Patent classifications
G02B6/124
OPTICAL CIRCUITS AND OPTICAL SWITCHES
According to one example, the present application discloses an optical circuit comprising a grating to receive input light of mixed polarizations and output light of a same polarization to a first waveguide and a second waveguide. The first waveguide and second waveguide are optically coupled to a plurality of resonators that are coupled to a plurality of gratings that are to output light of mixed polarizations.
OPTICAL CIRCUITS AND OPTICAL SWITCHES
According to one example, the present application discloses an optical circuit comprising a grating to receive input light of mixed polarizations and output light of a same polarization to a first waveguide and a second waveguide. The first waveguide and second waveguide are optically coupled to a plurality of resonators that are coupled to a plurality of gratings that are to output light of mixed polarizations.
FABRICATION OF OPTICAL INTERCONNECT STRUCTURES FOR A PHOTONIC INTEGRATED CIRCUIT
A method of fabricating an optical connection to at least one planar optical waveguide integrated on a planar integrated circuit (PIC) uses a machine vision system or the like to detect one or more positions at which one or more optical connections are to be made to at least one planar optical waveguide located on the PIC. A spatial light modulator (SLM) is used as a programmable photolithographic mask through which the optical connections are written in a volume of photosensitive material using a photolithographic process. The SLM is programmed to expose the photosensitive material to an illumination pattern that defines the optical connections. The programming is based at least in part on the positions that have been detected by the vision system. The optical connections are printed by exposing the photosensitive material to illumination that is modulated by the pattern with which the SLM is programmed.
FABRICATION OF OPTICAL INTERCONNECT STRUCTURES FOR A PHOTONIC INTEGRATED CIRCUIT
A method of fabricating an optical connection to at least one planar optical waveguide integrated on a planar integrated circuit (PIC) uses a machine vision system or the like to detect one or more positions at which one or more optical connections are to be made to at least one planar optical waveguide located on the PIC. A spatial light modulator (SLM) is used as a programmable photolithographic mask through which the optical connections are written in a volume of photosensitive material using a photolithographic process. The SLM is programmed to expose the photosensitive material to an illumination pattern that defines the optical connections. The programming is based at least in part on the positions that have been detected by the vision system. The optical connections are printed by exposing the photosensitive material to illumination that is modulated by the pattern with which the SLM is programmed.
WAFER LEVEL OPTICAL PROBING STRUCTURES FOR SILICON PHOTONICS
Embodiments herein describe techniques for testing optical components in a photonic chip using a testing structure disposed in a sacrificial region of a wafer. In one embodiment, the wafer is processed to form multiple photonic chips integrated into the wafer. While forming optical components in the photonic chips (e.g., modulators, detectors, waveguides, etc.), a testing structure can be formed in one or more sacrificial regions in the wafer. In one embodiment, the testing structure is arranged near an edge coupler in the photonic chip such that an optical signal can be transferred between the photonic chip and the testing structure. Moreover, the testing structure has a grating coupler disposed at or near a top surface of the wafer which permits optical signals to be transmitted into, or received from, the grating coupler when an optical probe is arranged above the grating coupler.
Light-emitting device including photoluminescent layer
a light-emitting device including: a photoluminescent layer that contains a photoluminescent material and emits light including first light having a wavelength .sub.a in air; and a light-transmissive layer located on or near the photoluminescent layer. At least one periodic structure is defined on at least one of the photoluminescent layer and the light-transmissive layer. The at least one periodic structure has projections or recesses or both. A distance D.sub.int between two adjacent projections or two adjacent recesses and a refractive index n.sub.wav-a of the photoluminescent layer for the first light satisfy .sub.a/n.sub.wav-a<D.sub.int<.sub.a. A wavelength A of a peak intensity in a spectrum of light output from the at least one periodic structure in a direction perpendicular to the photoluminescent layer is different from a wavelength B of a peak intensity in an emission spectrum of the photoluminescent material.
OPTICAL MODULE INCLUDING SILICON PHOTONICS CHIP AND COUPLER CHIP
An optical module includes a waveguide interconnect that transports light signals; a Silicon Photonics chip that modulates the light signals, detects the light signals, or both modulates and detects the light signals; a coupler chip attached to the Silicon Photonics chip and the waveguide interconnect so that the light signals are transported along a light path between the Silicon Photonics chip and the waveguide interconnect; and one of the Silicon Photonics chip and the coupler chip includes first, second, and third alignment protrusions. The other of the coupler chip and the Silicon Photonics chip includes a point contact, a linear contact, and a planar contact. The point contact provides no movement for the first alignment protrusion. The linear contact provides linear movement for the second alignment protrusion. The planar contact provides planar movement for the third alignment protrusion.
SCANNING ELECTROMAGNETIC WAVES IN PHOTONIC BAND GAP MULTILAYERS
A device and associated methods for using surface electromagnetic waves (SEWs) generated at the surface of photonic band gap multilayers (PBGMs) in place of surface plasmons (SPs) in metal films. One device is a photonic circuit comprising a multilayer apparatus to generate surface electromagnetic waves, wherein the surface electromagnetic waves comprise the signal medium within the circuit. The circuit may be formed or etched on the surface of the multilayer apparatus.
SCANNING ELECTROMAGNETIC WAVES IN PHOTONIC BAND GAP MULTILAYERS
A device and associated methods for using surface electromagnetic waves (SEWs) generated at the surface of photonic band gap multilayers (PBGMs) in place of surface plasmons (SPs) in metal films. One device is a photonic circuit comprising a multilayer apparatus to generate surface electromagnetic waves, wherein the surface electromagnetic waves comprise the signal medium within the circuit. The circuit may be formed or etched on the surface of the multilayer apparatus.
Method And System For Two-Dimensional Mode-Matching Grating Couplers
Methods and systems for two-dimensional mode-matching grating couplers may include in a photonic chip comprising a grating coupler at a surface of the photonic chip, the grating coupler having increased scattering strength in a direction of a light wave traveling through the grating coupler: receiving an optical signal from a first direction within the photonic chip; and scattering the optical signal out of the surface of the photonic chip. A second optical signal may be received in the grating coupler from a second direction within the photonic chip. The second optical signal may be scattered out of the surface of the photonic chip. The increasing scattering strength may be configured by increased width scatterers along a direction perpendicular to the direction of light travel. The increased scattering strength may be configured by a transition of shapes of scatterers in the grating coupler.