Patent classifications
G02B6/124
Optical devices and method for tuning an optical signal
The optical device coupleable to a waveguide to receive an optical signal from the waveguide generally has at least two diffraction grating devices optically coupled to one another and having corresponding spectral responses, the spectral response of at least one of said diffraction grating devices being tunable to adjust an amount of overlapping between the spectral responses of the at least two diffraction grating devices.
Packaging optoelectronic components and CMOS circuitry using silicon-on-insulator substrates for photonics applications
Package structures and methods are provided to integrate optoelectronic and CMOS devices using SOI semiconductor substrates for photonics applications. For example, a package structure includes an integrated circuit (IC) chip, and an optoelectronics device and interposer mounted to the IC chip. The IC chip includes a SOI substrate having a buried oxide layer, an active silicon layer disposed adjacent to the buried oxide layer, and a BEOL structure formed over the active silicon layer. An optical waveguide structure is patterned from the active silicon layer of the IC chip. The optoelectronics device is mounted on the buried oxide layer in alignment with a portion of the optical waveguide structure to enable direct or adiabatic coupling between the optoelectronics device and the optical waveguide structure. The interposer is bonded to the BEOL structure, and includes at least one substrate having conductive vias and wiring to provide electrical connections to the BEOL structure.
Packaging optoelectronic components and CMOS circuitry using silicon-on-insulator substrates for photonics applications
Package structures and methods are provided to integrate optoelectronic and CMOS devices using SOI semiconductor substrates for photonics applications. For example, a package structure includes an integrated circuit (IC) chip, and an optoelectronics device and interposer mounted to the IC chip. The IC chip includes a SOI substrate having a buried oxide layer, an active silicon layer disposed adjacent to the buried oxide layer, and a BEOL structure formed over the active silicon layer. An optical waveguide structure is patterned from the active silicon layer of the IC chip. The optoelectronics device is mounted on the buried oxide layer in alignment with a portion of the optical waveguide structure to enable direct or adiabatic coupling between the optoelectronics device and the optical waveguide structure. The interposer is bonded to the BEOL structure, and includes at least one substrate having conductive vias and wiring to provide electrical connections to the BEOL structure.
Optical waveguide element and receiving circuit
The optical waveguide element has a first optical waveguide core; and a second optical waveguide core. In the optical waveguide element, the first optical waveguide core includes a first coupling portion configured to propagate any one polarized wave of a TE polarized wave and a TM polarized wave of a k.sup.th-order mode, the other polarized wave of an h.sup.th-order mode, and the other polarized wave of a p.sup.th-order mode, and a first Bragg reflector connected to the first coupling portion. The second optical waveguide core includes a second coupling portion. The first Bragg reflector includes a rib waveguide including a grating configured to convert the one input polarized wave of the k.sup.th-order mode into the other polarized wave of the h.sup.th-order mode, reflect the converted polarized wave on the basis of Bragg reflection, and transmit the other input polarized wave of the p.sup.th-order mode, and slab waveguides having thicknesses smaller than that of the rib waveguide and integrally formed with the rib waveguide on both side surfaces of the rib waveguide respectively, in the light propagation direction.
Systems, devices, and methods for improved optical waveguide transmission and alignment
Provided herein are systems, devices, and methods for improved optical waveguide transmission and alignment in an analytical system. Waveguides in optical analytical systems can exhibit variable and increasing back reflection of single-wavelength illumination over time, thus limiting their effectiveness and reliability. The systems are also subject to optical interference under conditions that have been used to overcome the back reflection. Novel systems and approaches using broadband illumination light with multiple longitudinal modes have been developed to improve optical transmission and analysis in these systems. Novel systems and approaches for the alignment of a target waveguide device and an optical source are also disclosed.
Systems, devices, and methods for improved optical waveguide transmission and alignment
Provided herein are systems, devices, and methods for improved optical waveguide transmission and alignment in an analytical system. Waveguides in optical analytical systems can exhibit variable and increasing back reflection of single-wavelength illumination over time, thus limiting their effectiveness and reliability. The systems are also subject to optical interference under conditions that have been used to overcome the back reflection. Novel systems and approaches using broadband illumination light with multiple longitudinal modes have been developed to improve optical transmission and analysis in these systems. Novel systems and approaches for the alignment of a target waveguide device and an optical source are also disclosed.
Managing photonic integrated circuit optical coupling
An apparatus for testing a wafer or chip comprising a photonic integrated circuit comprises: an electrical signal interface module comprising an array of movable conducting structures; a photonic signal interface module attached to the electrical signal interface module, the photonic signal interface module comprising one or more optical fiber interfaces, and a first set of grating couplers arranged over at least a first plane of the photonic signal interface module; and one or more electrical signal connections between the electrical signal interface module and the photonic signal interface module.
Managing photonic integrated circuit optical coupling
An apparatus for testing a wafer or chip comprising a photonic integrated circuit comprises: an electrical signal interface module comprising an array of movable conducting structures; a photonic signal interface module attached to the electrical signal interface module, the photonic signal interface module comprising one or more optical fiber interfaces, and a first set of grating couplers arranged over at least a first plane of the photonic signal interface module; and one or more electrical signal connections between the electrical signal interface module and the photonic signal interface module.
BRAGG GRATING, AND SPECTROSCOPY DEVICE INCLUDING THE BRAGG GRATING
Provided are a Bragg grating and a spectroscopy device including the same. The Bragg grating is disposed at each of opposite ends of a resonator for reflecting light of a certain wavelength band and includes a core member extending from a waveguide of the resonator in a lengthwise direction of the waveguide; a plurality of first refractive members protruding from the core member and spaced apart from each other along the lengthwise direction; and a second refractive member filling spaces between the first refractive members and having a refractive index different from a refractive index of the first refractive members.
BRAGG GRATING, AND SPECTROSCOPY DEVICE INCLUDING THE BRAGG GRATING
Provided are a Bragg grating and a spectroscopy device including the same. The Bragg grating is disposed at each of opposite ends of a resonator for reflecting light of a certain wavelength band and includes a core member extending from a waveguide of the resonator in a lengthwise direction of the waveguide; a plurality of first refractive members protruding from the core member and spaced apart from each other along the lengthwise direction; and a second refractive member filling spaces between the first refractive members and having a refractive index different from a refractive index of the first refractive members.