G02B6/124

System and method associated with a photonic integrated circuit

The present disclosure concerns a photonic integrated circuit (10) and a method for interrogating a ring resonator (3) comprised therein. The circuit (10) comprises an optical port (4) for coupling light (L) into and out of the circuit (10). The circuit (10) further comprises a first waveguide (1) for receiving light (L1) from the optical port (4), and a second waveguide (2) for sending back light to the optical port (4). The ring resonator (3) is arranged between the first waveguide (1) and the second waveguide (2) for coupling a resonant wavelength () of the light therein between. The optical port (4) comprises a polarization splitting coupler for coupling light of a first polarization (P1) to and from the first waveguide (1) and coupling light of a second polarization (P2), orthogonal to the first polarization (P1), to and from the second waveguide (2).

System and method associated with a photonic integrated circuit

The present disclosure concerns a photonic integrated circuit (10) and a method for interrogating a ring resonator (3) comprised therein. The circuit (10) comprises an optical port (4) for coupling light (L) into and out of the circuit (10). The circuit (10) further comprises a first waveguide (1) for receiving light (L1) from the optical port (4), and a second waveguide (2) for sending back light to the optical port (4). The ring resonator (3) is arranged between the first waveguide (1) and the second waveguide (2) for coupling a resonant wavelength () of the light therein between. The optical port (4) comprises a polarization splitting coupler for coupling light of a first polarization (P1) to and from the first waveguide (1) and coupling light of a second polarization (P2), orthogonal to the first polarization (P1), to and from the second waveguide (2).

Negative angle grating coupler

In an example, a system includes a grating coupled laser and a photonic integrated circuit. The grating coupled laser includes a first waveguide and a transmit grating coupler optically coupled to the first waveguide. The photonic integrated circuit includes a second waveguide and a receive grating coupler optically coupled to the second waveguide. The second grating coupler may include a negative angle grating coupler.

Negative angle grating coupler

In an example, a system includes a grating coupled laser and a photonic integrated circuit. The grating coupled laser includes a first waveguide and a transmit grating coupler optically coupled to the first waveguide. The photonic integrated circuit includes a second waveguide and a receive grating coupler optically coupled to the second waveguide. The second grating coupler may include a negative angle grating coupler.

Integrated bound-mode spectral/angular sensors

A 2-D sensor array includes a semiconductor substrate and a plurality of pixels disposed on the semiconductor substrate. Each pixel includes a coupling region and a junction region, and a slab waveguide structure disposed on the semiconductor substrate and extending from the coupling region to the region. The slab waveguide includes a confinement layer disposed between a first cladding layer and a second cladding layer. The first cladding and the second cladding each have a refractive index that is lower than a refractive index of the confinement layer. Each pixel also includes a coupling structure disposed in the coupling region and within the slab waveguide. The coupling structure includes two materials having different indices of refraction arranged as a grating defined by a grating period. The junction region comprises a p-n junction in communication with electrical contacts for biasing and collection of carriers resulting from absorption of incident radiation.

Integrated bound-mode spectral/angular sensors

A 2-D sensor array includes a semiconductor substrate and a plurality of pixels disposed on the semiconductor substrate. Each pixel includes a coupling region and a junction region, and a slab waveguide structure disposed on the semiconductor substrate and extending from the coupling region to the region. The slab waveguide includes a confinement layer disposed between a first cladding layer and a second cladding layer. The first cladding and the second cladding each have a refractive index that is lower than a refractive index of the confinement layer. Each pixel also includes a coupling structure disposed in the coupling region and within the slab waveguide. The coupling structure includes two materials having different indices of refraction arranged as a grating defined by a grating period. The junction region comprises a p-n junction in communication with electrical contacts for biasing and collection of carriers resulting from absorption of incident radiation.

Photonics chip

The present disclosure relates to semiconductor structures and, more particularly, to photonics chips and methods of manufacture. A structure includes: a photonics chip having a grated optical coupler; an interposer attached to the photonics chip, the interposer having a grated optical coupler; an optical epoxy material provided between the grated optical coupler of the photonics chip and the grated optical coupler of the interposer; and epoxy underfill material provided at interstitial regions between the photonics chip and the interposer which lie outside of an area of the grated optical couplers of the photonics chip and the interposer.

Photonics chip

The present disclosure relates to semiconductor structures and, more particularly, to photonics chips and methods of manufacture. A structure includes: a photonics chip having a grated optical coupler; an interposer attached to the photonics chip, the interposer having a grated optical coupler; an optical epoxy material provided between the grated optical coupler of the photonics chip and the grated optical coupler of the interposer; and epoxy underfill material provided at interstitial regions between the photonics chip and the interposer which lie outside of an area of the grated optical couplers of the photonics chip and the interposer.

Multiplexer

To provide a multiplexer that makes it possible to achieve a reduction in size and that minimizes the influence of the expansion of laser light on a multiplexing unit. A multiplexer is provided with a plurality of waveguides, multiplexing units that are provided at an intermediate location within the waveguides, and laser light sources, wherein: the first multiplexing unit is arranged at a position that is closest to the laser light sources; and the laser light sources that have an optical axis at a position that is separated from the transmission axis of the visible light that is introduced into the first multiplexing unit are arranged so that the optical axis is inclined with respect to the transmission axis and the outer periphery of laser light that expands at a predetermined expansion angle passes in front of the first multiplexing unit.

Multiplexer

To provide a multiplexer that makes it possible to achieve a reduction in size and that minimizes the influence of the expansion of laser light on a multiplexing unit. A multiplexer is provided with a plurality of waveguides, multiplexing units that are provided at an intermediate location within the waveguides, and laser light sources, wherein: the first multiplexing unit is arranged at a position that is closest to the laser light sources; and the laser light sources that have an optical axis at a position that is separated from the transmission axis of the visible light that is introduced into the first multiplexing unit are arranged so that the optical axis is inclined with respect to the transmission axis and the outer periphery of laser light that expands at a predetermined expansion angle passes in front of the first multiplexing unit.