusing element and configured to couple the optical beam to or from the first focusing element. At least one of the first or second focusing element is externally coupled to the photonic integrated circuit, and the first and second focusing elements have different effective focal lengths.