G02B6/124

DISPLAY PANEL

A display panel includes waveguides, wires and a pixel array. The pixel array includes a plurality of pixel units. The pixel units are arranged in a plurality of columns and a plurality of rows. Each pixel unit includes a pixel electrode, a light filtering unit, and a photo transistor. The light filtering unit is coupled to one of the waveguides. The photo transistor is electrically connected to the pixel electrode and one of the wires, and is coupled to the light filtering unit. The waveguide transmits a light control signal. Each wire transmits an electric control signal. The light filtering unit is configured to receive a sub control signal from the waveguides to which the light filtering unit is coupled and filter out a specific optical signal according to the received sub control signal as an input signal of the photo transistor.

Optical Grating Coupler With Back-Side Reflector

An apparatus includes a planar structure having a top surface, a bottom surface, and an edge; and an optical grating located near or at the top surface and having a regular pattern of features. The planar structure has a cavity, and a portion of the cavity is located between opposing portions of the top and bottom surfaces. The optical grating is adjacent to the edge and is over, at least a part of the cavity. The apparatus includes an optically reflective coating on a portion of a wall of the cavity below the optical grating. The cavity has an opening along a portion of the edge of the planar structure.

Optical Grating Coupler With Back-Side Reflector

An apparatus includes a planar structure having a top surface, a bottom surface, and an edge; and an optical grating located near or at the top surface and having a regular pattern of features. The planar structure has a cavity, and a portion of the cavity is located between opposing portions of the top and bottom surfaces. The optical grating is adjacent to the edge and is over, at least a part of the cavity. The apparatus includes an optically reflective coating on a portion of a wall of the cavity below the optical grating. The cavity has an opening along a portion of the edge of the planar structure.

Two-stage adiabatically coupled photonic systems
10001599 · 2018-06-19 · ·

In an example, a photonic system includes a Si PIC with a Si substrate, a SiO.sub.2 box formed on the Si substrate, a first layer, and a second layer. The first layer is formed above the SiO.sub.2 box and includes a SiN waveguide with a coupler portion at a first end and a tapered end opposite the first end. The second layer is formed above the SiO.sub.2 box and vertically displaced above or below the first layer. The second layer includes a Si waveguide with a tapered end aligned in two orthogonal directions with the coupler portion of the SiN waveguide such that the tapered end of the Si waveguide overlaps in the two orthogonal directions and is parallel to the coupler portion of the SiN waveguide. The tapered end of the SiN waveguide is configured to be adiabatically coupled to a coupler portion of an interposer waveguide.

Two-stage adiabatically coupled photonic systems
10001599 · 2018-06-19 · ·

In an example, a photonic system includes a Si PIC with a Si substrate, a SiO.sub.2 box formed on the Si substrate, a first layer, and a second layer. The first layer is formed above the SiO.sub.2 box and includes a SiN waveguide with a coupler portion at a first end and a tapered end opposite the first end. The second layer is formed above the SiO.sub.2 box and vertically displaced above or below the first layer. The second layer includes a Si waveguide with a tapered end aligned in two orthogonal directions with the coupler portion of the SiN waveguide such that the tapered end of the Si waveguide overlaps in the two orthogonal directions and is parallel to the coupler portion of the SiN waveguide. The tapered end of the SiN waveguide is configured to be adiabatically coupled to a coupler portion of an interposer waveguide.

Device for coupling a plurality of different fibre modes

An integrated optical coupler device comprising, on a substrate surface: an integrated optical coupling grating extending in lateral directions parallel to the substrate surface and which, by diffraction at its grating structures, either converts electromagnetic waves, guided parallel to the substrate surface, of at least two waveguide modes of integrated optical waveguides into fiber modes propagating perpendicularly to the substrate surface, or converts electromagnetic waves, propagating perpendicularly to the substrate surface, of a fiber mode into electromagnetic waves, propagating parallel to the substrate surface, of at least two waveguide modes, and a first conductor pair, connected to the coupling grating and formed by a first and a second integrated optical waveguide, through which, in mutually opposite first and second directions parallel to the substrate surface, electromagnetic waves of at least two waveguide modes can be conducted to the coupling grating or can be conducted away from the coupling grating.

Device for coupling a plurality of different fibre modes

An integrated optical coupler device comprising, on a substrate surface: an integrated optical coupling grating extending in lateral directions parallel to the substrate surface and which, by diffraction at its grating structures, either converts electromagnetic waves, guided parallel to the substrate surface, of at least two waveguide modes of integrated optical waveguides into fiber modes propagating perpendicularly to the substrate surface, or converts electromagnetic waves, propagating perpendicularly to the substrate surface, of a fiber mode into electromagnetic waves, propagating parallel to the substrate surface, of at least two waveguide modes, and a first conductor pair, connected to the coupling grating and formed by a first and a second integrated optical waveguide, through which, in mutually opposite first and second directions parallel to the substrate surface, electromagnetic waves of at least two waveguide modes can be conducted to the coupling grating or can be conducted away from the coupling grating.

External-resonator-type light-emitting device

An external resonator type light-emitting device includes a light source oscillating a semiconductor laser light and a grating element configuring an external resonator together with the light source. The light source includes an active layer oscillating the semiconductor laser light. The grating element includes an optical waveguide and a plurality of Bragg gratings formed in the optical waveguide. The optical waveguide includes an incident face on which the semiconductor laser light is incident and an emitting face from which an emitting light having a desired wavelength is emitted.

OPTICAL MODULE INCLUDING SILICON PHOTONICS CHIP AND COUPLER CHIP
20180164520 · 2018-06-14 ·

An optical module includes a waveguide interconnect that transports light signals; a Silicon Photonics chip that modulates the light signals, detects the light signals, or both modulates and detects the light signals; a coupler chip attached to the Silicon Photonics chip and the waveguide interconnect so that the light signals are transported along a light path between the Silicon Photonics chip and the waveguide interconnect; and one of the Silicon Photonics chip and the coupler chip includes first, second, and third alignment protrusions. The other of the coupler chip and the Silicon Photonics chip includes a point contact, a linear contact, and a planar contact. The point contact provides no movement for the first alignment protrusion. The linear contact provides linear movement for the second alignment protrusion. The planar contact provides planar movement for the third alignment protrusion.

PHOTONICS CHIP

The present disclosure relates to semiconductor structures and, more particularly, to photonics chips and methods of manufacture. A structure includes: a photonics chip having a grated optical coupler; an interposer attached to the photonics chip, the interposer having a grated optical coupler; an optical epoxy material provided between the grated optical coupler of the photonics chip and the grated optical coupler of the interposer; and epoxy underfill material provided at interstitial regions between the photonics chip and the interposer which lie outside of an area of the grated optical couplers of the photonics chip and the interposer.