An optical system includes a light module, an optical element on a first grating coupler, and a second grating coupler. The light module emits three beams from different positions. The optical element is below the light module and is configured to change incident angles of the three beams and to focus the three beams at the same region of the first grating coupler. The first grating coupler is below the optical element and is configured to couple the three beams into a light-guide substrate. The light-guide substrate is connected to the first grating coupler and is configured to transmit the three beams. The second grating coupler is connected to the light-guide substrate and is configured to enable the three beams departing from the light-guide substrate after the three beams have traveled the same optical path.

Provided is a light receiving element with high light receiving sensitivity.

The light receiving element comprises: a light absorbing layer that absorbs light to generate a carrier; and a diffraction element that converts the optical path of first polarized light, which is obliquely incident on a plane formed by the light absorbing layer, so that the first polarized light propagates in a first direction along the light absorbing layer, and that converts the optical path of second polarized light incident from the same direction as the first polarized light so that the second polarized light propagates in a second direction, opposite the first direction, along the light absorbing layer.

A mode loss difference compensator of the present disclosure includes a main waveguide configured to allow propagation of N or more modes (where N is an integer of 3 or more), a first auxiliary waveguide having, at one end thereof, a first coupling portion configured to mode-convert an LP0n mode (where n is an integer of 2 or more) propagating in the main waveguide into a fundamental mode in the first auxiliary waveguide and transfer the fundamental mode from the main waveguide to the first auxiliary waveguide and having, at the other end thereof, a second coupling portion configured to mode-convert the fundamental mode propagating in the first auxiliary waveguide into the LP0n mode (where n is an integer of 2 or more) in the main waveguide and transfer the LP0n mode from the first auxiliary waveguide to the main waveguide, and a second auxiliary waveguide having, at one end thereof, a third coupling portion configured to convert a higher-order mode, other than any LP0n mode (where n is an integer of 2 or more), propagating in the main waveguide into a fundamental mode in the second auxiliary waveguide and transfer the fundamental mode from the main waveguide to the second auxiliary waveguide and having, at the other end thereof, a terminal end portion configured to eliminate the fundamental mode propagating in the second auxiliary waveguide from the second auxiliary waveguide, wherein the main waveguide includes a loss imparting portion configured to impart a loss to a fundamental mode propagating in the main waveguide between the first and second coupling portions.

A three-dimensional photonic integrated structure includes a first semiconductor substrate and a second semiconductor substrate. The first substrate incorporates a first waveguide and the second semiconductor substrate incorporates a second waveguide. An intermediate region located between the two substrates is formed by a one dielectric layer. The second substrate further includes an optical coupler configured for receiving a light signal. The first substrate and dielectric layer form a reflective element located below and opposite the grating coupler in order to reflect at least one part of the light signal.

Embodiments of alignment structures are disclosed that enable the alignment of a fiber attach unit (FAU) and the optical fibers contained therein to optical components on optical interposers or substrates on which photonic integrated circuits (PICs) are formed. Alignment of the optical fibers is enabled without the requirement for powering of the active optoelectrical devices in the PIC, but rather use an external testing apparatus to provide one or more optical signals to facilitate alignment. Methods for alignment using embodiments of the alignment structure is also disclosed.

A semiconductor device for use in an optical application and a method for fabricating the device. The device includes: an optically passive aspect that is operable in a substantially optically passive mode; and an optically active material having a material that is operable in a substantially optically active mode, wherein the optically passive aspect is patterned to include a photonic structure with a predefined structure, and the optically active material is formed in the predefined structure so as to be substantially self-aligned in a lateral plane with the optically passive aspect.

A semiconductor device for use in an optical application and a method for fabricating the device. The device includes: an optically passive aspect that is operable in a substantially optically passive mode; and an optically active material having a material that is operable in a substantially optically active mode, wherein the optically passive aspect is patterned to include a photonic structure with a predefined structure, and the optically active material is formed in the predefined structure so as to be substantially self-aligned in a lateral plane with the optically passive aspect.

Methods and systems for integrated multi-port waveguide photodetectors are disclosed and may include an optical receiver on a chip, where the optical receiver comprises a multi-port waveguide photodetector having three or more input ports. The optical receiver may be operable to receive optical signals via one or more grating couplers, couple optical signals to the photodetector via optical waveguides in the chip, and generate an output electrical signal based on the coupled optical signals using the photodetector. The photodetector may include four ports coupled to two PSGCs. The optical signals may be coupled to the photodetector via S-bends and/or tapers at ends of the optical waveguides. A width of the photodetector on sides that are coupled to the optical waveguides may be wider than a width of the optical waveguides coupled to the sides. Optical signals may be mixed with local oscillator signals using the multi-port waveguide photodetector.

Methods and systems for integrated multi-port waveguide photodetectors are disclosed and may include an optical receiver on a chip, where the optical receiver comprises a multi-port waveguide photodetector having three or more input ports. The optical receiver may be operable to receive optical signals via one or more grating couplers, couple optical signals to the photodetector via optical waveguides in the chip, and generate an output electrical signal based on the coupled optical signals using the photodetector. The photodetector may include four ports coupled to two PSGCs. The optical signals may be coupled to the photodetector via S-bends and/or tapers at ends of the optical waveguides. A width of the photodetector on sides that are coupled to the optical waveguides may be wider than a width of the optical waveguides coupled to the sides. Optical signals may be mixed with local oscillator signals using the multi-port waveguide photodetector.

An optical device for coupling light propagating between a waveguide and an optical transmission component is provided. The optical device includes a taper portion and a grating portion. The taper portion is disposed between the grating portion and the waveguide. The grating portion includes rows of grating patterns. A first size of a first grating pattern in a first row of grating patterns is larger than a second size of a second grating pattern in a second row of grating patterns. A first distance between the first row of grating patterns and the waveguide is less than a second distance between the second row of grating patterns and the waveguide.